SOT683-1: HBGA960

Overview

plastic thermal enhanced ball grid array package; 960 balls; body 33 x 33 x 2.4 mm; heatsink

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT683-1	HBGA960	surface mount	bottom	HBGA		960	plastic

Manufacture Code	Reference Codes	Issue Date
SOT683	MS-034(JEDEC	2002-05-01