SOT624-1: HBGA1312

Overview

plastic thermal enhanced ball grid array package; 1312 balls; body 40 x 40 x 1.65 mm; heatsink

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT624-1	HBGA1312	surface mount	bottom	HBGA		1312	plastic

Manufacture Code	Reference Codes	Issue Date
SOT624	MS-034(JEDEC);144E(IEC	2003-01-14