SOT1855-1: WLCSP


Overview

wafer level chip-scale package; 29 bumps; 1.14 x 1.14 x 0.28 mm
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP surface mount bottom WLCSP 1.14 x 1.14 x 0.28 29 other
Manufacture Code Reference Codes Issue Date
SOT1855 2016-10-04