SOT605-1: HBGA600

Overview

plastic, thermal enhanced ball grid array package; 600 balls; 1.27 mm pitch; 40 mm x 40 mm x 0.9 mm body

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT605-1	HBGA600	surface mount	bottom	HBGA	40 x 40 x 1.65	600	plastic

Manufacture Code	Reference Codes	Issue Date
SOT605	MS-034(JEDEC);144E(IEC	2003-03-17