SOT635-1: HBGA596


Overview

plastic thermal enhanced ball grid array package; 596 balls; body 40 x 40 x 1.75 mm; heatsink
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
HBGA596 surface mount bottom HBGA 596 plastic
Manufacture Code Reference Codes Issue Date
SOT635 MS-034(JEDEC);144E(IEC 2003-01-14