SOT635-1: HBGA596

Overview

plastic thermal enhanced ball grid array package; 596 balls; body 40 x 40 x 1.75 mm; heatsink

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT635-1	HBGA596	surface mount	bottom	HBGA		596	plastic

Manufacture Code	Reference Codes	Issue Date
SOT635	MS-034(JEDEC);144E(IEC	2003-01-14