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Package Version Package Name Package Description Reference Codes Issue Date
CDIP40 ceramic dual in-line package (600 mil); 40 leads; F: no window; FA: with window 2011-01-17
HUQFN HWQFN
SSOP plastic thermal enhanced thin shrink small outline package; 28 leads; body 9.7 x 4.4 x 1.2 mm; lead pitch 0.65 mm (EIAJ);MO-153-AE(JEDEC);IEC 2006-08-18
NAU000 Uncased 2009-07-16
WLCSP wafer level chip-scale package; 6 bumps; 0.65 x 0.44 x 0.27 mm 2015-05-06
WLCSP wafer level chip-size package; 6 balls; 0.65 x 0.44 x 0.29 mm 2013-11-04
WLCSP wafer level chip-size package; 6 balls; 0.65 x 0.44 x 0.29 mm 2012-07-25
WLCSP wafer level chip-size package; 6 balls; 0.65 x 0.44 x 0.29 mm 2014-08-25
WLCSP wafer level chip-size package; 6 balls; 0.65 x 0.44 x 0.29 mm 2014-08-25
WLCSP wafer level chip-size package; 6 balls; 0.65 x 0.44 x 0.29 mm 2014-08-25
WLCSP Wafer level chip-size package; 6 bumps (3 x 2) ---(EIAJ);---(JEDEC);---(IEC) 2011-06-06
WLCSP Wafer level chip-size package; 5 bumps (2-1-2) ---(EIAJ);---(JEDEC);---(IEC) 2011-06-06
WLCSP Wafer level chip-size package; 10 bumps (4-2-4) ---(EIAJ);---(JEDEC);---(IEC) 2011-06-06
WLCSP Wafer level chip-size package; 15 bumps (6-3-6) ---(EIAJ);---(JEDEC);---(IEC) 2011-06-06
WLCSP Wafer level chip-size package; 20 bumps (8-4-8) ---(EIAJ);---(JEDEC);---(IEC) 2011-06-06
WLCSP Wafer level chip-size package; 5 bumps (2-1-2) ---(EIAJ);---(JEDEC);---(IEC) 2011-06-06
WLCSP Wafer level chip-size package; 10 bumps (4-2-4) ---(EIAJ);---(JEDEC);---(IEC) 2011-06-06
WLCSP Wafer level chip-size package; 15 bumps (6-3-6) ---(EIAJ);---(JEDEC);---(IEC) 2011-06-06
WLCSP Wafer level chip-size package; 20 bumps (8-4-8) ---(EIAJ);---(JEDEC);---(IEC) 2011-06-06
WLCSP Wafer level chip-size package; 5 bumps (2-1-2) ---(EIAJ);---(JEDEC);---(IEC) 2011-06-06
WLCSP Wafer level chip-size package; 6 bumps (2 x 3) 2013-06-11
WLCSP Wafer level chip-size package; 18 bumps 2011-07-06
WLCSP Wafer level chip-size package; 24 bumps 2011-07-06
WLCSP Wafer level chip-size package; 10 bumps (4-2-4) ---(EIAJ);---(JEDEC);---(IEC) 2011-06-06
WLCSP Wafer level chip-size package; 15 bumps (6-3-6) ---(EIAJ);---(JEDEC);---(IEC) 2011-07-06
WLCSP Wafer level chip-size package; 20 bumps (8-4-8) ---(EIAJ);---(JEDEC);---(IEC) 2011-06-07
WLCSP Wafer level chip-size package; 5 bumps (2-1-2) ---(EIAJ);---(JEDEC);---(IEC) 2011-06-07
WLCSP Wafer level chip-size package; 24 bumps (5 x 5 - A1) ---(EIAJ);---(JEDEC);---(IEC) 2011-05-26
WLCSP Wafer level chip-size package; 25 bumps (5 x 5) ---(EIAJ);---(JEDEC);---(IEC) 2011-05-26
WLCSP Wafer level chip-size package; 5 bumps; 1.12 x 1.12 x 0.70 mm (EIAJ);(JEDEC);IEC 2011-07-18
WLCSP Wafer level chip-size package; 8 bumps; 1.49 x 1.46 x 0.70 mm (EIAJ);(JEDEC);IEC 2011-07-18
WLCSP Wafer level chip-size package; 11 bumps; 1.96 x 1.44 x 0.70 mm 2005-08-26
WLCSP Wafer level chip-size package; 20 bumps; 2.54 x 1.96 x 0.70 mm 2008-11-11
WLCSP Wafer level chip-size package; 20 bumps; 2.54 x 1.96 x 0.735 mm (EIAJ);(JEDEC);IEC 2011-07-20
WLCSP wafer level chip-size package; 16 bumps 2009-03-12
WLCSP Wafer level chip-size package; 8 bumps; 1.41 x 1.41 x 0.7 mm 2010-11-02
WLCSP Wafer level chip-size package; 5 bumps; 1.46 x 1.52 x 0.70 mm 2011-04-28
WLCSP Wafer level chip-size package; 20 bumps; 2.51 x 2.01 x 0.70 mm 2008-11-11
WLCSP Wafer level chip-size package; 4 bumps; 0.91 x 0.91 x 0.70 mm 2011-06-06
WLCSP Wafer level chip-size package; 2 bumps; 0.52 x 0.72 x 0.42 mm 2008-05-20
WLCSP Wafer level chip-size package; 4 bumps; 0.76 x 0.76 x 0.66 mm (EIAJ);(JEDEC);IEC 2010-11-08
WLCSP Wafer level chip-size package; 4 bumps; 0.76 x 0.76 x 0.66 mm (EIAJ);(JEDEC);IEC 2011-04-26
WLCSP Wafer level chip-size package; 9 bumps; 1.16 x 1.16 x 0.66 mm 2008-09-24
WLCSP Wafer level chip-size package; 5 bumps; 0.76 x 1.06 x 0.66 mm 2011-04-28
WLCSP WLCSP18: wafer level chip-size package; 18 bumps ---(EIAJ);---(JEDEC);---(IEC) 2011-05-26
WLCSP WLCSP24: wafer level chip-size package; 24 bumps ---(EIAJ);---(JEDEC);---(IEC) 2011-05-26
WLCSP Wafer level chip-size package; 5 bumps; 0.76 x 1.06 x 0.66 mm 2008-08-15
WLCSP Wafer level chip-size package; 5 bumps; 0.93 x 0.93 x 0.66 mm (EIAJ);(JEDEC);IEC 2011-07-18
WLCSP Wafer level chip-size package; 24 bumps; 2.11 x 1.95 x 0.70 mm 2011-06-06
WLCSP Wafer level chip-size package; 11 bumps; 1.61 x 1.21 x 0.70 mm (EIAJ);(JEDEC);IEC 2011-07-18
WLCSP Wafer level chip size package; 24 bumps; 2.01 x 2.02 x 0.61 mm 2009-07-06
WLCSP Wafer level chip-size package; 6 bumps; 1.16 x 0.76 x 0.68 mm 2008-10-10
WLCSP Wafer level chip-size package; 4 bumps; 0.76 x 0.76 x 0.66 mm 2011-06-06
WLCSP Wafer level chip-size package; 11 bumps 2011-07-06
WLCSP Wafer level chip-size package; 8 bumps (3 x 3 - A1) 2011-07-06
WLCSP Wafer level chip-size package; 4 bumps; 0.76 x 0.76 x 0.66 mm 2007-09-03
WLCSP Wafer level chip-size package; 4 bumps; 0.76 x 0.76 x 0.66 mm 2011-06-06
WLCSP Wafer level chip-size package; 4 bumps; 0.76 x 0.76 x 0.66 mm 2011-06-06
WLCSP Wafer level chip-size package; 25 bumps; 2.01 x 2.01 x 0.66 mm 2006-09-23
WLCSP Wafer level chip-size package; 24 bumps; 2.01 x 2.01 x 0.66 mm (EIAJ);(JEDEC);IEC 2008-04-14
WLCSP Wafer level chip-size package; 25 bumps; 2.01 x 2.01 x 0.66 mm 2013-04-15
WLCSP Wafer level chip-size package; 6 bumps (2 x 3) 2013-06-11
WLCSP Wafer level chip-size package; 16 bumps; 2.17 x 2.32 x 0.6 mm - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2010-10-18
WLCSP WLCSP100: wafer level chip-scale package; 100 balls; 5.074 x 5.074 x 0.6 mm ---(EIAJ);---(JEDEC);---(IEC) 2013-11-04
WLCSP wafer level chip-scale package; 49 bumps; 3.29 x 3.29 x 0.54 mm (backside coating included) 2014-11-03
WLCSP wafer chip-scale package; 9 bumps; 1.22 x 1.22 x 0.5 mm 2014-12-16
WLCSP wafer level chip-size package, 12 bumps ---(EIAJ);---(JEDEC);---(IEC) 2011-06-16
WLCSP wafer level chip-size package, 12 bumps 2011-07-28
WLCSP wafer level chip-scale package, 12 balls; 1.19 x 1.62 x 0.56 mm ---(EIAJ);---(JEDEC);---(IEC) 2013-02-26
WLCSP wafer level chip-scale package, 12 terminals, 0.4 mm pitch, 1.205 mm x 1.605 mm x 0.272 mm body 2014-04-22
WLCSP wafer level chip-scale package; 20 bumps; 2.1 x 1.7 x 0.49 mm (Backside coating included) 2015-07-21
WLCSP wafer level chip-scale package; 12 bumps; 1.36 x 1.66 x 0.51 mm, 0.4 mm pitch (Backside coating included) 2013-05-23
WLCSP wafer level chip-scale package; 42 bumps; 3.56 x 3.41 x 0.57 mm (backside coating included) 2015-01-19
WLCSP wafer level chip-size package; 16 bumps ---(EIAJ);---(JEDEC);---(IEC) 2011-11-04
WLCSP wafer level chip-size package; 16 bumps 2012-01-10
WLCSP wafer level chip-size package; 4 bumps; 0.96 x 0.96 x 0.55 mm (Backside coating included) ---(EIAJ);---(JEDEC);---(IEC) 2012-07-02
WLCSP wafer level chip-size package; 4 bumps ---(EIAJ);---(JEDEC);---(IEC) 2012-07-02
WLCSP wafer level chip-size package; 4 bumps; 0.96 x 0.96 x 0.55 mm (Backside coating included) ---(EIAJ);---(JEDEC);---(IEC) 2012-07-02
WLCSP wafer level chip-size package; 4 bumps; 0.96 x 0.96 x 0.55 mm (Backside coating included) ---(EIAJ);---(JEDEC);---(IEC) 2012-07-02
WLCSP wafer level chip-size package.4 bumps; body 0.76 x 0.76 x 0.51 mm. (Backside Coating included) ---(EIAJ);---(JEDEC);---(IEC) 2011-06-09
WLCSP wafer level chip-size package; 4 bumps ---(EIAJ);---(JEDEC);---(IEC) 2012-07-02
WLCSP Wafer level chip-size package.4 bumps; body 0.76 x 0.76 x 0.51 mm. (Backside Coating included) ---(EIAJ);---(JEDEC);---(IEC) 2011-06-10
WLCSP wafer level chip-size package; 4 bumps ---(EIAJ);---(JEDEC);---(IEC) 2012-07-02
WLCSP wafer level chip-scale package; 4 bumps; 0.77 x 0.77 x 0.51 mm (Backside coating included) ---(EIAJ);---(JEDEC);---(IEC) 2013-04-02
WLCSP WLCSP12: wafer level chip-scale package; 12 bumps 2013-03-29
WLCSP WLCSP12: wafer level chip-scale package; 12 bumps; 1.36 x 1.66 x 0.51 mm, 0.4 mm pitch (Backside coating included) 2013-12-20
WLCSP Wafer level chip-size package; 9 bumps 2013-03-27
WLCSP wafer level chip-scale package; 9 bumps; body 1.36 x 1.36 x 0.51 mm (Backside coating included) 2014-02-14
WLCSP wafer level chip-scale package; 6 bumps; 0.87 x 1.37 x 0.50 mm 2014-01-21
WLCSP wafer level chip-scale package, 6 bumps; 0.87 x 1.37 x 0.50 mm 2015-04-21
WLCSP wafer level chip-scale package, 6 bumps; 0.87 x 1.37 x 0.50 mm 2014-10-16
WLCSP wafer level chip-scale package, 6 bumps; 0.87 x 1.37 x 0.50 mm 2015-04-21
WLCSP wafer level chip-scale package; 12 bumps; 1.36 x 1.66 x 0.51 mm, 0.4 mm pitch (Backside coating included) 2013-05-23
WLCSP wafer level chip-scale package; 39 balls ---(EIAJ);---(JEDEC);---(IEC) 2013-06-06
WLCSP wafer level chip-scale package; 13 bumps; 2.74 x 2.80 x 0.38 mm 2015-10-05
WLCSP wafer level chip-scale package; 89 bumps; 3.63 x 3.58 x 0.38 mm (EIAJ);(JEDEC);IEC 2015-04-22
UC Wire bond die ; 5.47 x 4.47 x 0.24 mm 2008-08-08
UC Wire bond die; 5 bonding pads; 4.47 x 5.47 x 0.24 mm 2009-08-07
UC Bare die; 197 bumps ---(EIAJ);---(JEDEC);---(IEC) 2011-10-26
UC Bare die; 110 bumps ---(EIAJ);---(JEDEC);---(IEC) 2011-10-26
UC Bare die; 197 bumps ---(EIAJ);---(JEDEC);---(IEC) 2011-09-06
UC Bare die; 110 bumps ---(EIAJ);---(JEDEC);---(IEC) 2011-09-06
UC Bare die; 99 bumps 2011-12-05
UC Bare die; 247 bumps ---(EIAJ);---(JEDEC);---(IEC) 2013-01-07
UC Bare die; 59 bumps 2011-12-07
WLCSP wafer level chip-scale package; 9 bumps; 1.24 x 1.24 x 0.525 mm (backside coating included) 2015-07-23
WLCSP wafer level chip-scale package; 9 bumps; 1.24 x 1.24 x 0.525 mm (backside coating included) 2015-09-29
UC Bare die; 80 bonding pads ---(EIAJ);---(JEDEC);---(IEC) 2011-11-23
UC Bare die; 110 bumps 2012-02-29
WLCSP wafer level chip-scale package; 8 bumps; 1.16 x 0.86 x 0.48 mm 2015-08-17
UC Bare die: 168 bumps ---(EIAJ);---(JEDEC);---(IEC) 2011-11-01
UC Bare die; 197 bumps ---(EIAJ);---(JEDEC);---(IEC) 2011-10-26
UC Bare die; 110 bumps ---(EIAJ);---(JEDEC);---(IEC) 2011-10-26
UC Bare die; 12 bumps (6-6); 1.58 x 2.15 x 0.22 mm 2010-09-27
UC Wire bond die; 248 bonding pads 2011-12-14
UC Bare die; 197 bumps ---(EIAJ);---(JEDEC);---(IEC) 2011-10-26
UC Bare die; 99 bumps ---(EIAJ);---(JEDEC);---(IEC) 2011-10-26
UC Wire bond die; 76 bonding pads ---(EIAJ);---(JEDEC);---(IEC) 2011-10-26
UC Bare die; 247 bumps ---(EIAJ);---(JEDEC);---(IEC) 2013-01-07
UC Wire bond die; 40 bonding pads ---(EIAJ);---(JEDEC);---(IEC) 2011-10-26
UC Wire bond die; 56 bonding pads ---(EIAJ);---(JEDEC);---(IEC) 2011-10-26
UC Bare die; 59 bumps ---(EIAJ);---(JEDEC);---(IEC) 2011-10-26
UC Wire bond die; 59 bonding pads ---(EIAJ);---(JEDEC);---(IEC) 2011-10-26
UC Wire bond die; 40 bonding pads ---(EIAJ);---(JEDEC);---(IEC) 2011-11-02
UC Wire bond die; 248 bonding pads 2011-12-14
UC Wire bond die; 248 bonding pads 2011-12-14
WLCSP wafer level chip-scale package; 6 bumps; 0.69 x 1.09 x 0.38 mm (Backside coating included) 2014-11-19
WLCSP Wafer level chip-size package; 10 bumps (4-2-4) 2011-07-06
WLCSP Wafer level chip-size package; 10 bumps (4-2-4) 2011-07-06
WLCSP Wafer level chip-size package; 15 bumps (6-3-6) 2011-07-06
WLCSP Wafer level chip-size package; 15 bumps (6-3-6) 2011-07-06
WLCSP Wafer level chip-size package; 20 bumps (8-4-8) 2011-07-06
WLCSP Wafer level chip-size package; 20 bumps (8-4-8) 2011-07-06
WLCSP WLCSP4: wafer level chip-size package; 4 bumps (2 x 2) 2016-06-28
WLCSP WLCSP4: wafer level chip-size package; 4 bumps (2 x 2) 2015-07-07
WLCSP WLCSP4: wafer level chip-size package; 4 bumps (2 x 2) 2014-07-02
WLCSP WLCSP4: wafer level chip-size package; 4 bumps (2 x 2) (EIAJ);(JEDEC);IEC 2014-06-18
WLCSP WLCSP6: wafer level chip-size package; 6 bumps (3 x 2) 2015-07-07
WLCSP WLCSP6: wafer level chip-size package; 6 bumps (3 x 2) 2015-07-20
WLCSP WLCSP6: wafer level chip-size package; 6 bumps (3 x 2) 2015-03-25
WLCSP wafer level chip-scale package; 42 bumps; 2.88 x 2.80 x 0.54 mm (backside coating included) 2015-08-06
WLCSP wafer level chip-scale package; 42 bumps; 2.88 x 2.80 x 0.54 mm (backside coating included) 2015-08-06
WLCSP wafer level chip-scale package; 49 bumps; 3.29 x 3.29 x 0.54 mm (backside coating included) 2015-08-06
WLCSP Wafer level chip-size package; 16 balls; 1.7 x 1.7 x 0.56 mm 2010-01-19
WLCSP Wafer level chip-size package; 16 balls; 2.06 x 2.11 x 0.6 mm 2007-10-17
WLCSP Wafer level chip-size package; 9 bumps; 1.66 X 1.71 X 0.6 mm 2008-06-12
UC Bare die; 5.5 mm x 4.5 mm (EIAJ);(JEDEC);IEC 2012-11-21
UC Bare die; 7.5mm x 4.6 mm 2012-11-21
UC Bare die; 6.2mm x 3.7 mm 2012-11-02
WLCSP Wafer level chip-size package; 8 bumps; 0.61 x 0.84 x 0.38 mm 2006-12-15
UC Bare die; 84 bond pads 2011-04-13
UC Bare die; 84 bond pads ---(EIAJ);---(JEDEC);---(IEC) 2011-06-10
WLCSP wafer level chip-size package; 49 bumps; 3.37 x 2.97 mm ---(EIAJ);---(JEDEC);---(IEC) 2013-03-07
WLCSP Wafer level chip-size package; 9 bumps; 1.3 x 1.3 x 0.6 mm 2010-10-06
WLCSP WLCSP9: wafer level chip-size package; 9 bumps ---(EIAJ);---(JEDEC);---(IEC) 2011-05-26
WLCSP wafer level chip-scale package; 30 bumps; 2.06 x 2.72 x 0.50 mm 2014-10-09
WLCSP wafer level chip-scale package; 30 bumps; 2.06 x 2.72 x 0.50 mm 2015-04-17
WLCSP wafer level chip-scale package; 30 bumps; 2.06 x 2.72 x 0.525 mm (backside coating included) 2015-03-13
WLCSP wafer level chip-scale package; 30 bumps; 2.06 x 2.72 x 0.525 mm (Backside coating include) 2015-05-07
