SOT714-1: HBGA329

Overview

plastic thermal enhanced ball grid array package; 329 balls; body 31 x 31 x 1.75 mm; heatsink

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT714-1	HBGA329	surface mount	bottom	HBGA		329	plastic

Manufacture Code	Reference Codes	Issue Date
SOT714	MS-034(JEDEC);144E(IEC	2001-10-30