SOT2152-1: WLCSP151

Overview

WLCSP151 wafer level chip-size package, 151 terminals, 0.3 mm pitch, 5.165 mm x 4.68 mm x 0.455 mm body (backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT2152-1	WLCSP151	surface mount	perpendicular	WLCSP	5.165 x 4.68 x 0.455	28	silicon

Manufacture Code	Reference Codes	Issue Date
98ASA01782D		2023-05-04