WLCSP Wafer level chip-size package; 9 bumps; 1.3 x 1.3 x 0.6 mm 2010-10-25
WLCSP9 wafer level chip-scale package; 9 bumps; 1.24 x 1.24 x 0.525 mm (backside coating included) 2016-08-04
UFLGA64 plastic ultra thin fine-pitch land grid array package; 64 lands 2016-04-21
SMA; PMOS transfer-moulded thermo-setting plastic small rectangular surface mounted package; 2 connectors DO-214AC(JEDEC) 2006-03-16
ALF2 hermetically sealed plastic package; axial leaded; 2 leads 1998-08-04
ALF2 hermetically sealed plastic package; axial leaded; 2 leads 1998-08-05
SOD2 ceramic, very small ceramic rectangular surface-mounted package; 2 terminals; 2 mm x 1.25 mm x 1.6 mm body 2006-03-16
TO-220F plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 2-lead TO-220 "full pack" 2-lead TO-220F(JEDEC) 2015-07-28
TO-220F plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 2-lead TO-220F "full pack" 2 LEADS TO220F(JEDEC) 2014-01-14
ALF2 hermetically sealed plastic package; axial leaded; 2 leads 1998-05-28
ALF2 hermetically sealed plastic package; axial leaded; 2 leads 1998-05-28
GALF2 hermetically sealed glass package; axial leaded; 2 leads 1998-12-04
GALF2 hermetically sealed glass package; axial leaded; 2 leads 1999-06-24
GALF2 hermetically sealed glass package; axial leaded; 2 leads 1999-06-24
SOD123 plastic, surface-mounted package; 2 leads; 2.675 mm x 1.6 mm x 1.15 mm body 2016-08-31
SOD123F plastic, surface-mounted package; 2 leads; 2.6 mm x 1.6 mm x 1.1 mm body 2006-03-16
SOD123GW Plastic surface-mounted package; 2 leads (EIAJ);(JEDEC);IEC 2016-05-26
SOD123W plastic, surface mounted package; 2 terminals; 2.6 mm x 1.7 mm x 1 mm body 2008-11-06
SOD2 transfer-moulded thermo-setting plastic small rectangular surface mounted package; 2 connectors DO-214AC(JEDEC) 2006-03-16
ALF2 hermetically sealed plastic package; axial leaded; 2 leads 2000-03-06
SOD128 plastic, surface mounted package; 2 terminals; 4 mm pitch; 3.8 mm x 2.6 mm x 1 mm body 2007-09-12
SOD132 Hermetically sealed plastic package; SMB; 2 leads SMB. DO-214AA(JEDEC) 2013-03-20
DO-201AD Hermetically sealed plastic package; axial leaded; 2 leads DO-201AD(JEDEC) 2010-05-18
SOD142 Plastic Single-ended through-hole package; Heatsink mounted; 1 mounting hole; 2-lead TO-247 TO-247(JEDEC) 2012-11-27
DFN1608D-2 plastic, leadless ultra small plastic package; 2 terminals; 0.94 mm pitch; 1.6 mm x 0.8 mm x 0.37 mm body 2011-11-29
ALF2 glass, hermetically sealed glass package; axial leaded; 2 leads; 4.25 mm x 1.85 mm body SC-40(EIAJ);DO-34(JEDEC);A24(IEC) 2014-02-26
SOD323 plastic, surface-mounted package; 2 leads; 1.3 mm pitch; 1.7 mm x 1.25 mm x 0.95 mm body SC-76(EIAJ) 2006-03-16
SOD323F plastic, surface-mounted package; 2 leads; 1.7 mm x 1.25 mm x 0.7 mm body SC-90(EIAJ) 2006-03-16
SOD523 plastic, surface-mounted package; 2 leads; 1.2 mm x 0.8 mm x 0.6 mm body SC-79(EIAJ) 2006-03-16
SC-79 plastic surface-mounted package; 2 leads SC-79(EIAJ) 2006-03-16
GALF2 hermetically sealed glass package; axial leaded; 2 leads 1997-10-14
TO-220AC plastic single-ended package; heatsink mounted; 1 mounting hole; 2-lead TO-220AC 2-lead TO-220AC(JEDEC) 2012-11-27
TO-220AC Plastic single-ended package; heatsink mounted; 1 mounting hole; 2-lead TO-220AC 2015-03-30
GALF2 hermetically sealed glass package; axial leaded; 2 leads 1997-10-14
DO-41 glass, hermetically sealed glass package; 2 leads; 4.8 mm x 2.6 mm body DO-41(JEDEC) 1997-06-20
DO-34 glass, hermetically sealed glass package; 2 leads; 3.04 mm x 1.6 mm body DO-34(JEDEC) 1997-06-09
PBCYT2 plastic near cylindrical single-ended package; 2 in-line leads 2006-09-15
SOD2 plastic surface mounted package; 2 leads 2006-03-16
LLDS; MiniMelf glass, hermetically sealed glass surface-mounted package; 2 connectors; 3.5 mm x 1.5 mm body 100H01(IEC) 2006-03-16
GALF2 hermetically sealed glass package; axial leaded; 2 leads 1997-06-20
GALF2 hermetically sealed glass package; axial leaded; 2 leads 1997-06-11
GALF2 hermetically sealed glass package; axial leaded; 2 leads 1997-06-27
MELF glass, hermetically sealed glass surface mounted package; 2 terminals; 3.5 mm x 2.1 mm body 100H03(IEC) 2006-03-16
DFN1006-2 plastic, leadless ultra small package; 2 terminals; 0,65 mm pitch; 1 mm x 0.6 mm x 0.48 mm body 2014-08-26
DFN1006D-2 plastic, leadless ultra small plastic package; 2 terminals; 0.65 mm pitch; 1 mm x 0.6 mm x 0.4 mm body 2010-09-27
SOD2 leadless ultra small plastic package; 2 terminals; body 1.0 x 0.6 x 0.4 mm 2006-04-12
GALF2 hermetically sealed glass package; axial leaded; 2 leads 1997-06-20
GALF2 hermetically sealed glass package; axial leaded; 2 leads 1997-06-20
GALF2 hermetically sealed glass package; axial leaded; 2 leads 1997-06-20
GALF2 hermetically sealed glass package; axial leaded; 2 leads 1997-06-20
GALF2 hermetically sealed glass package; axial leaded; 2 leads 1997-06-09
SOD2 Microlead ultra small surface-mounted plastic package; 2 leads ---(EIAJ);---(JEDEC);---(IEC) 2011-04-12
TO-220 plastic single-ended package; low-profile 2-lead TO-220 2-lead TO-220(JEDEC) 1999-09-13
DSN0603-2 DSN0603-2: leadless ultra small package; 2 terminals; body 0.6 x 0.3 x 0.3 mm 2010-07-23
SOD2 silicon, leadless ultra small package; 2 terminals; 0.4 mm pitch; 0.6 mm x 0.3 mm x 0.3 mm body 2013-07-17
DSN1608-2 silicon, leadless very small package; 2 terminals; 0.6 mm pitch; 1.6 mm x 0.8 mm x 0.25 mm body 2015-08-06
DSN1608-2 plastic, leadless very small package; 2 terminals; 0.6 mm pitch; 1.6 mm x 0.8 mm x 0.29 mm body 2015-05-15
DFN0603-2 plastic, ultra small and leadless full encapsulated package; 2 terminals; 0.4 mm pitch; 0.63 mm x 0.33 mm x 0.2 mm body 2016-10-10
DSN0402-2 silicon, leadless tiny package; 2 terminals; 0.25 mm pitch; 0.4 mm x 0.2 mm x 0.1 mm body 2015-08-25
DSN1006-2 silicon, leadless ultra small package; 2 terminals; 0.65 mm pitch; 1 mm x 0.6 mm x 0.27 mm body 2014-10-24
DSN1006U-2 silicon, leadless ultra small package; 2 terminals; 0.325 mm pitch; 1 mm x 0.6 mm x 0.27 mm body 2014-12-09
LGA274 land grid array package; 274 lands 2013-04-16
LGA350 land grid array package; 350 lands 2013-08-02
HVQFN36R plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; resin based; body 6 x 5 x 0.85 mm 2008-03-14
HVQFN36R plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; resin based; body 5.5 x 4.5 x 0.85 mm 2007-11-14
HVQFN plastic thermal enhanced very thin quad flat package; no leads; 25 terminals; body 5 x 5 x 0.85 mm 2016-05-19
HUQFN60U plastic thermal enhanced ultra thin quad flat package; no leads; 60 terminals; UTLP based; body 5 x 5 x 0.55 mm ---(EIAJ);---(JEDEC);---(IEC) 2008-04-10
CRDB4 hermetic ceramic surface mounted package; 4 leads 2006-03-16
DIP24 plastic, dual in-line package; 24 leads; 2.54 mm pitch; 31.7 mm x 13.8 mm x 5.1 mm body SC-509-24(EIAJ);MO-015(JEDEC);051G02(IEC) 2003-02-13
HLQFN48R plastic thermal enhanced low profile quad flat package; no leads; 48 terminals; body 7 x 7 x 1.28 mm 2007-11-14
TFBGA100 plastic thin fine-pitch ball grid array package; 100 balls MO-195(JEDEC) 2007-06-05
TFBGA160 plastic thin fine-pitch ball grid array package; 160 balls 2007-07-27
LQFP176 plastic low profile quad flat package; 176 leads; body 20 x 20 x 1.4 mm MS-026(JEDEC) 2007-08-20
BGA256 plastic ball grid array package; 256 balls, 1 mm pitch, 17 mm x 17 mm x 1.45 mm body 2007-08-20
LFBGA208 plastic low profile fine-pitch ball grid array package; 208 balls, 0.8 mm pitch, 14 mm x 14 mm x 1.35 mm body 2007-08-20
DIP18 plastic dual in-line package; 18 leads (300 mil) MS-001(JEDEC) 2003-02-13
DIP18 plastic dual in-line package; 18 leads (300 mil); slim corner leads MS-011(JEDEC) 2003-02-13
DIP18 plastic dual in-line package; 18 leads (300 mil); long body MS-001(JEDEC) 2003-03-12
LFBGA256 plastic low profile fine-pitch ball grid array package; 256 balls, 0.8 mm pitch, 14 mm x 14 mm x 1.35 mm body 2007-08-20
LFBGA256 LFBGA256, low profile fine-pitch ball grid array; 256 terminals, 0.8 mm pitch, 14 mm x 14 mm x 1.6 mm body 2017-03-13
LFBGA256 LFBGA256, low profile fine-pitch ball grid array; 256 terminals, 0.8 mm pitch, 14 mm x 14 mm x 1.35 mm body 2018-05-04
LFBGA324 plastic low profile fine-pitch ball grid array package; 324 balls 2007-08-20
LFBGA477 plastic low profile fine-pitch ball grid array package; 477 balls 2007-07-27
LFPAK56; Power-SO8 plastic, single-ended surface-mounted package (LFPAK56); 4 leads; 1.27 mm pitch; 4.58 mm x 5.13 mm x 1.03 mm body 2013-03-05
LFBGA169 plastic low profile fine-pitch ball grid array package; 169 balls 2007-08-21
LFBGA169 plastic low profile fine-pitch ball grid array package; 169 balls ---(EIAJ);---(JEDEC) 2008-08-07
HUQFN60U plastic thermal enhanced ultra thin quad flat package; no leads; 60 terminals; UTLP based - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2007-11-14
HWQFN28 plastic thermal enhanced very very thin quad flat package; no leads; 28 terminals - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2007-08-23
BGA596 plastic ball grid array package; 596 balls - - -(JEDEC) 2007-11-06
LFBGA296 plastic low profile fine-pitch ball grid array package; 296 balls 2007-09-28
LFBGA161 plastic low profile fine-pitch ball grid array package; 161 balls - - -(EIAJ);- - -(JEDEC) 2007-09-28
HWQFN48R plastic thermal enhanced very very thin quad flat package; no leads; 48 terminals; resin based; body 7 x 7 x 0.7 mm 2007-12-01
HWQFN48R plastic thermal enhanced very very thin quad flat package; no leads; 48 terminals; resin based; body 7 x 7 x 0.7 mm 2008-03-26
HVQFN108U plastic thermal enhanced very thin quad flat package; no leads; 108 terminals; UTLP based; body 8 x 8 x 0.9 mm 2008-10-17
HVQFN108U plastic thermal enhanced very thin quad flat package; no leads; 108 terminals; low stand-off height; UTLP based; body 8 x 8 x 0.9 mm 2008-10-16
HVQFN108U plastic thermal enhanced very thin quad flat package; no leads; 108 terminals; low stand-off height; UTLP based; body 8 x 8 x 0.9 mm 2008-10-17
HWQFN56R plastic thermal enhanced very very thin quad flat package; no leads; 56 terminals; resin based; body 11 x 5 x 0.7 mm 2007-12-01
HWQFN56R HWQFN56R, thermal enhanced very very thin quad flatpack; no leads, 56 terminals, 0.5 mm pitch, 5 mm x 11 mm x 0.71 mm body 2018-05-25
BGA736 plastic ball grid array package; 736 balls 2007-09-28
HBGA736 plastic thermal enhanced ball grid array package; 736 balls; heatsink 2009-08-14
HUQFN76U plastic thermal enhanced ultra thin quad flat package; no leads; 76 terminals; UTLP based; body 6 x 6 x 0.55 mm ---(EIAJ);---(JEDEC);---(IEC) 2007-12-01
HXQFN16U plastic thermal enhanced extremely thin quad flat package; no leads; 16 terminals; UTLP based; body 3 x 3 x 0.5 mm 2007-12-01
HXQFN16(U) HXQFN16 (U) plastic thermal enhanced extremely thin quad flat package; no leads; 16 terminals, 0.5 mm pitch, 3 mm x 3 mm x 0.5 mm body 2011-03-30
FCS2 plastic flip chip strap package; 2 leads; 9 mm wide tape 2007-10-18
FCS2 plastic flip chip strap package; 2 leads; 12 mm wide tape 2007-10-18
FCS2 polymer strap package; 2 leads; 14 mm wide tape 2011-04-21
FCS2 plastic flip chip strap package; 2 leads; 14 mm wide tape 2007-10-18
DHXQFN20U plastic dual in-line compatible thermal enhanced extremely thin quad flat package; no leads; 20 terminals; UTLP based - - -(EIAJ);- - -(IEC) 2009-08-04
DHXQFN20 plastic, dual in-line compatible thermal enhanced extremely thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 0.5 mm body ---(EIAJ);---(JEDEC);---(IEC) 2011-08-18
HXQFN16U plastic thermal enhanced extremely thin quad flat package; no leads; 16 terminals; UTLP based - - -(EIAJ);- - -(IEC) 2007-12-01
HXQFN16 plastic thermal enhanced extremely thin quad flat package; no leads; 16 terminals - - -(EIAJ);- - -(IEC) 2011-03-30
BGA485 plastic ball grid array package; 485 balls MS-034(JEDEC);144E(IEC) 2007-11-14
TFBGA296 plastic thin fine-pitch ball grid array package; 296 balls MO-216(JEDEC) 2007-11-02
XQFN10U plastic extremely thin quad flat pack package; no leads; 10 terminals; UTLP based - - -(EIAJ);MO-255(JEDEC);- - -(IEC) 2010-02-05
XQFN10U plastic extremely thin quad flat pack package; no leads; 10 terminals; UTLP based - - -(EIAJ);MO-255(JEDEC);- - -(IEC) 2010-02-05
XQFN10 plastic, extremely thin quad flat package; 10 terminals; 0.5 mm pitch; 1.55 mm x 2 mm x 0.5 mm body MO255(JEDEC) 2011-03-30
USON6 plastic ultra thin small outline package; no leads; 6 terminals 2008-06-03
TFBGA273 plastic thin fine-pitch ball grid array package; 273 balls MO-195(JEDEC) 2007-11-14
HXSON8 plastic thermal enhanced extremely thin small outline package; no leads; 8 terminals; body 2 x 3 x 0.5 mm MO-229(JEDEC) 2008-03-11
HVSON14 plastic thermal enhanced very thin small outline package; no leads; 14 terminals; body 3 x 4 x 0.85 mm ---(EIAJ);---(JEDEC);---(IEC) 2008-03-06
HVQFN41 plastic thermal enhanced very thin quad flat package; no leads; 41 terminals; body 7 x 7 x 0.85 mm 2008-01-23
HVQFN38R plastic thermal enhanced very thin quad flat package; no leads; 38 terminals; resin based; body 4 x 4 x 0.9 mm 2007-11-30
LFBGA136 plastic low profile fine-pitch ball grid array package; 136 balls 2008-01-03
XSON10U plastic, extremely thin small outline package; no leads; 10 terminals; 0.5 mm pitch; 2.5 mm x 1 mm x 0.5 mm body 2008-01-18
DFN2020-3 plastic, thermal enhanced ultra thin small outline package; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body 2008-10-07
