SOT636-1: HBGA388

Overview

plastic, heatsink ball grid array package; 388 balls; 1.27 mm pitch; 35 mm x 35 mm x 1.75 mm body

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT636-1	HBGA388	surface mount	bottom	HBGA	35 x 35 x 2.55	388	plastic

Manufacture Code	Reference Codes	Issue Date
SOT636	MS-034(JEDEC);144E(IEC	2001-12-11