SOT1784-1: WLCSP89

Overview

wafer level chip-scale package, 89 bumps, 0.4 mm pitch, 3.63 mm x 3.58 mm x 0.38 mm body

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1784-1	WLCSP89	surface mount	bottom	WLCSP	3.63 x 3.58 x 0.38	89

Manufacture Code	Reference Codes	Issue Date
SOT1784		2016-09-05