SOT605-1: HBGA600


Overview

plastic, thermal enhanced ball grid array package; 600 balls; 1.27 mm pitch; 40 mm x 40 mm x 0.9 mm body
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
HBGA600 surface mount bottom HBGA 40 x 40 x 1.65 600 plastic
Manufacture Code Reference Codes Issue Date
SOT605 MS-034(JEDEC);144E(IEC 2003-03-17