DFN2020D-3 plastic, thermal enhanced ultra thin small outline package; no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body 2015-01-09
LFBGA286 plastic low profile fine-pitch ball grid array package; 286 balls MO-205(JEDEC) 2008-01-28
VFBGA48 plastic very thin fine-pitch ball grid array package; 48 balls ---(JEDEC) 2008-03-17
LFBGA84 plastic low profile fine-pitch ball grid array package; 84 balls ---(EIAJ);---(JEDEC);---(IEC) 2008-04-02
TFBGA54 plastic thin fine-pitch ball grid array package; 54 balls ---(EIAJ);---(JEDEC);---(IEC) 2008-03-27
MLSSN4R metal low profile special-shape package; no leads; 4 terminals; resin based; body 4.72 x 3.76 x 1.1 mm - - -(EIAJ);- - -(JEDEC);- - -IEC 2008-08-20
HUQFN16U plastic thermal enhanced ultra thin quad flat package; no leads; 16 terminals; UTLP based; body 3 x 3 x 0.55 mm 2008-02-26
HWSON8 plastic thermal enhanced very very thin small outline package; no leads; 8 terminals; body 2 x 3 x 0.8 mm (EIAJ);MO-229(JEDEC);IEC 2009-08-10
HWSON8 HWSON8: plastic thermal enhanced very very thin small outline package, no leads; 8 terminals; MO-229(JEDEC) 2009-05-25
LFBGA296 plastic low profile fine-pitch ball grid array package; 296 balls 2008-02-11
VFBGA81 plastic very thin fine-pitch ball grid array package; 81 balls 2008-02-08
LFBGA169 plastic low profile fine-pitch ball grid array package; 169 balls ---(EIAJ);MO-275(JEDEC) 2008-04-02
TFBGA64 plastic thin fine-pitch ball grid array package; 64 balls 2008-03-14
HWQFN48 plastic thermal enhanced very very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.65 mm ---(EIAJ);---(JEDEC);---(IEC) 2008-03-14
LFBGA49 plastic low profile fine-pitch ball grid array package; 49 balls ---(JEDEC) 2008-03-17
LFBGA487 plastic low profile fine-pitch ball grid array package; 487 balls 2008-03-19
LFBGA487 plastic low profile fine-pitch ball grid array package; 487 balls 2009-02-19
VFBGA144 plastic very thin fine-pitch ball grid array package; 144 balls ---(JEDEC) 2008-04-07
LFBGA141 plastic low profile fine-pitch ball grid array package; 141 balls ---(EIAJ);---(JEDEC) 2008-04-10
SO14 plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body MS-012(JEDEC);076E06(IEC) 2003-02-19
SO14 plastic small outline package; 14 leads; body width 3.9 mm; body thickness 1.47 mm MS-012(JEDEC) 2003-02-19
SO14 SOICN 14 3.9*8.65*1.75 2017-06-11
HUQFN24U plastic thermal enhanced ultra thin quad flat package; no leads; 24 terminals; UTLP based; body 3 x 3 x 0.55 mm ---(EIAJ);---(JEDEC);---(IEC) 2008-04-17
XSON10U plastic, extremely thin small outline package; 10 terminals; 0.35 mm pitch; 1.7 mm x 1 mm x 0.35 mm body ---(EIAJ);---(IEC) 2008-04-18
XSON10 plastic, extremely thin small outline package; 10 terminals; 0.35 mm pitch; 1.7 mm x 1 mm x 0.5 mm body - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2011-03-30
VSON6U plastic very thin small outline package; no leads; 6 terminals; UTLP based ---(EIAJ);---(JEDEC);---(IEC) 2009-06-17
LFBGA273 plastic low profile fine-pitch ball grid array package; 273 balls MO-195(JEDEC) 2008-04-29
HVSON14 plastic thermal enhanced very thin small outline package; no leads; 14 terminals; body 3 x 4.5 x 0.85 mm MO-229(JEDEC) 2008-07-03
HVSON14 plastic, thermal enhanced very thin small outline package; no leads; 14 terminals, 0.65 mm pitch, 4.5 mm x 3 mm x 0.85 mm body MO-229(JEDEC) 2010-07-15
HVSON14 plastic, thermal enhanced very thin small outline package; no leads; 14 terminals MO-229(JEDEC) 2011-08-30
VFBGA100 plastic very thin fine-pitch ball grid array package; 100 balls ---(EIAJ);---(JEDEC);---(IEC) 2008-05-27
VFBGA100 VFBGA100, plastic, very thin fine-pitch ball grid array; 100 balls; 0.5 mm pitch; 6 mm x 6 mm x 0.66 mm body 2017-06-11
HBGA520 plastic thermal enhanced ball grid array package; 520 balls; heatsink MS-034(JEDEC);144E(IEC) 2008-06-03
XSON8 plastic, extremely thin small outline package; no leads; 8 terminals; 0.55 mm pitch; 1.35 mm x 1 mm x 0.5 mm body MO-252(JEDEC) 2010-04-12
XSON8 plastic, extremely thin small outline package; no leads; 8 terminals - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2010-06-30
SO16 plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body MS-012(JEDEC);076E07(IEC) 2003-02-19
SO16 plastic small outline package; 16 leads; body width 3.9 mm; low stand-off height MS-012(JEDEC);076E07(IEC) 2003-02-19
SO16 plastic small outline package; 16 leads; body width 3.9 mm; body thickness 1.47 mm MS-012AC(JEDEC) 2003-02-19
SO16 SO16, plastic, small outline; leaded package; 16 terminals; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body 2017-03-24
BGA426 plastic ball grid array package; 426 balls ---(EIAJ);MS-034(JEDEC);144E(IEC) 2008-06-19
TFBGA49 plastic thin fine-pitch ball grid array package; 49 balls ---(JEDEC) 2008-06-23
HVQFN36 plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; body 6 x 6 x 0.85 mm MO-220(JEDEC) 2008-11-12
HVQFN36 plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; body 6 mm x 6 mm x 0.85 mm 2009-02-24
HVQFN36 plastic thermal enhanced very thin quad flat package; no leads; 0.1 dimple wettable flank; 36 terminals; 0.5 mm pitch, 6 mm x 6 mm x 0.85 mm body 2018-03-08
HVQFN36 plastic thermal enhanced very thin quad flat package; no leads; dimple wettable flank; 36 terminals; 0.5 mm pitch, 6 mm x 6 mm x 0.85 mm body 2018-01-09
HVQFN36 plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; 0.5 mm pitch; 6 mm x 6 mm x 0.85 mm body MO-220(JEDEC) 2012-01-10
HVQFN36 plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; body 6 mm x 6 mm x 0.85 mm 2016-10-03
HVQFN36 HVQFN36, plastic thermal enhanced very thin quad flat package; no leads, wettable flanks, 36 terminals; body 6 mm x 6 mm x 0.85 mm 2017-09-09
HVQFN36 HVQFN36, plastic thermal enhanced very thin quad flat package; no leads; dimple wettable flank; 36 terminals, 0.5 mm pitch, 6 mm x 6 mm x 0.85 mm body 2018-05-29
TQFP80 TQFP80: plastic thin quad flat package; 80 leads; body 14 x 14 x 1.1 mm MS-026(JEDEC);136E19(IEC) 2008-11-14
BGA376 plastic ball grid array package; 376 balls - - -(EIAJ);MS-034(JEDEC);144E(IEC) 2008-11-14
HBGA624 plastic thermal enhanced ball grid array package; 624 balls; heatsink - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2008-11-17
BGA452 plastic ball grid array package; 452 balls MS-034(JEDEC);144E(IEC) 2008-11-14
LBGA228 plastic low profile ball grid array package; 228 balls - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2008-11-17
LBGA228 plastic low profile ball grid array package; 228 balls - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2009-12-01
LFBGA268 plastic low profile fine-pitch ball grid array package; 268 balls 2008-11-17
LQFP256 plastic low profile quad flat package; 256 leads; body 28 x 28 x 1.4 mm MS-026(JEDEC);136E31(IEC) 2009-04-08
SIL9MPF plastic single in-line medium power package with fin; 9 leads 2003-03-12
BGA456 BGA456: plastic ball grid array package; 456 balls - - -(EIAJ);MS-034(JEDEC);144E(IEC) 2008-11-19
QFP80 QFP80, plastic, quad flat package; 80 terminals; 0.65 mm pitch; 14 mm x 14 mm x 2.2 mm body PQFP-G80(JEDEC) 2017-06-11
HQFP80 plastic, thermal enhanced quad; flat package; 80 terminals; 0.65 mm pitch; 14 mm x 14 mm x 2.3 mm body 2016-06-06
LFBGA135 plastic low profile fine-pitch ball grid array package; 135 balls ---(EIAJ);---(JEDEC) 2008-08-06
TFBGA296 plastic thin fine-pitch ball grid array package; 296 balls 2008-08-07
MTSSN4R metal thin special-shape package; no leads; 4 terminals; resin based; body 4 x 3 x 1 mm - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2008-08-20
HVSON12 plastic thermal enhanced very thin small outline package; no leads; 12 terminals; body 6 x 6 x 1 mm ---(EIAJ);---(JEDEC);---IEC 2008-09-24
DBS9MPF plastic DIL-bent-SIL medium power package with fin; 9 leads 2003-03-12
HVQFN44 plastic thermal enhanced very thin quad flat package; no leads; 44 terminals 2010-07-23
HVQFN44 HVQFN44, plastic, thermal enhanced very thin quad flatpack; no leads; 44 terminals; 0.65 mm pitch; 9 mm x 9 mm x 1 mm body H-PQFN-N44(JEDEC) 2017-06-11
HVQFN44 HVQFN44, plastic, thermal enhanced very thin quad flatpack; no leads; 44 terminals; 0.65 mm pitch; 9 mm x 9 mm x 1 mm body 2019-04-05
HWQFN56R plastic thermal enhanced very very thin quad flat package; no leads; 56 terminals; resin based; body 7 x 7 x 0.7 mm ---(EIAJ);---(JEDEC);---(IEC) 2008-10-07
XSON6 plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 0.9 mm x 1 mm x 0.35 mm body 2010-04-07
XSON8 plastic, extremely thin small outline package; 8 terminals; 0.55 mm pitch; 1.2 mm x 1 mm x 0.35 mm body 2010-04-07
HUSON6 plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body 2013-06-06
HUSON6 plastic, thermally enhanced ultra thin and small outline package; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body 2014-07-16
HBGA432 plastic thermal enhanced ball grid array package; 432 balls; heatsink ---(EIAJ);MS-034(JEDEC);144E(IEC) 2009-08-14
XSON3 plastic extremely thin small outline package; no leads; 3 terminals MO-252(JEDEC) 2009-10-09
XSON3 plastic extremely thin small outline package; no leads; 3 terminals 2013-07-11
HBGA324 plastic thermal enhanced ball grid array package; 324 balls; heatsink - - -(EIAJ);MS-034(JEDEC);144E(IEC) 2009-06-09
HBGA324 plastic thermal enhanced ball grid array package; 324 balls; heatsink - - -(EIAJ);MS-034(JEDEC);144E(IEC) 2010-01-06
HLQFP256 plastic thermal enhanced low profile quad flat package; 256 leads; body 28 x 28 x 1.4 mm; heatsink MS-026(JEDEC) 2008-12-19
BGA324 plastic ball grid array package; 324 balls; body 23 x 23 x 1.78 mm ---(EIAJ);MS-034(JEDEC);144E(IEC) 2009-02-05
BGA324 plastic ball grid array package; 324 balls - - -(EIAJ);MS-034(JEDEC);144E(IEC) 2009-03-31
BGA324 BGA324, plastic, ball grid array; 324 balls; 1 mm pitch; 23 mm x 23 mm x 1.95 mm body PBGA-B324(JEDEC) 2017-06-11
HSOP44 plastic, heatsink small outline package; 44 leads; low stand-off height, 0.65 mm pitch, 15.9 mm x 11.0 mm x 3.3 mm body 2010-08-18
HXQFN60U plastic thermal enhanced extremely thin quad flat package; no leads; 60 terminals; UTLP based - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2010-04-09
HXQFN60U plastic compatible thermal enhanced extremely thin quad flat package; no leads; 60 terminals 2011-08-22
HXQFN60U plastic, thermal enhanced extremely thin quad flat package; 60 terminals; 0.5 mm pitch; 4 mm x 6 mm x 0.5 mm body - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2009-01-22
HXQFN60U plastic, compatible thermal enhanced extremely thin quad flat package; 60 terminals; 0.5 mm pitch; 4 mm x 6 mm x 0.5 mm body 2011-08-22
BGA420 plastic ball grid array package; 420 balls - - -(EIAJ);MS-034(JEDEC);144E(IEC) 2009-05-20
BGA582 plastic ball grid array package; 582 balls, 1 mm pitch, 27 mm x 27 mm x 1.87 mm body MS-034 Compliant(JEDEC) 2009-05-26
BGA806 plastic ball grid array package; 806 balls MS-034 Compliant(JEDEC) 2009-05-26
LFBGA385 plastic low profile fine-pitch ball grid array package; 385 balls - - -(JEDEC) 2009-05-25
HBGA543 plastic thermal enhanced ball grid array package; 543 balls; heatsink - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2009-08-03
LFBGA417 plastic low profile fine-pitch ball grid array package; 417 balls 2009-06-19
HVQFN42 plastic thermal enhanced very thin quad flat package; no leads; 42 terminals 2009-08-28
TFBGA385 plastic thin fine-pitch ball grid array package; 385 balls - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2009-08-18
HXSON16U plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals;UTLP based - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2009-10-02
HBGA404 HBGA404, plastic thermal enhanced ball grid array; 404 balls; 1 mm pitch, 23 mm x 23 mm x 1.75 mm body MS-034(JEDEC);144E(IEC) 2017-06-14
BGA708 plastic ball grid array package; 708 balls MS-034D Compliant(EIAJ);MS-034D Compliant(JEDEC);MS-034D Compliant(IEC) 2010-10-19
BGA596 plastic ball grid array package; 596 balls (EIAJ);(JEDEC);IEC 2009-10-19
HBGA640 plastic thermal enhanced ball grid array package; 640 balls; heatsink MS-034D compliant(JEDEC) 2009-10-19
HVQFN32R plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; resin based - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2009-11-16
BGA456 plastic ball grid array package; 456 balls MS-034D compliant(JEDEC) 2009-11-16
DBSMS27P plastic dual bent surface mounted SIL power package; 27 leads 2013-02-13
TFBGA48 TFBAG48, plastic thin fine-pitch ball grid array package; 48 balls, 0.5 mm pitch, 4.5 mm x 4.5 mm x 0.8 mm body 2009-11-27
TFBGA48 plastic thin fine-pitch ball grid array package; 48 balls 2013-06-19
DFN2521-12 plastic, thermal enhanced extremely thin small outline package; 12 terminals; 0.4 mm pitch; 2.5 mm x 2.1 mm x 0.5 mm body - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2010-09-17
DFN1712-8 plastic, thermal enhanced extremely thin small outline package; 8 terminals; 0.4 mm pitch; 1.7 mm x 1.2 mm x 0.5 mm body - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2009-12-17
DFN2512-12 plastic, thermal enhanced extremely thin small outline package; 12 terminals; 0.4 mm pitch; 2.5 mm x 1.2 mm x 0.5 mm body - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2009-12-17
