SOT1901-1: WLCSP8

Overview

WLCSP8, wafer level chip-scale package; 8 bumps; 0.810 mm x 0.505 mm x 0.23 mm body

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1901-1	WLCSP8	surface mount	bottom	WLCSP	0.801 x 0.505 x 0.23	8

Manufacture Code	Reference Codes	Issue Date
SOT1901-1		2017-03-08