SOT2235-1: WLCSP114

Overview

WLCSP114, wafer level chip scale package, 114 terminals, 0.33 mm pitch, 4.495 mm x 4.0 mm x 0.455 mm body (backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT2235-1	WLCSP114	surface mount	upper	WLCSP	4.495 x 4 x 0.455	114	silicon

Manufacture Code	Reference Codes	Issue Date
98ASA02158D		2024-12-02