DFN3312-16 plastic, thermal enhanced extremely thin small outline package; 16 terminals; 0.4 mm pitch; 3.3 mm x 1.2 mm x 0.5 mm body - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2009-12-17
SFM8 rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; 8 gold-plated in-line leads (EIAJ);(JEDEC);IEC 2004-02-04
SFM7 rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC; 7 SN-plated in-line leads 2005-11-11
SFM9 rectangular single-ended package; aluminium flange; 2 vertical mounting holes;2 x 6-32 UNC and 2 extra horizontal mounting holes; 9 gold-plated in-line leads 2004-02-04
SFM7 rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads 2004-02-04
SFM7 rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads 2012-09-14
SFO8 rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; optical input; 8 gold-plated in-line leads 2004-02-04
SFO8 rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; optical input with connector; 8 gold-plated in-line leads 1999-04-13
SFO8 rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; optical input with connector; 8 gold-plated in-line leads 2004-02-04
SFO8 rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; optical input with connector; 8 gold-plated in-line leads 2004-02-05
DIP22 DIP22, plastic dual in-line package; 22 leads, 2.54 mm pitch, 27.94 mm x 8.7 mm x 3.81 mm body MS-010(JEDEC);060G07(IEC) 1999-12-27
XQFN10 plastic, extremely thin quad flat package; no leads; 10 terminals; 0.4 mm pitch; 1.4 mm x 1.8 mm x 0.5 mm body 2009-12-29
XQFN10 plastic, extremely thin quad flat package; no leads; 10 terminals; body 1.8 x 1.4 x 0.5 mm 2014-03-10
XQFN16 plastic, extermely thin quad flat package; 16 terminals; 0.4 mm pitch; 1.8 mm x 2.6 mm x 0.5 mm body 2009-12-29
XQFN16 XQFN16, plastic, extremely thin quad flat package; no leads; 16 terminals; 2.6 mm x 1.8 mm x 0.50 mm body 2017-01-24
BGA582 plastic ball grid array package; 582 balls MS-034D Compliant(JEDEC) 2009-12-29
HBGA360 plastic, thermal enhanced ball grid array package; 360 balls; heatsink - - -(EIAJ);MS-034(JEDEC);144E(IEC) 2010-01-22
BGA360 plastic ball grid array package; 360 balls - - -(EIAJ);MS-034(JEDEC);144E(IEC) 2010-01-22
DFN2510-10 plastic, extremely thin small outline package; 10 terminals; 0.5 mm pitch; 2.5 mm x 1 mm x 0.5 mm body - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2013-02-18
DFN1714-8 plastic, thermal enhanced ultra thin small outline package; 8 terminals; 0.4 mm pitch; 1.7 mm x 1.35 mm x 0.55 mm body - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2010-03-22
DFN2514-12 plastic, thermal enhanced ultra thin small outline package; 12 terminals; 0.4 mm pitch; 2.5 mm x 1.35 mm x 0.55 mm body - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2010-03-22
HUSON6 plastic, thermal enhanced ultra thin small outline package; 16 terminals; 0.4 mm pitch; 3.3 mm x 1.35 mm x 0.55 mm body - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2010-03-22
LFBGA256 plastic low profile fine-pitch ball grid array package; 256 balls 2010-03-01
DIP28 plastic, dual in-line package; 28 leads; 2.54 mm body; 35.7 mm x 13.8 mm x 5.1 mm body SC-510-28(EIAJ);MO-015(JEDEC);051G05(IEC) 2003-02-13
DIP28 plastic dual in-line package; 28 leads (600 mil); long body SC-510-28(EIAJ);MS-011(JEDEC);051G06(IEC) 2003-03-12
DIP28 plastic, dual in-line package; 2.54 mm pitch, 13.9 mm x 36.85 mm x 3.81 mm body 2017-03-21
DIP28 DIP28, plastic, dual in-line package; 28 terminals; 2.54 mm pitch; 13.97 mm x 36.83 mm x 5.08 mm body E-PDIP-T28(JEDEC) 2017-06-11
HTSSOP28 plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad - - -(EIAJ);MO-153(JEDEC);- - -(IEC) 2010-03-31
HTSSOP28 plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad MO-153(JEDEC) 2010-07-13
HTSSOP28 plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad MO-153(JEDEC) 2013-09-12
HTSSOP28 HTSSOP28, plastic, thermal enhanced thin shrink small outline package; 28 terminals; 0.65 mm pitch; 4.4 mm x 9.7 mm x 1 mm body TS-PDSO-G28(JEDEC) 2017-06-11
HVQFN64R plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; resin based - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2010-04-02
XQFN12 plastic, extremely thin quad flat package; 12 terminals; 0.4 mm pitch; 1.7 mm x 2 mm x 0.5 mm body MO-288(JEDEC) 2010-04-21
SO7 plastic small outline package; 7 leads; body width 3.9 mm - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2010-04-21
DFN2510A-10 plastic, extremely thin small outline package; 10 terminals; 0.5 mm pitch; 2.5 mm x 1 mm x 0.5 mm body - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2010-06-22
XSON10 plastic extremely thin small outline package; no leads; 10 terminals - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2010-11-08
DFN2110-9 plastic, extremely thin small outline package; 9 terminals; 0.4 mm pitch; 2.1 mm x 1 mm x 0.5 mm body - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2010-06-03
HVSON12 plastic thermal enhanced very thin small outline package; no leads; 12 terminals; body 4 x 6 x 0.85 mm ---(EIAJ);---(JEDEC);---IEC 2008-09-24
HWQFN32 plastic thermal enhanced very very thin quad flat package; no leads; 32 terminals 2010-08-05
HTQFP48 plastic thermal enhanced thin quad flat package; 48 leads; exposed die pad - - -(EIAJ);MS-026(JEDEC);- - -(IEC) 2010-08-04
HTQFP48 HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 10 mm x 10 mm x 1 mm; exposed die pad MS-026(JEDEC) 2012-10-23
HXQFN16 plastic thermal enhanced extremely thin quad flat package; no leads; 16 terminals - - -(EIAJ);- - -(IEC) 2010-09-16
HXQFN16 plastic thermal enhanced extremely thin quad flat package; no leads; 16 terminals - - -(EIAJ);- - -(IEC) 2010-07-29
HSOP14 plastic, heatsink small outline package; 14 leads - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2010-08-10
HVQFN32 HVQFN32: plastic termal enhanced very thin quad flat package; no leads; 32 terminals 2010-08-09
HSOP14F plastic, heatsink small outline package; 14 leads (flat) - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2010-09-20
XSON8 Plastic extremely thin small outline package; no leads; 8 terminals - - -(EIAJ);MO-229(JEDEC);- - -(IEC) 2010-10-07
SIL4 plastic, single in-line package 2010-10-04
SIL4 SIL4, plastic single in-line package, 4 terminals, 1.8 mm pitch, 11 mm x 7.4 mm x 1.95 mm body 2018-03-16
HXSON6 plastic, thermal enhanced extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1.6 mm x 1.6 mm x 0.5 mm body 2018-08-14
LFBGA144 plastic low profile fine-pitch ball grid array package; 144 balls, 0.8 mm pitch, 10 mm x 10 mm x 1 mm body MO-205(JEDEC) 2013-01-10
LFBGA144 plastic low profile fine-pitch ball grid array package; 144 balls - - -(EIAJ);MO-205(JEDEC) 2010-12-30
XQFN10 plastic, extremely thin quad flat package; no leads; 10 terminals - - -(EIAJ);MO255(JEDEC);- - -(IEC) 2010-12-06
HXSON4 plastic, thermal enhanced extremely thin small outline package; 4 terminals; 0.65 mm pitch; 1 mm x 1 mm x 0.5 mm body - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2011-01-20
XQFN8 Plastic, extremely thin quad flat package; no leads; 8 terminals - - -(EIAJ);MO-255(JEDEC);- - -(IEC) 2010-11-02
XQFN8 plastic, extremely thin quad flat package; no leads; 8 terminals - - -(EIAJ);MO-255(JEDEC);- - -(IEC) 2011-01-17
DFN1010C-4 plastic, thermal enhanced ultra thin small outline package; 4 terminals; 0.65 mm pitch; 1 mm x 1 mm x 0.55 mm body - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2011-01-25
SO12 SO12: plastic small outline package; 12 leads; body width 3.9 mm - - -(EIAJ);MS-012 Compliant(JEDEC);- - -(IEC) 2011-02-16
HXSON10 plastic, thermal enhanced extremely thin small outline package; 10 terminals; 0.5 mm pitch; 2.6 mm x 2.6 mm x 0.5 mm body 2011-01-20
HVQFN54R plastic thermal enhanced very thin quad flat package; no leads; 54 terminals; resin based - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2011-01-20
VFBGA24 plastic very thin fine-pitch ball grid array package; 24 balls 2011-02-16
XSON6 plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 1 mm x 1mm x 0.35 mm body 2010-04-06
X2SON6 X2SON6, plastic super thin small outline package; no leads; 6 terminals; 1.0 mm x 1.0 mm x 0.32 mm body 2018-03-08
XSON8 plastic, extremely thin small outline package; 8 terminals; 0.55 mm pitch; 1.35 mm x 1 mm x 0.35 mm body 2010-04-06
LFPAK56D plastic, single ended surface mounted package (LFPAK56D); 8 leads; 1.27 mm pitch; 4.7 mm x 5.3 mm x 1.05 mm body ---(EIAJ);---(JEDEC);---(IEC) 2014-10-28
SIL2 SIL2, plastic single in-line package; 2 terminals (EIAJ);(JEDEC);IEC 2016-03-07
HXSON6 plastic thermal enhanced super thin small outline package; no leads; 6 terminals; body 2 x 1.3 x 0.35 mm 2014-10-10
CRPM4 studded ceramic package; 4 leads 1999-03-29
LFPAK33 Plastic, single ended surface mounted package (LFPAK33); 8 leads; 0.65 mm pitch; 2.7 mm x 3.4 mm x 0.9 mm body 2016-08-09
DFN1010D-3 plastic, thermal enhanced ultra thin small outline package; 3 terminals; 0.75 mm pitch; 1.1 mm x 1 mm x 0.37 mm body 2013-03-06
DFN1010B-6 plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.75 mm pitch; 1.1 mm x 1 mm x 0.37 mm body 2013-03-06
DFN2020MD-6 plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body 2012-05-03
HSOP6 plastic, heatsink small outline package; 6 leads 2012-07-02
HSOP6 plastic, heatsink small outline package; 6 leads 2015-06-08
DFN1612-8 plastic, extremely thin small outline package; 8 terminals; 0.4 mm pitch; 1.6 mm x 1.2 mm x 0.4 mm body 2012-07-24
X2SON5 plastic, thermal enhanced extremely thin small outline package; no leads; 5 terminals; 0.48 mm pitch; 0.8 mm x 0.8 mm x 0.35 mm body 2012-04-18
X2SON5 plastic thermal enhanced extremely thin small outline package; no leads; 5 terminals 2012-04-05
XSON6 plastic, extremely thin small outline package; 6 terminals; 0.4 mm pitch; 1.2 mm x 1.2 mm x 0.4 mm body 2013-06-26
CRPM4 studded ceramic package; 4 leads 1999-03-29
CRPM4 studded ceramic package; 4 leads 1999-03-29
XSON6 plastic very thin small outline package; no leads; 6 terminals; body 1.1 x 0.9 x 0.47 mm 2013-01-08
XSON6 XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1.1 x 0.7 x 0.37 mm 2013-11-08
XSON6 plastic flip-chip quad flat package; no leads; 6 terminals; body 1.1 x 0.7 x 0.37 mm 2014-08-29
X2SON plastic, thermal enhanced extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1.35 mm x 0.8 mm x 0.35 mm body 2016-04-21
HX2SON6 plastic, thermal enhanced super thin small outline package; no leads; 6 terminals; 0.4 mm pitch, 1.4 mm x 1.2 mm x 0.32 mm body 2017-09-01
QFP80 QFP80, plastic, quad flat package; 80 terminals; 0.65 mm pitch; 14 mm x 14 mm x 2.2 mm body (SPC-PAE143-001 )(JEDEC) 2017-06-11
LFPAK88 Plastic, single-ended surface-mounted package (LFPAK88; Power-SO8); 4 leads 2016-06-02
LFPAK88D Plastic, single-ended surface-mounted package (LFPAK88D; Power-SO8); 4 leads 2016-06-02
LDMOST Earless flanged LDMOST ceramic package; 6 leads 2015-03-03
DFM8 Plastic earless flanged cavity package; 6 leads 2013-05-24
DPAK plastic, thermal enhanced small outline package (DFN56 AD); 8 Leads; 1.27 mm pitch; 6 mm x 5 mm x 0.9 mm body 2014-11-06
X2SON plastic, thermal enhanced extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 0.8 mm x 0.35 mm body 2015-07-22
TO3P Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO3P 2014-10-22
HX2SON plastic, thermal enhanced super thin small outline package; no leads; 8 terminals; body 1.5 x 1.5 x 0.3 mm 2014-06-11
SOT1261 plastic, thermal enhanced super thin quad flat package; no leads; 12 terminals; body 2.0 x 2.0 x 0.3 mm 2014-06-20
SOT1263 Microlead ultra small surface-mounted plastic package; 3 leads - - -(JEDEC) 2011-03-22
DFN1412-6 plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.5 mm pitch; 1.4 mm x 1.2 mm x 0.47 mm body 2016-09-02
SIP3 Plastic single-ended multi-chip package; 6 interconnections; 3 in-line leads 2016-08-02
SIP3 Plastic single-ended multi-chip package; 6 interconnections; 3 in-line leads 2013-08-05
SIL3 Plastic single-ended package; 6 interconnections; 3 in-line leads, 2.54 mm pitch 2019-02-15
CFP15 plastic, thermal enhanced ultra thin SMD package; 3 terminals; 2.13 mm pitch; 5.8 x 4.3 x 0.78 mm body ---(EIAJ);---(JEDEC);---(IEC) 2014-04-29
DIP40 plastic dual in-line package; 40 leads (600 mil) SC-511-40(EIAJ);MO-015(JEDEC);051G08(IEC) 2003-02-13
DIP40 DIP40, plastic, dual in-line package; 40 terminals; 2.54 mm pitch; 13.97 mm x 52.07 mm x 5.08 mm body E-PDIP-T40(JEDEC) 2017-06-11
SOT1290 SMAN2, plastic single-ended multi-chip package; magnetized ferrite (2 mm x 3 mm x 1 mm); 2 in-line leads 2019-06-14
SOT1291 SMAN2, plastic single-ended multi-chip package; magnetized trenched ferrite (3.8 mm x 6.15 mm x 3.6 mm); 2 in-line leads 2019-06-14
HLQFN16R plastic thermal enhanced low profile quad flat package; no leads; 16 terminals ---(EIAJ);---(JEDEC);---(IEC) 2011-08-30
FBGA196 plastic fine-pitch ball grid array package; 196 balls MO-205(JEDEC) 2011-02-22
HLQFN56R plastic thermal enhanced low profile quad flat package; no leads; 56 terminals; resin based - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2011-03-16
HLQFP176 plastic thermal enhanced low profile quad flat package, 176 terminals, 0.4 mm pitch, 20 mm x 20 mm x 1.4 mm body MS-026(JEDEC) 2011-04-20
HSOP44 HSOP44: plastic, heatsink small outline package; 44 leads; low stand-off height ---(EIAJ);---(JEDEC);---(IEC) 2011-05-31
