SOT2019-1: WLCSP114

Overview

WLCSP114, wafer level chip scale package, 114 terminals, 0.35 mm pitch, 4.235 mm x 4.235 mm x 0.49 mm body (backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT2019-1	WLCSP114	surface mount	bottom	WLCSP	4.235 x 4.235 x 0.49	114

Manufacture Code	Reference Codes	Issue Date
98ASA01389D		2020-04-24

Products

Part	Description	Quick access
MIMXRT685SFAWB	i.MX RT600 Crossover MCU with Arm® Cortex®-M33 and DSP Cores	View parametrics