SOT846-1: HBGA760

Overview

plastic thermal enhanced ball grid array package; 760 balls; body 40 x 40 x 1.75 mm; heatsink

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT846-1	HBGA760	surface mount	bottom	HBGA		760	plastic

Manufacture Code	Reference Codes	Issue Date
SOT846	MS-034(JEDEC	2005-08-19