HSOP44 HSOP44, plastic, thermal enhanced small outline package; 44 terminals; 0.65 mm pitch; 15.9 mm x 11 mm x 3 mm body PDSO-G44(JEDEC) 2017-06-11
VFBGA64 Plastic very thin fine-pitch ball grid array package; 64 balls ---(EIAJ);---(JEDEC);---(IEC) 2011-06-10
VFBGA64 plastic very thin fine-pitch ball grid array package; 64 balls; ---(EIAJ);---(JEDEC);---(IEC) 2011-06-16
VFBGA64 VFBGA64, plastic very thin fine-pitch ball grid array package; 64 balls; 0.5 mm pitch, 4.5 mm x 4.5 mm x 0.80 mm body 2018-12-10
HVSON16 Plastic thermal enhanced very thin small outline package; no leads; 16 terminals MO-229(JEDEC) 2011-07-04
HVSON16 HVSON16, plastic thermal enhanced very thin small outline package; no leads;16 terminals; 0.65 mm pitch, 3.5 mm x 5.5 mm x 0.85 mm body MO-229(JEDEC) 2015-09-08
XQFN8 plastic, extremely thin quad flat package; no leads MO-255(JEDEC) 2011-08-23
SIL9P plastic single in-line power package; 9 leads 2003-03-12
XQFN24 plastic, extremely thin quad flat package; no leads; 0.4 mm pitch; 3.4 mm x 2.5 mm x 0.5 mm body MO-288(JEDEC) 2011-08-22
SO8 Plastic small outline package; 8 leads 2011-08-18
SO8 SO8, plastic, small outline package; 8 terminals; 1.27 mm pitch; 5.28 mm x 5.3 mm x 2.05 mm body E-PDSO-G8(JEDEC) 2017-06-11
HXSON4 HXSON4: plastic thermal enhanced extremely thin small outline package; no leads; 4 terminals; body 2.0 mm x 1.5 mm x 0.5 mm 2012-11-05
HLQFP208 plastic thermal enhanced low profile quad flat package: 208 leads ---(EIAJ);MS-026(JEDEC);---(IEC) 2011-11-04
HLQFP208 HLQFP208, plastic, thermal enhanced low profile quad flat package; 208 terminals; 0.5 mm pitch; 28 mm x 28 mm x 1.4 mm body 2017-06-11
VSON4 plastic very thin small outline package; no leads; 4 terminals ---(EIAJ);---(JEDEC);---(IEC) 2011-11-04
LFBGA170 plastic low profile fine-pitch ball grid array package; 170 balls ---(EIAJ);MO-205(JEDEC);---(IEC) 2011-11-04
LQFP48 plastic low profile quad flat package; 48 leads; body 10 x 10 x 1.4 mm 2011-11-03
HTQFN80R plastic thermal enhanced thin quad flat package; no leads; 80 terminals; resin based; body 12 x 12 x 1.1 mm 2012-10-30
HXQFN32 plastic thermal enhanced extremely thin quad flat package; no leads; 32 terminals 2014-05-08
VFBGA49 plastic very thin fine-pitch ball grid array package; 49 balls 2012-01-05
TFBGA132 plastic thin fine-pitch ball grid array package; 132 balls MO-205(JEDEC) 2012-01-25
LFBGA223 plastic low profile fine-pitch ball grid array package; 223 balls, 0.65 mm pitch, 12 mm x 12 mm x 1.3 mm body MO-205(JEDEC) 2012-01-25
VSON4 plastic very thin small outline package; no leads; 4 terminals 2012-03-08
FBGA144 plastic fine-pitch ball grid array package; 144 balls MO-205(JEDEC) 2012-03-08
HVSON10 plastic thermal enhanced very thin small outline package; no leads; 10 terminals MO-229(JEDEC) 2012-04-17
HWSON8 HWSON8: plastic thermal enhanced very very thin small outline package; no leads; 8 terminals MO-229(JEDEC) 2012-04-17
TFBGA80 plastic thin fine-pitch ball grid array package; 80 balls 2012-07-02
TFBGA100 plastic thin fine-pitch ball grid array package; 100 balls 2012-07-02
SO14 plastic small outline package; 14 leads 2012-07-13
HTSSOP38 plastic thermal enhanced thin shrink small outline package; 38 leads; body with 4.4 mm; lead pitch 0.5 mm; exposed die pad 2012-09-21
LFBGA267 plastic low profile fine-pitch ball grid array package; 267 balls 2012-09-20
DFN2520-9 plastic, extremely thin small outline package; 9 terminals; 0.5 mm pitch; 2 mm x 2.5 mm x 0.5 mm body MO-252(JEDEC) 2013-05-01
DFN4020-14 plastic, extremely thin small outline package; 14 terminals; 0.5 mm pitch; 2 mm x 4 mm x 0.5 mm body MO-252(JEDEC) 2013-05-01
HVQFN16 plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm 2012-09-21
TFBGA64 plastic thin fine-pitch ball grid array package; 64 balls 2012-09-25
XQFN10 plastic, extremely thin small outline package; 10 terminals; 0.4 mm pitch; 1.3 mm x 1.6 mm x 0.5 mm body MO-288(JEDEC) 2012-09-11
HXSON6 plastic extremely thin small outline package; no leads; 6 terminals; body 2.0 x 2.0 x 0.5 mm 2012-09-20
LFBGA217 plastic low profile fine-pitch ball grid array package; 217 balls MO-205(JEDEC) 2012-09-20
HXSON4 plastic extremely thin small outline package; no leads; 4 terminals; body 1.6 x 1.2 x 0.5 mm (EIAJ);(JEDEC);IEC 2012-09-10
XSON16 plastic extremely thin small outline package; no leads; 16 terminals; body 2.5 x 3.2 x 0.5 mm MO-252(JEDEC) 2013-02-13
XFBGA24 plastic, extremely thin fine-pitch ball grid array package; 24 balls 2012-09-25
TFBGA484 plastic thin fine-pitch ball grid array package; 484 balls, 0.65 mm pitch, 15 mm x 15 mm x 1.2 mm body 2012-11-26
UFLGA53R plastic fine-pitch land grid array package; 53 lands 2012-11-28
TFBGA50 plastic thin fine-pitch ball grid array package; 50 balls MO-195(JEDEC) 2013-07-17
XQFN20 plastic extremely thin small outline package; no leads; 20 terminals; body 2.00 x 2.70 x 0.40 mm - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2013-05-16
DIP8 plastic dual in-line package; 7 leads (300 mil) MO-001(JEDEC);076E03(IEC) 2013-01-21
HXSON6 plastic, thermal enhanced extremely thin small outline package; no leads; 6 terminals; body 2.0 x 2.0 x 0.5 mm 2015-05-15
WFBGA32 plastic very-very-thin profile fine-pitch ball grid array package; 32 balls 2013-02-21
UFLGA49 plastic ultra thin fine-pitch land grid array package; 49 lands 2013-06-04
TSOP6 plastic surface-mounted package (TSOP6); 6 leads SC-74(EIAJ) 2013-04-18
XFBGA16 plastic, extremely thin fine-pitch ball grid array package; 16 balls 2013-08-27
X2QFN X2QFN12: plastic, super thin quad flat package; no leads; 12 terminals; body 1.6 x 1.6 x 0.35 mm 2014-01-13
XSON7 plastic, extremely thin small outline package; 7 terminals; 0.5 mm pitch; 1.1 mm x 2.1 mm x 0.5 mm body 2013-09-12
HVFLGA Plastic thermal enhanced very thin profile fine pitch land grid array package; 36 terminals, 0.4 mm pitch, 5 mm x 5 mm x 0.72 mm body 2015-01-27
HVLGA HVLGA36, plastic thermal enchanced very thin profile land grid array package; 36 terminals; 5 mm x 5 mm x 0.72 mm body 2017-03-28
SO28 plastic, small outline package; 28 leads; 1.27 mm pitch; 17.9 mm x 7.5 mm x 2.65 mm body MS-013(JEDEC);075E06(IEC) 2003-02-19
SO28 SO28, plastic, small outline package; 28 terminals; 1.27 mm pitch; 7.5 mm x 17.93 mm x 2.35 mm body E-PDSO-G28(JEDEC) 2017-06-11
HVSON20 plastic thermal enhanced extremely thin quad flat package; no leads; 20 terminals; body 3.5 mm x 5.5 mm x 0.85 mm 2015-07-06
HVSON plastic thermal enhanced extremely thin quad flat package; no leads; 20 terminals; body 3.5 x 5.5 x 0.85 mm 2015-05-11
UFBGA24 UFBGA24: plastic ultra thin fine-pitch ball grid array package; 24 balls 2013-11-07
HWSON4 HWSON4: plastic thermal enhanced very very thin small outline package; no leads; 4 terminals; body 2.0 x 2.0 x 0.75 mm - - -(EIAJ);MO-229(JEDEC);- - -(IEC) 2013-11-20
WFBGA171 WFBGA171: plastic very-very-thin profile fine-pitch ball grid array package; 171 balls 2014-04-01
TFBGA48 Plastic thin fine-pitch ball grid array package; 48 balls, 0.65 mm pitch, 3 mm x 8 mm x 1.05 mm body 2014-08-12
HVQFN40 plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 5 mm x 5 mm x 0.85 mm 2015-01-08
HVQFN40 plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 5 mm x 5 mm x 0.85 mm 2016-05-18
HVQFN40 HVQFN40, plastic, thermally enhanced very thin quad flat, non-leaded package; 40 terminals; 0.4 mm pitch; 5 mm x 5 mm x 0.85 mm body 2018-11-19
SO24 plastic, small outline package; 24 leads; 1.27 mm pitch; 15.4 mm x 7.5 mm x 2.65 mm body MS-013(JEDEC);075E05(IEC) 2003-02-19
SO24 SO24, plastic, small outline package; 24 terminals; 1.27 mm pitch; 7.5 mm x 15.4 mm x 2.35 mm body E-PDSO-G24(JEDEC) 2017-06-11
SOT1372 plastic thermal enhanced very thin small package; no leads; 8 terminals; body 3 x 2 x 0.35 mm 2014-05-20
SOT1373 plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad 2014-05-20
WLCSP4 WLCSP4, wafer level chip-scale package, 4 terminals, 1.03 mm x 0.94 mm x 0.5 mm body 2016-04-26
WLCSP4 WLCSP4, wafer level chip-scale package, 4 terminals, 1.31 mm x 0.94 mm x 0.5 mm body 2018-11-30
WLCSP4 WLCSP4, wafer level chip-scale package; 4 bumps; 0.97 mm x 0.97 mm x 0.54 mm body (backside coating included) 2017-08-22
WLCSP6 WLCSP6, wafer level chip scale package, 6 terminals, 0.22 mm pitch, 0.66 mm x 0.45 mm x 0.23 mm body 2018-11-20
WLCSP6 wafer level chip-scale package; 6 bumps; 0.69 mm x 1.09 mm x 0.38 mm 2016-11-24
WLCSP6 WLCSP6, , wafer level chip-size package; 6 terminals; 0.4 mm pitch; 1.22 mm x 0.85 mm x 0.6 mm body 2017-06-11
WLCSP9 WLCSP9, wafer level chip-scale package; 9 bumps; 1.50 mm x 1.28 mm x 0.60 mm body 2017-03-03
WLCSP9 wafer level chip-scale package; 9 bumps; 1.24 mm x 1.24 mm x 0.525 mm body (backside coating included) 2018-08-08
WLCSP9 WLCSP9, wafer level chip-scale package; 9 bumps; 0.5 mm pitch, 1.49 mm x 1.49 mm x 0.555 mm body (backside coating included) 2018-03-06
WLCSP12 WLCSP12, wafer level chip scale package; 12 bumps; 0.4 mm pitch; 1.36 mm x 1.66 mm x 0.51 mm body (backside coating included) 2017-09-09
WLCSP12 WLCSP12, wafer level chip-scale package, 12 terminals, 0.4 mm pitch, 1.97 mm x 1.42 mm x 0.525 mm body 2018-06-19
WLCSP12 wafer level chip-scale package, 12 bumps 2016-03-02
WLCSP12 WLCSP12, wafer level chip-scale package; 12 bumps; 1.62 mm x 1.43 mm x 0.525 mm (backside coating included) 2017-01-11
WLCSP12 WLCSP12, wafer level chip-scale package; 12 bumps; 1.67 mm x 1.27 mm x 0.525 mm (backside coating included) 2017-04-24
WLCSP12 WLCSP12, wafer level chip scale package; 12 bumps; 0.4 mm pitch; 1.65 mm x 1.25 mm x 0.525 mm body (backside coating included) 2017-10-23
WLCSP wafer level chip-scale package; 15 bumps; 2.56 x 1.54 x 0.555 mm (Backside coating included) 2015-08-11
WLCSP16 WLCSP16, wafer level chip-scale package; 16 bumps; 1.84 mm x 1.84 mm x 0.5 mm body 2018-02-09
WLCSP16 wafer level chip-scale package; 16 bumps; 2.05 x 2.05 x 0.555 mm (Backside coating included) 2016-08-29
WLCSP16 WLCSP16, wafer level chip-scale package, 16 bumps, 2.20 mm x 2.20 mm x 0.555 mm body (backside coating included) 2018-03-12
WLCSP20 WLCSP20, wafer level chip-size package; 20 terminals; 0.4 mm pitch; 2 mm x 1.61 mm x 0.56 mm body NON-JEDEC(JEDEC) 2017-06-11
WLCSP20 WLCSP20, wafer level chip-size package; 20 terminals; 0.4 mm pitch; 1.94 mm x 1.99 mm x 0.6 mm body 2017-06-11
WLCSP20 wafer level chip-scale package, 20 bumps 2016-04-26
WLCSP20 WLCSP20, wafer level chip-size package; 20 terminals; 0.4 mm pitch; 2 mm x 1.61 mm x 0.32 mm body 2017-06-11
WLCSP20 WLCSP20, wafer level chip-scale package; 20 bumps; 1.70 mm x 2.16 mm x 0.525 mm body (backside coating included) 2017-01-19
WLCSP25 WLCSP25, wafer level chip-scale package; 25 bumps; 0.4 mm pitch, 2.09 mm x 2.09 mm x 0.525 mm body 2017-12-04
WLCSP20 WLCSP20, wafer level chip-scale package; 20 bumps; 0.4 mm pitch, 2.50 mm x 1.84 mm x 0.5 mm body 2018-05-24
WLCSP24 WLCSP24, wafer level chip-scale package; 24 bumps; 2.98 mm x 1.90 mm x 0.525 mm body (backside coating included) 2017-06-22
WLCSP25 wafer level chip-scale package, 25 balls; 2.51 mm x 2.51 mm x 0.5 mm body 2015-10-05
WLCSP25 WLCSP25, wafer level chip-scale package, 25 bumps, 2.27 mm x 2.17 mm x 0.62 mm 2017-05-12
WLCSP25 WLCSP25, wafer level chip-scale package, 25 bumps, 2.555 mm x 2.525 mm x 0.368 mm body (backside coating included) 2017-05-12
WLCSP25 wafer level chip-scale package, 25 balls; 0.4 mm pitch, 2.09 mm x 2.09 mm x 0.525 mm body 2018-08-03
WLCSP34 wafer level chip-scale package, 34 bumps 2016-08-08
WLCSP36 WLCSP 36 2.4*2.5*.6 P.35 2017-06-11
WLCSP wafer level chip-scale package; 36 bumps; 2.07 x 2.07x 0.42 mm 2016-04-26
SOT1408 plastic, super thin quad flat package; no leads; 12 terminals; body 2.10 x 1.25 x 0.35 mm MO-255(JEDEC) 2015-01-19
DBS13P plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm) 2003-03-12
DBS13P plastic DIL-bent-SIL power package; 13 leads (lead length 7.7 mm) 2003-03-12
WLCSP12 WLCSP12, wafer level chip scape package, 12 terminals, 1.58 mm x 2.15 mm x 0.22 mm body 2010-09-27
SIL9MP plastic single in-line medium power package; 9 leads 2003-03-12
WLCSP9 WLCSP9, wafer level chip scape package, 9 terminals, 1.89 mm x 1.22 mm x 0.22 mm body 2013-07-16
WLCSP9 WLCSP9, wafer level chip scape package, 9 terminals, 1.89 mm x 1.22 mm x 0.17 mm body 2013-07-16
HUQFN32 plastic thermal enhanced ultra thin quad flat package; no leads; 32 terminals; body 5 mm x 5 mm x 0.56 mm 2014-08-07
HUQFN32 QFN 32 5*5*0.65 P0.5 2017-06-11
LFBGA159 plastic low profile fine-pitch ball grid array package; 159 balls 2014-07-26
HVQFN plastic thermal enhanced very thin quad flat package; no leads; 27 terminals; body 5 x 5 x 0.85 mm 2014-10-14
HSOP6F plastic, heatsink small outline package; 6 leads(flat) 2014-10-30
X2QFN plastic extremely thin small outline package; no leads; 10 terminals; body 1.6 x 1.3 x 0.33 mm 2015-02-10
HVFLGA44 Plastic, thermal enhanced very thin profile fine pitch land grid array package; 44 terminals, 0.4 mm pitch, 5 mm x 5 mm x 0.72 mm body 2016-08-12
TFBGA plastic thin fine-pitch ball grid array package; 321 balls 2014-11-17
HX2QFN plastic, thermal enhanced super thin quad flat package; no leads; 16 terminals; body 2.0 x 2.0 x 0.3 mm 2015-03-05
HX2SON plastic, thermal enhanced super thin small outline package; no leads; 10 terminals; 0.35 mm pitch, 2.0 mm x 1.7 mm x 0.3 mm body 2015-05-21
