SOT1957-1: WLCSP43

Overview

WLCSP43, wafer level chip-scale package; 43 bumps; 0.4 mm pitch, 4.045 mm x 3.16 mm x 0.38 mm body

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT1957-1	WLCSP43	surface mount	bottom	WLCSP	4.045 x 3.16 x 0.38	43

Manufacture Code	Reference Codes	Issue Date
98ASA01248D		2018-04-12