SOT799-1: HBGA564


Overview

plastic thermal enhanced ball grid array package; 564 balls; body 40 x 40 x 1.75 mm; heatsink
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
HBGA564 surface mount bottom HBGA 564 plastic
Manufacture Code Reference Codes Issue Date
SOT799 MS-034(JEDEC);144E(IEC 2002-11-18