SO10 plastic small outline package; 10 leads; body width 3.9 mm; body thickness 1.35 mm 2015-03-06
HVSON plastic thermal enhanced extremely thin quad flat package; no leads; 28 terminals; body 3.5 x 7.5 x 0.85 2015-07-31
VFBGA40 plastic very thin fine-pitch ball grid array package; 40 balls 2015-04-02
SOT143B plastic, surface-mounted package; 4 leads; 1.9 mm pitch; 2.9 mm x 1.3 mm x 1 mm body 2006-03-16
SOT143R plastic surface-mounted package; reverse pinning; 4 leads SC-61AA(EIAJ) 2006-03-16
PMFP8 plastic micro flat package; 8 leads (straight) 2003-03-12
WLCSP49 WLCSP49, wafer level chip-size package; 49 terminals; 0.054 mm pitch; 3.14 mm x 2.92 mm x 0.56 mm body 2017-06-11
DHXQFN plastic dual in-line compatible thermal enhanced super-thin quad flat package; no leads; 18 terminals; body 2.4 x 2.0 x 0.35 mm 2016-02-15
WLCSP wafer level chip-scale package; 30 bumps; 2.26 x 2.56 x 0.51 mm (backside coating included) 2015-06-11
WLCSP wafer level chip-scale package; 30 bumps; 2.06 x 2.72 x 0.525 mm (Backside coating included) 2016-04-26
WLCSP30 wafer level chip-scale package; 30 bumps; 0.4 mm pitch, 2.44 mm x 2.2 mm x 0.5 mm body (backside coating included) 2019-04-26
WLCSP30 wafer level chip-scale package; 30 bumps; 0.4 mm pitch, 2.44 mm x 2.2 mm x 0.525 mm body (backside coating included) 2019-04-16
WLCSP WLCSP49, wafer level chip-scale package; 49 bumps; 2.97 mm x 3.37 mm x 0.56 mm (backside coating included) 2017-01-06
WLCSP49 WLCSP49, wafer level chip-scale package; 49 bumps; 3.3 mm x 3.3 mm x 0.525 mm body (Backside coating included) 2018-08-22
WLCSP49 WLCSP49, wafer level chip-scale package, 49 terminals, 0.4 mm pitch, 2.915 mm x 3.142 mm x 0.564 mm body 2018-04-20
WLCSP wafer level chip-scale package; 49 bumps; 2.98 x 3.43 x 0.56 mm 2015-07-21
WLCSP wafer level chip-scale package; 49 bumps; 2.98 x 3.43 x 0.56 mm (Backside coating included) 2015-07-21
WLCSP49 WLCSP49, wafer level chip-scale package; 49 bumps; 3.44 mm x 3.44 mm x 0.525 mm (Backside coating included) 2016-04-26
WLCSP wafer level chip-scale package; 49 bumps; 2.97 x 3.37 x 0.5 mm 2016-04-26
WLCSP wafer level chip-scale package; 49 bumps; 2.97 x 3.37 x 0.525 mm 2016-04-26
WLCSP49 wafer level chip-scale package; 49 bumps; 3.13 x 3.63 x 0.5 mm 2016-08-09
WLCSP wafer level chip-scale package; 49 bumps; 3.19 mm x 3.19 mm x 0.49 mm 2016-04-26
WLCSP wafer level chip-scale package; 6 bumps; 0.69 x 0.44 x 0.29 mm 2016-07-11
WLCSP wafer level chip-scale package; 6 bumps; 0.69 mm x 0.44 mm x 0.29 mm 2016-12-06
WLCSP6 WLCSP6, wafer level chip scale package, 6 terminals, 0.25 mm pitch, 0.7 mm x 0.45 mm x 0.23 mm body 2018-08-23
HVQFN plastic thermal enhanced very thin quad flat package; no leads; 184 terminals; body 12 x 12 x 0.85 mm 2015-07-29
WLCSP99 wafer level chip-scale package; 99 bumps; 4.37 x 3.82 x 0.5 mm 2015-06-26
WLCSP wafer level chip-scale package; 99 bumps; 4.37 x 3.82 x 0.525 mm (Backside coating included) 2015-10-09
WLCSP29 WLCSP29, wafer level chip-size package; 29 bumps; 3.19 mm x 2.07 mm x 0.6 mm body 2017-06-14
WLCSP WLCSP29, wafer level chip-scale package; 29 bumps; 3.19 mm x 2.07 mm x 0.6 mm (backside coating included) 2017-01-11
WLCSP100 WLCSP100, wafer level chip-scale package; 100 bumps; 5.07 mm x 5.07 mm x 0.53 mm body 2018-03-06
WLCSP11 wafer level chip-scale package, 11 bumps 2016-03-02
WLCSP8 wafer level chip-scale package, 8 bumps 2016-03-02
WLCSP6 wafer level chip-scale package, 6 bumps 2016-03-02
WFBGA155 plastic very-very-thin fine-pitch ball grid array package; 155 balls, 0.5 mm pitch, 7.5 mm x 7.5 mm x 0.76 mm body 2016-04-06
WFBGA155 plastic very-very-thin fine-pitch ball grid array package; 155 balls, 0.5 mm pitch, 7.5 mm x 7.5 mm x 0.62 mm body 2018-12-12
LFBGA364 plastic low profile fine-pitch ball grid array package, 364 balls 2016-03-02
DHX2QFN plastic dual in-line compatible thermal enchanged super thin quad flat package; no leads; 14 terminals; body 1.5 x 2.1 x 0.32 mm 2015-11-10
WLCSP42 wafer level chip-scale package; 42 bumps; 2.88 mm x 2.80 mm x 0.54 mm (Backside coating included) 2016-09-01
WLCSP wafer level chip-scale package; 42 bumps; 3.13 x 2.46 x 0.5 mm (backside coating included) 2016-04-26
WLCSP wafer level chip-scale package; 42 bumps; 3.13 x 2.46 x 0.525 mm 2016-04-26
WLCSP WLCSP42, wafer level chip-scale package; 42 bumps; 2.91 mm x 2.51 mm x 0.525 mm body (backside coating included) 2017-07-28
DIP20 plastic, dual in-line package; 20 leads; 2.54 mm pitch; 26.1 mm x 6.35 mm x 4.2 mm body SC-603(EIAJ);MS-001(JEDEC) 2003-02-13
DIP20 DIP20, plastic, dual in-line package; 20 terminals; 2.54 mm pitch; 7.28 mm x 24.69 mm x 5.08 mm body E-PDIP-T20(JEDEC) 2017-06-11
DIP20 DIP20, plastic, dual in-line package; 20 terminals; 2.54 mm pitch; 25.9 mm x 6.6 mm x 3.9 mm body 2018-08-08
WLCSP WLCSP13, wafer level chip-size package; 13 bumps, 0.4 mm pitch, 2.74 mm x 2.80 mm x 0.38 mm body 2016-08-08
WLCSP WLCSP13, wafer level chip-scale package; 13 bumps; 1.19 mm x 1.99 mm x 0.5 mm body 2017-02-23
HQFN plastic thermal enhanced quad flat package; no leads; 20 terminals; body 8.0 mm x 8.0 mm x 2.1 mm 2015-10-12
HQFN plastic thermal enhanced quad flat package; no leads; 20 terminals; body 8.0 mm x 8.0 mm x 2.1 mm 2015-10-13
HQFN plastic thermal enhanced quad flat package; no leads; 20 terminals; body 8.0 mm x 8.0 mm x 2.1 mm 2015-10-13
WLCSP wafer level chip-scale package, 46 bumps 2016-03-02
WLCSP6 WLCSP6, wafer level chip-scale package, 6 bumps, 0.19 mm pitch, 0.57 mm x 0.43 mm x 0.28 mm body 2016-04-25
WLCSP31 wafer level chip-scale package, 31 bumps 2016-04-26
WLCSP31 wafer level chip-scale package, 31 bumps 2016-03-02
TFBGA plastic thin fine-pitch ball grid array package; 144 balls 2016-04-21
HLQFP64 HLQFP64, plastic, thermal enhanced low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body; 4.9 mm x 4.9 mm exposed pad MS-026 BCD(JEDEC) 2018-08-07
HLQFP64 HLQFP64, plastic, thermal enhanced low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body MS-026 BCD(JEDEC) 2018-07-24
HLQFP64 HLQFP64, plastic, thermal enhanced low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body FL-PQFP-G64(JEDEC) 2017-06-11
HLQFP64 plastic, thermal enhanced low profile quad flat package; 64 leads; body 10 x 10 x 1.5 mm 2016-07-12
HQFP64 HQFP64, plastic, thermal enhanced quad flatpack; no leads; 64 terminals; 0.65 mm pitch; 14 mm x 14 mm x 2.7 mm body PQFP-G64(JEDEC) 2017-06-11
LFBGA400 LFBGA400, plastic, low profile fine-pitch ball grid array; 400 balls; 0.8 mm pitch; 17 mm x 17 mm x 1.12 mm body PBGA-B400(JEDEC) 2017-06-11
LFBGA400 LFBGA400, plastic, low profile fine-pitch ball grid array; 400 balls; 0.8 mm pitch; 17 mm x 17 mm x 1.18 mm body 2016-02-01
BGA208 plastic, ball grid array; 208 bumps; 1.0 mm pitch; 17 mm x 17 mm x 1.15 mm body 2016-07-05
LFBGA404 LFBGA404, plastic, low profile fine-pitch ball grid array; 404 balls; 0.65 mm pitch; 17 mm x 17 mm x 1.02 mm body T-PBGA-B404(JEDEC) 2017-06-11
LFBGA404 LFBGA404, plastic, low profile fine-pitch ball grid array; 404 balls; 0.65 mm pitch; 17 mm x 17 mm x 1.32 mm body 2018-03-15
LFBGA289 LFBGA289, plastic, low profile fine-pitch ball grid array; 289 balls; 0.8 mm pitch; 17 mm x 17 mm x 1.6 mm body PBGA-B289(JEDEC) 2017-06-11
LFBGA292 LFBGA292, plastic, low profile fine-pitch ball grid array; 292 balls; 0.8 mm pitch; 17 mm x 17 mm x 1.7 mm body PBGA-B289(JEDEC) 2017-06-11
LFBGA364 LFBGA364, plastic, low profile fine-pitch ball grid array; 364 bumps; 0.8 mm pitch; 17 mm x 17 mm x 1.33 mm body MO-275 -MMAC-1(JEDEC) 2016-01-08
LFBGA364 LFBGA364, plastic, low profile fine-pitch ball grid array; 363 balls; 0.8 mm pitch; 17 mm x 17 mm x 1.54 mm body 2017-06-11
LFBGA364 LFBGA364, plastic, low profile fine-pitch ball grid array; 364 balls; 0.8 mm pitch; 17 mm x 17 mm x 1.45 mm body 2017-06-11
LFBGA252 LFBGA252, plastic, low profile fine-pitch ball grid array; 252 balls; 0.8 mm pitch; 17 mm x 17 mm x 1.54 mm body 2017-06-11
LFBGA356 LFBGA356; plastic, low profile fine-pitch ball grid array; 356 bumps; 0.8 mm pitch; 17 mm x 17 mm x 1.54 mm body 2019-06-25
LFBGA292 LFBGA292, plastic, low profile fine-pitch ball grid array; 292 balls; 0.8 mm pitch; 17 mm x 17 mm x 1.46 mm body 2017-06-11
BGA208 BGA208, plastic, ball grid array; 208 balls; 1 mm pitch; 17 mm x 17 mm x 1.57 mm body 2017-06-11
HTQFP128 HTQFP128, plastic, thermal enhanced thin quad flat package; 128 terminals; 0.4 mm pitch; 14 mm x 14 mm x 1 mm body TS-PQFP-G128(JEDEC) 2017-06-11
LFBGA473 LFBGA473, plastic, low profile fine-pitch ball grid array; 473 balls; 0.8 mm pitch; 19 mm x 19 mm x 1.12 mm body PBGA-B473(JEDEC) 2017-06-11
LFBGA473 LFBGA473, plastic, low profile fine-pitch ball grid array; 473 balls; 0.8 mm pitch; 19 mm x 19 mm x 1.18 mm body 2017-06-11
FBGA484 FBGA484, plastic, fine-pitch ball grid array; 484 balls; 0.8 mm pitch; 19 mm x 19 mm x 1.62 mm body 2017-06-11
LFBGA541 LFBGA541, plastic, low profile fine-pitch ball grid array; 541 balls; 0.75 mm pitch; 19 mm x 19 mm x 1.33 mm body 2017-06-11
LFBGA529 LFBGA529, plastic, low profile fine-pitch ball grid array; 529 balls; 0.8 mm pitch; 19 mm x 19 mm x 1.37 mm body 2017-06-11
LFBGA529 LFBGA529, plastic, low profile fine-pitch ball grid array; 529 balls; 0.8 mm pitch; 19 mm x 19 mm x 1.12 mm body 2017-06-11
LFBGA529 LFBGA529, plastic, low profile fine-pitch ball grid array; 529 balls; 0.8 mm pitch; 19 mm x 19 mm x 1.25 mm body MO-275 PPAC-1(JEDEC) 2018-07-13
BGA516 BGA516, plastic, ball grid array; 516 balls; 1 mm pitch; 27 mm x 27 mm x 1.83 mm body R-PDSO-G8(JEDEC) 2017-06-11
BGA516 BGA516, plastic, ball grid array; 516 bumps; 1.0 mm pitch; 27 mm x 27 mm x 2.25 mm body 2016-01-20
BGA416 BGA416, plastic, ball grid array; 416 bumps; 1.0 mm pitch; 27 mm x 27 mm x 2.02 mm body 2017-03-27
LFBGA624 LFBGA624, plastic, low profile fine-pitch ball grid array; 624 bumps; 0.8 mm pitch; 21 mm x 21 mm x 1.6 mm body 2016-01-08
LFBGA369 LFBGA369, plastic, low profile fine-pitch ball grid array; 369 balls; 0.8 mm pitch; 19 mm x 19 mm x 1.61 mm body 2017-06-11
LFBGA489 LFBGA489, plastic, low profile fine-pitch ball grid array; 489 balls; 0.8 mm pitch; 19 mm x 19 mm x 1.61 mm body 2017-06-11
LFBGA121 LFBGA121, plastic, low profile fine-pitch ball grid array; 121 bumps; 0.65 mm pitch; 8 mm x 8 mm x 1.38 mm body 2016-01-07
LFBGA121 LFBGA121, plastic, low profile fine-pitch ball grid array; 121 bumps; 0.65 mm pitch; 8 mm x 8 mm x 1.3 mm body 2016-01-08
LFBGA289 LFBGA289, plastic, low profile fine-pitch ball grid array; 289 balls; 0.8 mm pitch; 14 mm x 14 mm x 1.37 mm body 2016-01-07
LFBGA289 LFBGA289, plastic, low profile fine-pitch ball grid array; 289 balls; 0.8 mm pitch; 14 mm x 14 mm x 1.18 mm body 2017-06-11
LFBGA289 LFBGA289, plastic, low profile fine-pitch ball grid array; 289 balls; 0.8 mm pitch; 14 mm x 14 mm x 1.37 mm body 2018-03-15
LBGA144 LBGA144; plastic, low profile ball grid array; 144 balls; 1.0 mm pitch; 13 mm x 13 mm x 1.7 mm body 2016-01-06
LBGA144 MAPBGA 144 13*13*1.6 P1 2017-06-11
LFBGA280 LFBGA280, plastic, low profile fine-pitch ball grid array; 280 balls; 0.65 mm pitch; 13 mm x 13 mm x 1.02 mm body 2016-01-29
LFBGA289 LFBGA289, plastic, low profile fine-pitch ball grid array; 289 balls; 0.65 mm pitch; 14 mm x 14 mm x 1.18 mm body PBGA-B289(JEDEC) 2017-06-11
LFBGA496 LFBGA496, plastic, low profile fine-pitch ball grid array; 496 balls; 0.5 mm pitch; 15 mm x 15 mm x 1.34 mm body PBGA-B496(JEDEC) 2017-06-11
LFBGA457 LFBGA457, plastic, low profile fine-pitch ball grid array; 457 balls; 0.5 mm pitch; 14 mm x 14 mm x 0.96 mm body PBGA-B457(JEDEC) 2017-06-11
TFBGA452 TFBGA452, plastic, thin fine-pitch ball grid array; 452 balls; 0.4 mm pitch; 11 mm x 11 mm x 1.2 mm body PBGA-B452(JEDEC) 2017-06-11
LFBGA169 LFBGA169, plastic, low profile fine-pitch ball grid array; 169 balls; 0.8 mm pitch; 11 mm x 11 mm x 1.02 mm body 2017-06-11
BGA160 BGA160, plastic, ball grid array; 160 balls; 1 mm pitch; 15 mm x 15 mm x 1.18 mm body PBGA-B160(JEDEC) 2017-06-11
LFBGA104 LFBGA104, plastic, low profile fine-pitch ball grid array; 104 balls; 0.8 mm pitch; 10 mm x 10 mm x 1.1 mm body PBGA-B104(JEDEC) 2017-06-11
LFBGA527 LFBGA527, plastic, low profile fine-pitch ball grid array; 527 balls; 0.5 mm pitch; 13 mm x 13 mm x 0.96 mm body 2017-06-11
LFBGA196 LFBGA196, plastic, low profile fine-pitch ball grid array; 196 balls; 0.65 mm pitch; 10 mm x 10 mm x 1.52 mm body 2017-06-11
LFBGA196 LFBGA196, plastic, low profile fine-pitch ball grid array; 196 balls; 0.65 mm pitch; 10 mm x 10 mm x 1.3 mm body 2017-06-01
LFBGA257 LFBGA257, plastic, low profile fine-pitch ball grid array package; 257 balls; 0.8 mm pitch; 14 mm x 14 mm x 1.35 mm body MO-275A -JJAC-1(JEDEC) 2016-01-05
LFBGA257 LFBGA257, plastic, low profile fine-pitch ball grid array package; 257 balls; 0.8 mm pitch; 14 mm x 14 mm x 1.45 mm body MO-275A -JJAC-1(JEDEC) 2019-07-18
LFBGA257 LFBGA257, plastic, low profile fine-pitch ball grid array package; 257 balls; 0.8 mm pitch; 14 mm x 14 mm x 1.37 mm body 2019-06-20
LFBGA416 LFBGA416, plastic, low profile fine-pitch ball grid array; 416 balls; 0.5 mm pitch; 13 mm x 13 mm x 1.52 mm body 2017-06-11
HVQFN48R HVQFN48R, plastic, thermal enhanced very thin quad flatpack; no leads; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 0.98 mm body 2017-06-11
