SOT2003-1: FOWLP249


Overview

FOWLP249, fan-out wafer-level package, 249 terminals, 0.4 mm pitch, 7 mm x 7 mm x 0.725 mm body
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
FOWLP249 surface mount bottom FOWLP 7 x 7 x 0.725 249
Manufacture Code Reference Codes Issue Date
98ASA01357D 2020-06-17
Part Description Quick access
i.MX RT600 Crossover MCU with Arm® Cortex®-M33 and DSP Cores