SOT603-1: HBGA420

Overview

plastic thermal enhanced ball grid array package; 420 balls; body 35 x 35 x 0.9 mm; heatsink

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT603-1	HBGA420	surface mount	bottom	HBGA		420	plastic

Manufacture Code	Reference Codes	Issue Date
SOT603	MS-034(JEDEC);144E(IEC	2003-03-17