SOT2084-1: HWFLGA18

Overview

HWFLGA18, thermal enhanced very-very thin fine-pitched land grid array package, 18 terminals, 0.4 mm pitch, 2.4 mm x 2 mm x 0.64 mm body

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT2084-1	HWFLGA18	surface mount	bottom	LGA	2.4 x 2 x 0.64	18

Manufacture Code	Reference Codes	Issue Date
98ASA01669D		2020-09-10