SOT1882-1: WLCSP47

Overview

wafer level chip-scale package; 47 bumps; 3.20 mm x 3.28 mm x 0.365 mm body

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1882-1	WLCSP47	surface mount	bottom	WLCSP	3.20 x 3.28 x 0.365	47

Manufacture Code	Reference Codes	Issue Date
SOT1882		2016-08-01