SOT860-1: HBGA624

Overview

plastic, thermal enhanced ball grid array package; 624 balls; 1.27 mm pitch; 40 mm x 40 mm x 1.75 mm body

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT860-1	HBGA624	surface mount	bottom	HBGA	40 x 40 x 2.55	624	plastic

Manufacture Code	Reference Codes	Issue Date
SOT860	MS-034(JEDEC	2005-09-22