SOT1887-1: WLCSP48


Overview

wafer level chip-scale package; 48 bumps; 3.72 mm x 2.79 mm x 0.525 mm (Backside coating included)
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP48 surface mount bottom WLCSP 3.72 x 2.79 x 0.525 48 other
Manufacture Code Reference Codes Issue Date
SOT1887 2016-10-04
Part Description Quick access