SOT864-1: HTSSOP24


Overview

plastic thermal enhanced thin shrink small outline package; 24 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
HTSSOP24 surface mount double HTSSOP 4.4 x 7.8 x 0.9 24 plastic
Manufacture Code Reference Codes Issue Date
SOT864 MO-153(JEDEC) 2005-12-06
Part Description Quick access
LIN fail-safe system basis chip