SOT864-1: HTSSOP24

Overview

plastic thermal enhanced thin shrink small outline package; 24 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
SOT864-1	HTSSOP24	surface mount	double	HTSSOP	4.4 x 7.8 x 0.9	24	plastic

Manufacture Code	Reference Codes	Issue Date
SOT864	MO-153(JEDEC	2005-12-06

Products

Part	Description	Quick access
UJA1069TW24	LIN fail-safe system basis chip	View parametrics