VFBGA520S VFBGA520S, plastic, very thin fine-pitch ball grid array; 520 balls; 0.4 mm pitch; 12 mm x 12 mm x 1 mm body 2017-06-11
LFBGA206 LFBGA206, plastic, low profile fine-pitch ball grid array; 206 balls; 0.8 mm pitch; 13 mm x 13 mm x 1.6 mm body 2017-06-11
VFLGA60 VFLGA60, plastic, very thin fine-pitch land grid array package; 60 balls; 0.5 mm pitch; 8 mm x 8 mm x 0.91 mm body 2017-06-11
LFBGA206 LFBGA206, plastic, low profile fine-pitch ball grid array; 206 balls; 0.5 mm pitch; 8 mm x 8 mm x 1.25 mm body 2017-06-11
LFBGA130 MAPBGA 130 8*8*1.25 P0.5 2017-06-11
LFBGA64 LFBGA64, plastic, low profile fine-pitch ball grid array; 64 bumps; 0.5 mm pitch; 5 mm x 5 mm x 1.23 mm body 2016-01-08
TFBGA432 TFBGA432, plastic, thin fine-pitch ball grid array; 432 balls; 0.5 mm pitch; 13 mm x 13 mm x 1.1 mm body 2017-06-11
XFBGA121 XFBGA121, plastic, extremely thin fine-pitch ball grid array; 121 bumps; 0.65 mm pitch; 8 mm x 8 mm x 0.43 mm body 2016-01-12
XFBGA36 MAPBGA 36 3.5*3.5*.5 P.5 2017-06-11
LFBGA400 LFBGA400, plastic, low profile fine-pitch ball grid array; 400 balls; 0.65 mm pitch; 14 mm x 14 mm x 1.165 mm body 2017-06-11
LFBGA121 LFBGA121, plastic, low profile fine-pitch ball grid array; 121 balls; 0.8 mm pitch; 10 mm x 10 mm x 1.02 mm body T-PBGA-B121(JEDEC) 2017-06-11
TFBGA185 TFBGA185, plastic, thin fine-pitch ball grid array; 185 balls; 0.5 mm pitch; 10 mm x 10 mm x 0.92 mm body 2017-06-11
TFBGA247 TFBGA247, plastic, thin fine-pitch ball grid array; 247 balls; 0.5 mm pitch; 10 mm x 10 mm x 0.92 mm body T-PBGA-B247(JEDEC) 2017-06-11
LBGA81 LBGA81, plastic, low profile ball grid array; 81 balls; 1 mm pitch; 10 mm x 10 mm x 1.52 mm body PBGA-B81(JEDEC) 2017-06-11
TFBGA139 MAPBGA 139 7*7*0.7P0.5 2017-06-11
TFBGA338 TFBGA338, plastic, thin fine-pitch ball grid array; 338 balls; 0.706 mm pitch; 11 mm x 11 mm x 0.92 mm body 2017-06-11
LFBGA225 LFBGA225, plastic, low profile fine-pitch ball grid array; 225 balls; 0.8 mm pitch; 13 mm x 13 mm x 1.6 mm body PBGA-B225(JEDEC) 2017-06-11
BGA196 BGA196, plastic, ball grid array; 196 balls; 1 mm pitch; 15 mm x 15 mm x 1.18 mm body PBGA-B196(JEDEC) 2017-06-11
LBGA100 LBGA100, plastic, low profile ball grid array; 100 balls; 1 mm pitch; 11 mm x 11 mm x 1.27 mm body PBGA-B100(JEDEC) 2017-06-11
DBS9P plastic DIL-bent-SIL power package; 9 leads (lead length 12 mm) 2003-03-12
DBS9P plastic DIL-bent-SIL power package; 9 leads (lead length 7.7 mm) 2003-03-12
HLQFP100 HLQFP100, plastic, thermal enhanced low profile quad flat package; 100 terminals; 0.50 mm pitch; 14 mm x 14 mm x 1.6 mm body 2016-01-08
HLQFP100 HLQFP100, plastic, thermal enhanced low profile quad flat package; 100 terminals; 0.50 mm pitch; 14 mm x 14 mm x 1.6 mm body 2017-03-27
HLQFP100 HLQFP100, plastic, thermal enhanced low profile quad flat package; 100 terminals; 0.50 mm pitch; 14 mm x 14 mm x 1.4 mm body 2018-03-02
HLQFP48 HLQFP48, plastic, thermal enhanced low profile quad flat package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1.4 mm body MS-026-BBC(JEDEC) 2017-12-14
HLQFP48 HLQFP48, plastic, thermal enhanced low profile quad flat package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1.4 mm body MS-026 BBC(JEDEC) 2017-06-11
HLQFP48 HLQFP48, plastic, thermal enhanced low profile quad flat package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1.4 mm body MS-026 BBC(JEDEC) 2017-06-11
HLQFP48 HLQFP48, plastic, thermal enhanced low profile quad flat package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1.4 mm body 2017-06-11
HLQFP48 plastic, thermal enhanced low profile quad flat package; 48 leads; body 7 x 7 x 1.5 mm 2016-07-14
HLQFP48 HLQFP48, plastic, thermal enhanced low profile quad flat package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1.4 mm body; 4.4 mm x 4.4 mm exposed pad 2018-07-19
HLQFP48 plastic, thermal enhanced low profile quad flat package; 48 leads; 0.5 mm pitch, 7 mm x 7 mm x 1.4 mm body MS-026 BBC(JEDEC) 2017-08-28
HLQFP48 HLQFP48, plastic, thermal enhanced low profile quad flat package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1.4 mm body MS-026 BBC(JEDEC) 2018-03-01
HLQFP80 HLQFP80, plastic, thermal enhanced, low profile quad; flat leaded package; 80 terminals; 0.5 mm pitch; 12 mm x 12 mm x 1.4 mm body 2017-03-27
HQFN16 HQFN16, plastic, thermal enhanced quad flatpack; no leads; 16 terminals; 0.8 mm pitch; 4 mm x 4 mm x 1.98 mm body 2018-01-17
HQFN16 plastic, thermally enhanced quad flat non-leaded package; 16 terminals; 1.0 mm pitch; 6 mm x 6 mm x 1.98 mm body 2016-01-06
HQFN16 QFN16EP 6SQ*1.98P1.0 2017-06-11
HQFN plastic, thermally enhanced quad; flat non-leaded package; 16 terminals; 1.0 mm pitch; 6 mm x 6 mm x 1.98 mm body 2016-06-06
HQFN24 plastic thermally enhanced quad flat non-leaded package; 24 terminals; 1.0 mm pitch; 7 mm x 7 mm x 2.2 mm body 2016-01-08
HQFN32 HQFN32, plastic, thermally enhanced quad; flat non-leaded package; 32 terminals; 0.65 mm pitch; 9 mm x 9 mm x 2.5 mm body 2017-03-22
HSOP30 HSOP30, plastic, thermal enhanced small outline package; 30 terminals; 0.8 mm pitch; 11 mm x 15.9 mm x 3 mm body PDSO-G30(JEDEC) 2017-06-11
HSOP36 HSOP36, plastic, thermal enhanced small outline package; 36 terminals; 0.65 mm pitch; 11 mm x 15.9 mm x 3.6 mm body HS-PDSO-G36(JEDEC) 2017-06-11
HVQFN32 HVQFN32, plastic, thermal enhanced very thin quad flatpack; no leads; 32 terminals; 0.5 mm pitch; 7 mm x 7 mm x 0.85 mm body H-PQFP-N32(JEDEC) 2017-06-11
VSO40 plastic very small outline package; 40 leads 2003-02-19
VSO40 plastic very small outline package; 40 leads; face down 2003-02-19
HTQFP176 HTQFP176, plastic, thermal enhanced thin quad flat package; 176 terminals; 0.5 mm pitch; 24 mm x 24 mm x 1 mm body N/A(JEDEC) 2017-06-11
HUQFN16 QFN 16 3*3*0.65 P0.5 2017-06-11
HUQFN16 QFN-EP 16 3*3*0.65 P0.5 2017-06-11
HUQFN16 HUQFN16, plastic, thermal enhanced ultra thin quad flatpack; no leads; 16 terminals; 0.5 mm pitch; 3 mm x 3 mm x 0.58 mm body 2017-06-11
HUQFN20 HUQFN20, plastic, thermal enhanced ultra thin quad flatpack; no leads; 20 terminals; 0.4 mm pitch; 3 mm x 3 mm x 0.65 mm body 2017-06-11
HUQFN20 HUQFN20, plastic, thermal enhanced ultra thin quad flatpack; no leads; 20 terminals; 0.4 mm pitch; 3 mm x 3 mm x 0.58 mm body 2017-06-11
HUQFN20 HUQFN20, plastic, thermal enhanced ultra thin quad flatpack; no leads; 20 terminals; 0.5 mm pitch; 4 mm x 3 mm x 0.65 mm body 2017-06-11
HUQFN20 HUQFN20, plastic, thermal enhanced ultra thin quad flatpack; no leads; 20 terminals; 0.5 mm pitch; 4 mm x 3 mm x 0.65 mm body 2018-07-16
HUQFN24 HUQFN24, plastic, thermally enhanced; ultra thin quad; flat non-leaded package; 24 terminals; 0.5 mm pitch; 4 mm x 4 mm x 0.65 mm body 2017-03-27
HUQFN24 HUQFN24, plastic, thermal enhanced ultra thin quad flat non-leaded package; 24 terminals; 0.5 mm pitch; 4 mm x 4 mm x 0.65 mm body 2018-07-12
HUQFN48 QFN MAP 48 7*7*0.65 P0.5 2017-06-11
HUSON12 HUSON12, plastic, thermal enhanced ultra thin small outline; no leads; 12 terminals; 0.4 mm pitch; 3 mm x 3 mm x 0.6 mm body HF-PDSO-N12(JEDEC) 2017-06-11
HUSON6 HUSON6, plastic, thermal enhanced ultra thin small outline; no leads; 6 terminals; 0.5 mm pitch; 2 mm x 1.5 mm x 0.6 mm body NON JEDEC(JEDEC) 2017-06-11
HUSON8 HUSON8, plastic, thermal enhanced ultra thin small outline; no leads; 8 terminals; 0.5 mm pitch; 2 mm x 2 mm x 0.6 mm body NON JEDEC(JEDEC) 2017-06-11
HUSON8 QFN-D 8 EP 2*3*0.65P0.5 2017-06-11
HUSON8 HUSON8, plastic, thermal enhanced ultra thin small outline; no leads; 8 terminals; 0.5 mm pitch; 3 mm x 2 mm x 0.65 mm body 2017-08-29
HVQFN16 QFN 16 EP 3SQ*1.0P0.5 2017-06-11
HVQFN16 HVQFN16, plastic, thermal enhanced very thin quad flatpack; no leads; 16 terminals; 0.5 mm pitch; 3 mm x 3 mm x 0.85 mm body 2018-08-01
HVQFN16 HVQFN16, plastic, thermal enhanced very thin quad flatpack; no leads; 16 terminals; 0.65 mm pitch; 4 mm x 4 mm x 0.9 mm body NON-JEDEC(JEDEC) 2017-06-11
HVQFN16 HVQFN16, plastic, thermal enhanced very thin quad flatpack; no leads; 16 terminals; 0.8 mm pitch; 5 mm x 5 mm x 0.9 mm body 2017-06-11
HVQFN24 HVQFN24, plastic, thermal enhanced very thin quad flatpack; no leads; 24 terminals; 0.65 mm pitch; 5 mm x 5 mm x 0.9 mm body 2017-06-11
HVQFN32 HVQFN32, plastic, thermal enhanced very thin quad flatpack; no leads; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 0.9 mm body 2017-06-11
HVQFN32 HVQFN32, plastic, thermal enhanced very thin quad flatpack; no leads; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 1 mm body 2017-06-11
HVQFN32 HVQFN32, plastic, thermal enhanced very thin quad flatpack; no leads; 32 terminals; 0.4 mm pitch; 4 mm x 4 mm x 0.9 mm body 2017-06-11
HVQFN32 plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 4 x 4 x 0.85 mm 2016-03-04
LFBGA169 MAPBGA 169 9*9*1.3 P0.65 2017-06-11
LFBGA169 LFBGA169, plastic, low profile fine-pitch ball grid array; 169 balls; 0.65 mm pitch; 9 mm x 9 mm x 1.11 mm body 2017-06-11
LFBGA272 LFBGA272, plastic, low profile fine-pitch ball grid array; 272 balls; 0.5 mm pitch; 9 mm x 9 mm x 1.11 mm body 2017-06-11
USON8 USON8, plastic, ultra thin small outline package; no leads; 8 terminals; 0.5 mm pitch; 2 mm x 2 mm x 0.65 mm body MO-252(JEDEC) 2017-06-11
HVSON8 HVSON8, plastic, thermal enhanced very thin small outline; no leads; 8 terminals; 0.65 mm pitch; 3 mm x 3 mm x 0.9 mm body 2017-06-11
CBGA1023 CBGA1023, ceramic, ball grid array; 1023 balls; 1 mm pitch; 33 mm x 33 mm x 2.77 mm body CBGA-B1023(JEDEC) 2017-06-11
CBGA1023 CBGA1023, ceramic, ball grid array; 1023 balls; 1 mm pitch; 33 mm x 33 mm x 2.97 mm body CBGA-B1023(JEDEC) 2017-06-11
CBGA255 CBGA255, ceramic, ball grid array; 255 balls; 1.27 mm pitch; 21 mm x 21 mm x 3 mm body CBGA-B255(JEDEC) 2017-06-11
CBGA360 CBGA360, ceramic, ball grid array; 360 balls; 1.27 mm pitch; 25 mm x 25 mm x 3.2 mm body CBGA-B360(JEDEC) 2017-06-11
CBGA360 CBGA360, ceramic, ball grid array; 360 balls; 1.27 mm pitch; 25 mm x 25 mm x 2.8 mm body CBGA-B360(JEDEC) 2017-06-11
CBGA360 CBGA360, ceramic, ball grid array; 360 balls; 1.27 mm pitch; 25 mm x 25 mm x 2.4 mm body CBGA-B360(JEDEC) 2017-06-11
CBGA360 CBGA360, ceramic, ball grid array; 360 balls; 1.27 mm pitch; 25 mm x 25 mm x 2.8 mm body CBGA-B360(JEDEC) 2017-06-11
CBGA360 CBGA360, ceramic, ball grid array; 360 balls; 1.27 mm pitch; 25 mm x 25 mm x 2.8 mm body CBGA-B360(JEDEC) 2017-06-11
CBGA360 CBGA360, ceramic, ball grid array; 360 balls; 1.27 mm pitch; 25 mm x 25 mm x 3.2 mm body CBGA-B360(JEDEC) 2017-06-11
CBGA483 CBGA483, ceramic, ball grid array; 483 balls; 1.27 mm pitch; 29 mm x 29 mm x 3.2 mm body E-CBGA-B483(JEDEC) 2017-06-11
CBGA783 CBGA783, ceramic, ball grid array; 783 balls; 1 mm pitch; 29 mm x 29 mm x 3.38 mm body PBGA-B783(JEDEC) 2017-06-11
CFBGA483 CFBGA483, ceramic, fine-pitch ball grid array; 483 balls; 1.27 mm pitch; 29 mm x 29 mm x 3.1 mm body E-CBGA-B483(JEDEC) 2017-06-11
CFBGA994 CFBGA994, ceramic, fine-pitch ball grid array; 994 balls; 1 mm pitch; 33 mm x 33 mm x 2.77 mm body CBGA-B994(JEDEC) 2017-06-11
CFBGA994 CFBGA994, ceramic, fine-pitch ball grid array; 994 balls; 1 mm pitch; 33 mm x 33 mm x 2.97 mm body CBGA-B994(JEDEC) 2017-06-11
CLGA360 CLGA360, ceramic, land grid array; 360 balls; 1.27 mm pitch; 25 mm x 25 mm x 2.2 mm body CBGA-N360(JEDEC) 2017-06-11
CLGA360 CLGA360, ceramic, land grid array; 360 balls; 1.27 mm pitch; 25 mm x 25 mm x 2.2 mm body CBGA-N360(JEDEC) 2017-06-11
CLGA360 CLGA360, ceramic, land grid array; 360 balls; 1.27 mm pitch; 25 mm x 25 mm x 1.8 mm body CBGA-N360(JEDEC) 2017-06-11
CLGA483 CLGA483, ceramic, land grid array; 483 lands; 1.27 mm pitch; 29 mm x 29 mm x 2.2 mm body 2017-06-11
CQFP144 CQFP144, ceramic, quad flat package; 144 terminals; 0.65 mm pitch; 26.75 mm x 26.75 mm x 3.5 mm body CQFP-G144(JEDEC) 2017-06-11
CQFP184 CQFP184, ceramic, quad flat package; 184 terminals; 0.65 mm pitch; 31 mm x 31 mm x 3.5 mm body CQFP-G184(JEDEC) 2017-06-11
VSON10 VSON10, plastic, very thin small outline, no leads; 10 terminals; 0.4 mm pitch; 2 mm x 2 mm x 0.85 mm body 2017-06-11
VSON10 VSON10, plastic, very thin small outline, no leads; 10 terminals; 0.4 mm pitch; 2 mm x 2 mm x 0.95 mm body 2017-06-11
VSON10 VSON10, plastic, very thin small outline package, no leads; 10 terminals; 0.4 mm pitch; 2 mm x 2 mm x 0.95 mm body 2017-06-11
VSON10 VSON10, plastic, very thin small outline package, no leads; 10 terminals; 0.5 mm pitch; 3 mm x 3 mm x 0.5 mm body NJR(JEDEC) 2017-06-11
BGA1020 BGA1020, plastic, ball grid array; 1020 balls; 1 mm pitch; 33 mm x 33 mm x 2.78 mm body 2017-06-11
BGA1023 BGA1023, plastic, ball grid array; 1023 balls; 1 mm pitch; 33 mm x 33 mm x 2.75 mm body PBGA-B1023(JEDEC) 2017-06-11
BGA1023 BGA1023, plastic, ball grid array; 1023 balls; 1 mm pitch; 33 mm x 33 mm x 3.38 mm body NONE(JEDEC) 2017-06-11
SO16 plastic, small outline package; 16 leads; 1.27 mm pitch; 10.2 mm x 7.5 mm x 2.65 mm body MS-013(JEDEC);075E03(IEC) 2003-02-19
SO16 SO16, plastic, small outline package; 16 terminals; 1.27 mm pitch; 7.5 mm x 10.3 mm x 2.4 mm body E-PDSO-G16(JEDEC) 2017-06-11
BGA1023 BGA1023, plastic, ball grid array; 1023 balls; 1 mm pitch; 33 mm x 33 mm x 3.13 mm body 2017-06-11
BGA575 BGA575, plastic, ball grid array; 575 balls; 1 mm pitch; 25 mm x 25 mm x 2.75 mm body PBGA-B575(JEDEC) 2017-06-11
