SOT1887-1: WLCSP48

Overview

wafer level chip-scale package; 48 bumps; 3.72 mm x 2.79 mm x 0.525 mm (Backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1887-1	WLCSP48	surface mount	bottom	WLCSP	3.72 x 2.79 x 0.525	48	other

Manufacture Code	Reference Codes	Issue Date
SOT1887		2016-10-04

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