SOT727-1: HLBGA475

Overview

plastic thermal enhanced low profile ball grid array package; 475 balls; body 35 x 35 x 0.9 mm; heatsink

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT727-1	HLBGA475	surface mount	bottom	HLBGA		475	plastic

Manufacture Code	Reference Codes	Issue Date
SOT727	MO-192(JEDEC	2002-02-07