SOT1926-1: WLCSP41

Overview

WLCSP41, wafer level chip-scale package; 41 bumps; 1.500 mm x 1.455 mm x 0.275 mm body

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1926-1	WLCSP41	surface mount	bottom	WLCSP	1.50 x 1.455 x 0.275	41

Manufacture Code	Reference Codes	Issue Date
SOT1926		2017-06-14