SOT1887-3: WLCSP48


Overview

WLCSP48, wafer level chip-scale package; 48 bumps; 0.4 mm pitch, 2.51 mm x 3.55 mm x 0.525 mm body
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP48 surface mount bottom WLCSP 2.51 x 3.55 x 0.525 48
Manufacture Code Reference Codes Issue Date
98ASA01163D 2017-12-11
Part Description Quick access