SOT2028-1: WLCSP48


Overview

WLCSP48, wafer level chip-scale package; 48 bumps; 0.4 mm pitch, 3.15 mm x 2.89 mm x 0.38 mm body
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP48 surface mount bottom WLCSP 3.15 x 2.89 x 0.38 48
Manufacture Code Reference Codes Issue Date
98ASA01467D 2021-05-28