SOT706-1: HBGA552

Overview

plastic thermal enhanced ball grid array package; 552 balls; body 37.5 x 37.5 x 1.42 mm; heatsink

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT706-1	HBGA552	surface mount	bottom	HBGA		552	plastic

Manufacture Code	Reference Codes	Issue Date
SOT706		2002-11-13