SOT553-1: HBGA292


Overview

plastic thermal enhanced ball grid array package; 292 balls; body 27 x 27 x 1.75 mm; heatsink
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
HBGA292 surface mount bottom HBGA 292 plastic
Manufacture Code Reference Codes Issue Date
SOT553 MS-034(JEDEC);144E(IEC) 2002-02-27