SOT602-1: HBGA256

Overview

plastic thermal enhanced ball grid array package; 256 balls; body 27 x 27 x 0.9 mm; heatsink

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT602-1	HBGA256	surface mount	bottom	HBGA		256	plastic

Manufacture Code	Reference Codes	Issue Date
SOT602	MS-034(JEDEC);144E(IEC	2003-03-17