SOT1957-1: WLCSP43


Overview

WLCSP43, wafer level chip-scale package; 43 bumps; 0.4 mm pitch, 4.045 mm x 3.16 mm x 0.38 mm body
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP43 surface mount bottom WLCSP 4.045 x 3.16 x 0.38 43
Manufacture Code Reference Codes Issue Date
98ASA01248D 2018-04-12