SOT2028-1: WLCSP48

Overview

WLCSP48, wafer level chip-scale package; 48 bumps; 0.4 mm pitch, 3.15 mm x 2.89 mm x 0.38 mm body

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT2028-1	WLCSP48	surface mount	bottom	WLCSP	3.15 x 2.89 x 0.38	48

Manufacture Code	Reference Codes	Issue Date
98ASA01467D		2021-05-28