SOT610-1: HBGA456

Overview

plastic thermal enhanced ball grid array package; 456 balls; body 35 x 35 x 1.8 mm; heatsink

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT610-1	HBGA456	surface mount	bottom	HBGA		456	plastic

Manufacture Code	Reference Codes	Issue Date
SOT610	MS-034(JEDEC);144E(IEC	2009-08-14