SOT1917-3: WLCSP72

Overview

WLCSP72, wafer level chip-scale package; 72 bumps; 0.35 mm pitch, 3.54 mm x 2.99 mm x 0.49 mm body

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1917-3	WLCSP72	surface mount	bottom	WLCSP	3.54 x 2.99 x 0.49	72

Manufacture Code	Reference Codes	Issue Date
98ASA01185D		2018-04-27