SOT509-2: HLBGA304

Overview

plastic thermal enhanced low profile ball grid array package; 304 balls; body 31 x 31 x 0.9 mm; heatsink

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT509-2	HLBGA304	surface mount	bottom	HLBGA		304	plastic

Manufacture Code	Reference Codes	Issue Date
SOT509	MO-149(JEDEC	2005-09-01