SOT509-2: HLBGA304


Overview

plastic thermal enhanced low profile ball grid array package; 304 balls; body 31 x 31 x 0.9 mm; heatsink
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
HLBGA304 surface mount bottom HLBGA 304 plastic
Manufacture Code Reference Codes Issue Date
SOT509 MO-149(JEDEC) 2005-09-01