SOT2034-1: WLCSP48

Overview

WLCSP48, wafer level chip scale package, 48 terminals with gold bump, 0.15 mm pitch, 3.931 mm x 2.983 mm x 0.129 mm body

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT2034-1	WLCSP48	surface mount	bottom	WLCSP	3.931 x 2.983 x 0.129	48

Manufacture Code	Reference Codes	Issue Date
98ASA01416D		2019-07-15