SOT546-2: HBGA352


Overview

plastic, heatsink ball grid array package; 352 balls; body 35 x 35 x 0.9 mm
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
HBGA352 surface mount bottom HBGA 352 plastic
Manufacture Code Reference Codes Issue Date
SOT546 2000-03-04