SOT1950-1: WLCSP72

Overview

WLCSP72, wafer level chip-scale package, 72 bumps, 4.46 mm x 3.96 mm x 0.53 mm body

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1950-1	WLCSP72	surface mount	bottom	WLCSP	4.46 x 3.96 x 0.53	72

Manufacture Code	Reference Codes	Issue Date
SOT1950-1		2017-10-05