BGA783 BGA783, plastic, ball grid array; 783 balls; 1 mm pitch; 29 mm x 29 mm x 3.75 mm body 2015-12-17
BGA783 BGA783, plastic, ball grid array; 783 balls; 1 mm pitch; 29 mm x 29 mm x 2.7 mm body PBGA-B783(JEDEC) 2017-06-11
BGA783 BGA783, plastic, ball grid array; 783 balls; 1 mm pitch; 29 mm x 29 mm x 2.76 mm body MS-034B AAM-1(JEDEC) 2015-12-22
BGA783 BGA783, plastic, ball grid array; 783 balls; 1 mm pitch; 29 mm x 29 mm x 2.8 mm body 2016-01-04
BGA783 BGA783, plastic, ball grid array; 783 balls; 1 mm pitch; 29 mm x 29 mm x 3.85 mm body PBGA-B783(JEDEC) 2017-06-11
BGA783 BGA783, plastic, ball grid array; 783 balls; 1 mm pitch; 29 mm x 29 mm x 3.58 mm body MS-034(JEDEC) 2015-12-22
BGA783 plastic, ball grid array; 783 bumps; 1.0 mm pitch; 29 mm x 29 mm x 3.13 mm body 2016-01-11
FBGA431 FBGA431, plastic, fine-pitch ball grid array; 431 balls; 0.8 mm pitch; 20 mm x 20 mm x 3.3 mm body PBGA-B431(JEDEC) 2017-06-11
HBGA620 HBGA620, plastic, thermal enhanced ball grid array; 620 balls; 1 mm pitch; 29 mm x 29 mm x 2.46 mm body MS-034 AAM-1(JEDEC) 2016-02-01
HUQFN20 HUQFN20, plastic, thermal enhanced ultra thin quad flatpack; no leads; 20 terminals; 0.4 mm pitch; 3 mm x 3 mm x 0.6 mm body 2017-06-11
BGA1295 plastic, ball grid array; 1295 bumps; 1.0 mm pitch; 37.5 mm x 37.5 mm x 3.19 mm body MS-034(JEDEC) 2015-12-24
SO20 plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body MS-013(JEDEC);075E04(IEC) 2003-02-19
SO20 SO20, plastic, small outline package; 20 terminals; 1.27 mm pitch; 7.5 mm x 12.82 mm x 3.55 mm body R-PDSO-G20(JEDEC) 2017-06-11
SO plastic, small outline; leaded package; 20 terminals; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body 2016-08-25
HQFN16 HQFN16, plastic, thermal enhanced quad flat package, no leads; 16 terminals; 0.9 mm pitch; 12 mm x 12 mm x 2.1 mm body I-PQFP-N16(JEDEC) 2017-06-11
HQFN16 HQFN16, plastic, thermal enhanced quad flat package, no leads; 16 terminals; 0.9 mm pitch; 12 mm x 12 mm x 2.1 mm body 2018-05-22
HQFN36 HQFN36, plastic, thermal enhanced quad flatpack; no leads; 36 terminals; 0.8 mm pitch; 12 mm x 12 mm x 2.1 mm body I-PQFP-N36(JEDEC) 2017-06-11
HQFN24 HQFN24, plastic, thermal enhanced quad flatpack; no leads; 24 terminals; 0.8 mm pitch; 12 mm x 12 mm x 2.1 mm body I-PQFP-N24(JEDEC) 2017-06-11
HQFN24 HQFN24, plastic, thermal enhanced quad flatpack; no leads; 24 terminals; 0.9 mm pitch; 12 mm x 12 mm x 2.1 mm body 2016-01-08
HQFN23 HQFN23; plastic, thermally enhanced quad; flat non-leaded package; 23 terminals; 0.9 mm pitch; 12 mm x 12 mm x 2.1 mm body 2016-01-21
HQFN23 HQFN23, plastic, thermal enhanced quad flatpack; no leads; 23 terminals; 0.8 mm pitch; 12 mm x 12 mm x 2.1 mm body NA(JEDEC) 2017-06-11
HQFN16 HQFN16, plastic, thermal enhanced quad flatpack; no leads; 16 terminals; 0.8 mm pitch; 12 mm x 12 mm x 2.1 mm body I-PQFP-N16(JEDEC) 2017-06-11
HQFN24 HQFN24, plastic, thermal enhanced quad flatpack; no leads; terminals; 0.8 mm pitch; 12 mm x 12 mm x 2.1 mm body I-PQFP-N24(JEDEC) 2016-03-14
HQFN24 HQFN24, plastic, thermal enhanced quad flatpack; no leads; terminals; 0.8 mm pitch; 12 mm x 12 mm x 2.1 mm body 2016-03-14
HQFN16 HQFN16, plastic, thermal enhanced quad flatpack; no leads; 16 terminals; 0.8 mm pitch; 5 mm x 5 mm x 2.1 mm body PQFP-N16(JEDEC) 2017-06-11
HQFN PWR QFN 32 8SQ*2.1P0.8 2017-06-11
BGA456 BGA456, plastic, ball grid array; 456 balls; 1.27 mm pitch; 35 mm x 35 mm x 2.59 mm body PBGA-B456(JEDEC) 2017-06-11
PGA241 PGA241, plastic, pin grid array; 241 pins; 2.54 mm pitch; 47.2 mm x 47.2 mm x 3.18 mm body PPGA-P241(JEDEC) 2017-06-11
BGA360 BGA360, plastic, ball grid array; 360 balls; 1.27 mm pitch; 25 mm x 25 mm x 2.77 mm body E-PBGA-B360(JEDEC) 2017-06-11
BGA255 BGA255, plastic, ball grid array; 255 balls; 1.27 mm pitch; 21 mm x 21 mm x 2.8 mm body E-PBGA-B255(JEDEC) 2017-06-11
HVQFN44R MAPLGA 44 5*5*0.9 P0.65 2017-06-11
FBGA780 FBGA780, plastic, fine-pitch ball grid array; 780 bumps; 0.8 mm pitch; 23 mm x 23 mm x 2.36 mm body 2017-03-24
VFBGA416S VFBGA416S, plastic, very thin fine-pitch ball grid array; 416 balls; 0.5 mm pitch; 13 mm x 13 mm x 0.9 mm body 2017-06-11
FBGA520 FBGA520, plastic, fine-pitch ball grid array; 520 bumps; 0.8 mm pitch; 21 mm x 21 mm x 1.83 mm body 2017-03-27
LFBGA624 LFBGA624, plastic, low profile fine-pitch ball grid array; 624 bumps; 0.8 mm pitch; 21 mm x 21 mm x 1.45 mm body 2017-03-27
LFBGA624 LFBGA624, plastic, low profile fine-pitch ball grid array; 624 balls; 0.8 mm pitch; 21 mm x 21 mm x 1.45 mm body 2017-06-11
FBGA624 FBGA624; plastic, fine-pitch ball grid array; 624 bumps; 0.8 mm pitch; 21 mm x 21 mm x 2 mm body 2016-01-07
LFBGA569S LFBGA569S, plastic, low profile fine-pitch ball grid array; 569 balls; 0.4 mm pitch; 12 mm x 12 mm x 1.15 mm body 2017-06-11
BGA1932 FCPBGA 1932 45*45*3.18 1 2017-06-11
VQFN40R VQFN40R, plastic, very thin quad flatpack; no leads; 40 terminals; 0.5 mm pitch; 6 mm x 6 mm x 0.98 mm body NON-JEDEC(JEDEC) 2017-06-11
HVQFN63R HVQFN63R, plastic, thermal enhanced very thin quad flatpack; no leads; 63 terminals; 0.5 mm pitch; 8 mm x 8 mm x 0.91 mm body 2017-06-11
VQFN41R VQFN41R, plastic, very thin quad flatpack; no leads; 41 terminals; 0.5 mm pitch; 5 mm x 5 mm x 0.91 mm body 2017-06-11
VQFN41R VQFN41R, plastic, very thin quad flatpack; no leads; 41 terminals; 0.5 mm pitch; 5 mm x 5 mm x 0.91 mm body 2017-06-11
VQFN64R VQFN64R, plastic, very thin quad flatpack; no leads; 64 terminals; 0.5 mm pitch; 7 mm x 7 mm x 0.91 mm body 2017-06-11
BGA1152 BGA1152, plastic, ball grid array; 1152 balls; 1 mm pitch; 35 mm x 35 mm x 2.67 mm body 2017-06-11
BGA780 BGA780, plastic, ball grid array; 780 balls; 1 mm pitch; 29 mm x 29 mm x 2.68 mm body 2017-06-11
FBGA780 FBGA780, plastic, fine-pitch ball grid array; 780 bumps; 0.8 mm pitch; 23 mm x 23 mm x 1.92 mm body 2016-01-11
FBGA780 FBGA780, plastic, fine-pitch ball grid array; 780 bumps; 0.8 mm pitch; 23 mm x 23 mm x 1.92 mm body 2016-01-14
FBGA780 FBGA780, plastic, fine-pitch ball grid array; 780 bumps; 0.8 mm pitch; 23 mm x 23 mm x 1.92 mm body 2016-01-27
FBGA780 FBGA780, plastic, fine-pitch ball grid array; 780 bumps; 0.8 mm pitch; 23 mm x 23 mm x 1.92 mm body 2017-03-21
FBGA780 FBGA780, plastic, fine-pitch ball grid array; 780 bumps; 0.8 mm pitch; 23 mm x 23 mm x 2.46 mm body 2016-01-14
FBGA780 FBGA780, fine-pitch ball grid array package, 780 terminals, 0.8 mm pitch, 23 mm x 23 mm x 2.46 mm body 2019-02-26
BGA416 BGA416, plastic, ball grid array; 416 balls; 1 mm pitch; 27 mm x 27 mm x 2.23 mm body MS-034 AAL-1(JEDEC) 2017-06-11
FBGA525 FBGA525, plastic, fine-pitch ball grid array; 525 bumps; 0.8 mm pitch; 19 mm x 19 mm x 1.62 mm body 2017-03-27
FBGA525 FBGA525, plastic, fine-pitch ball grid array; 525 bumps; 0.8 mm pitch; 19 mm x 19 mm x 1.92 mm body 2017-03-27
FBGA525 FBGA525, plastic, fine-pitch ball grid array; 525 bumps; 0.8 mm pitch; 19 mm x 19 mm x 1.97 mm body 2019-05-17
FBGA525 FBGA525, plastic, fine-pitch ball grid array; 525 bumps; 0.8 mm pitch; 19 mm x 19 mm x 2.17 mm body 2019-05-22
BGA1292 BGA1292, plastic, ball grid array; 1292 balls; 1 mm pitch; 37.5 mm x 37.5 mm x 3.17 mm body 2017-06-11
BGA1292 BGA1292, plastic, ball grid array; 1292 balls; 1 mm pitch; 37.5 mm x 37.5 mm x 3.17 mm body 2019-04-11
FBGA896 FBGA896, plastic, fine-pitch ball grid array; 896 balls; 0.8 mm pitch; 25 mm x 25 mm x 2.46 mm body 2017-06-11
FBGA625 FBGA625, plastic, fine-pitch ball grid array; 625 balls; 0.8 mm pitch; 21 mm x 21 mm x 2.35 mm body MS-026-BBC(JEDEC) 2017-06-11
HBGA448 HBGA448, plastic, thermal enhanced ball grid array; 448 balls; 1 mm pitch; 23 mm x 23 mm x 1.93 mm body 2017-06-11
HLQFP156 HLQFP156, plastic, thermal enhanced low profile quad flat package; 156 terminals; 0.4 mm pitch; 14 mm x 20 mm x 1.4 mm body NON-JEDEC(JEDEC) 2017-06-11
HLQFP156 HLQFP156, plastic, thermal enhanced low profile quad flat package; 156 terminals; 0.4 mm pitch; 14 mm x 20 mm x 1.4 mm body 2018-10-26
FBGA621 FBGA621, plastic, fine-pitch ball grid array; 621 bumps; 0.8 mm pitch; 21 mm x 21 mm x 1.92 mm body 2016-01-13
BGA495 BGA495, plastic, ball grid array; 495 balls; 1 mm pitch; 25 mm x 25 mm x 2.5 mm body 2017-06-11
HQFN PWR QFN 36 9*9*2.1P0.8 2017-06-11
HQFN24 PWR QFN 24 8*8*2.1P0.8 2017-06-11
HBGA516 HBGA516, plastic, thermal enhanced ball grid array; 516 balls; 1 mm pitch; 27 mm x 27 mm x 2.55 mm body PBGA-B516(JEDEC) 2017-06-11
BGA357 BGA357, plastic, ball grid array; 357 balls; 1.27 mm pitch; 25 mm x 25 mm x 2.52 mm body PBGA-B357(JEDEC) 2017-06-11
BGA256 BGA256, plastic, ball grid array; 256 balls; 1.27 mm pitch; 23 mm x 23 mm x 2.54 mm body PBGA-B256(JEDEC) 2017-06-11
SO16 SO16, plastic, small outline package; 16 terminals; 0.8 mm pitch; 7.03 mm x 7.03 mm x 2.3 mm body PDSO-G16(JEDEC) 2017-06-11
PGA179 PGA179, plastic, pin grid array; 179 pins; 2.54 mm pitch; 47.2 mm x 47.2 mm x 3.18 mm body PPGA-P179(JEDEC) 2017-06-11
PGA182 PGA182, plastic, pin grid array; 182 pins; 2.54 mm pitch; 46.7 mm x 46.7 mm x 3.18 mm body PPGA-P182(JEDEC) 2017-06-11
LQFP52 plastic, low profile quad; flat leaded package; 52 terminals; 0.65 mm pitch; 10 mm x 10 mm x 1.7 mm body 2016-01-25
LQFP52 LQFP52, plastic, low profile quad flat package; 52 terminals; 0.65 mm pitch; 10 mm x 10 mm x 1.4 mm body 2017-06-11
LQFP112 LQFP112, plastic, low profile quad flat package; 112 terminals; 0.65 mm pitch; 20 mm x 20 mm x 1.4 mm body L-PQFP-G112(JEDEC) 2017-06-11
SNSR SNSR M-PAK 05 Package PORTED R-PDSO-G5(JEDEC) 2017-06-11
SNSR SNSR M-PAK 05 Package R-PDSO-G5(JEDEC) 2017-06-11
UQFN20 UQFN20, plastic, ultra thin quad flatpack; no leads; 20 terminals; 0.4 mm pitch; 3 mm x 3 mm x 0.6 mm body 2017-06-11
VQFN16 VQFN16, plastic, very thin quad flatpack; no leads; 16 terminals; 0.5 mm pitch; 3 mm x 3 mm x 1 mm body 2016-01-05
HVQFN12 QFN 12EP 3SQ*.85PO0.50 2017-06-11
SO8 SO8, plastic, small outline package; 8 terminals; 2.54 mm pitch; 9.6 mm x 9.6 mm x 0.81 mm body 2017-06-11
VQFN12 VQFN12, plastic, very thin quad flatpack; no leads; 12 terminals; 0.65 mm pitch; 3 mm x 3 mm x 1 mm body 2017-06-11
VQFN12 VQFN12, plastic, very thin quad flatpack; no leads; 12 terminals; 0.65 mm pitch; 3 mm x 3 mm x 1 mm body 2017-06-11
TQFN16 TQFN16, plastic, thin quad flatpack; no leads; 16 terminals; 0.5 mm pitch; 3 mm x 3 mm x 1.2 mm body 2017-06-11
VQFN24 VQFN24, plastic, very thin quad flatpack; no leads; 24 terminals; 0.5 mm pitch; 4 mm x 4 mm x 1 mm body 2017-06-11
HQFN42 HQFN42, plastic, thermal enhanced quad flat package, no leads; 42 terminals; 0.65 mm pitch; 9 mm x 13.6 mm x 2.65 mm body 2017-06-11
VFBGA85 VFBGA85, plastic, very thin fine-pitch ball grid array; 85 balls; 0.5 mm pitch; 6 mm x 6 mm x 0.95 mm body 2017-06-11
VFBGA89 VFBGA89, plastic, very thin fine-pitch ball grid array; 89 balls; 0.5 mm pitch; 6 mm x 6 mm x 0.95 mm body NON-JEDEC(JEDEC) 2017-06-11
VFBGA89 VFBGA89, plastic, very thin fine-pitch ball grid array; 89 balls; 0.5 mm pitch; 6 mm x 6 mm x 0.95 mm body NON-JEDEC(JEDEC) 2017-06-11
VFBGA256 VFBGA256, plastic, very thin fine-pitch ball grid array; 256 balls; 0.5 mm pitch; 9 mm x 9 mm x 0.795 mm body 2017-06-11
HLQFN16 HLQFN16; plastic, thermal enhanced low profile quad flat non-leaded package, dimple wettable flank; 16 terminals; 0.8 mm pitch; 4 mm x 4 mm x 1.45 mm body 2018-06-12
HLQFN16 HLQFN16; plastic, thermal enhanced low profile quad flat non-leaded package; 16 terminals; 0.8 mm pitch; 4 mm x 4 mm x 1.5 mm body 2018-06-15
HLQFN16 HLQFN16; plastic, thermal enhanced low profile quad flat non-leaded package; 16 terminals; 0.8 mm pitch; 4 mm x 4 mm x 1.37 mm body 2019-05-09
TFBGA500S TFBGA500S, thin fine-pitch ball grid array package; 500 terminals, 0.65 mm pitch, 14 mm x 17 mm x 0.925 mm body 2017-02-28
SO8 SO8, plastic, small outline package; 8 terminals; 2.54 mm pitch; 1.07 mm x 1.07 mm x 1.99 mm body PDIP-P8(JEDEC) 2017-06-11
SO8 SO8, plastic, small outline package; 8 terminals; 2.54 mm pitch; 1.07 mm x 1.07 mm x 1.99 mm body PDIP-P8(JEDEC) 2017-06-11
SO20 SO20, plastic, small outline package; 20 terminals; 1.27 mm pitch; 7.5 mm x 13.85 mm x 4.25 mm body E-PDSO-G20(JEDEC) 2017-06-11
SO20 SO20, plastic, small outline package; 20 terminals; 1.27 mm pitch; 7.5 mm x 12.85 mm x 4.25 mm body 2017-06-11
SO8 SO8, plastic, small outline package; 8 terminals; 2.54 mm pitch; 12.06 mm x 12.06 mm x 7.62 mm body E-PDSO-G8(JEDEC) 2017-06-11
SO8 SO8, plastic, small outline package; 8 terminals; 2.54 mm pitch; 12.06 mm x 12.06 mm x 9.62 mm body E-PDSO-G8(JEDEC) 2017-06-11
SO8 SO8, plastic, small outline package; 8 terminals; 2.54 mm pitch; 12.06 mm x 12.06 mm x 8.38 mm body E-PDSO-G8(JEDEC) 2017-06-11
SO8 SO8, plastic, small outline package; 8 terminals; 2.54 mm pitch; 10.66 mm x 10.66 mm x 5.84 mm body E-PDSO-G8(JEDEC) 2017-06-11
QFP132 QFP132, plastic, quad flat package; 132 terminals; 0.635 mm pitch; 24.1 mm x 24.1 mm x 3.56 mm body PQFP-G132(JEDEC) 2017-06-11
QFP208 QFP208, plastic, quad flat package; 208 terminals; 0.5 mm pitch; 28 mm x 28 mm x 4.1 mm body F-PQFP-G208(JEDEC) 2017-06-11
HQFN plastic, thermally enhanced quad; flat non-leaded package; 64 terminals; 0.80 mm pitch; 14 mm x 14 mm x 2.2 mm body 2016-06-06
QFP64 QFP64, plastic, quad flat package; 64 terminals; 0.8 mm pitch; 14 mm x 14 mm x 2.2 mm body PQFP-G64(JEDEC) 2017-06-11
QFP256S QFP256S, plastic, quad flat package; 256 terminals; 0.65 mm pitch; 45.3 mm x 45.3 mm x 4.9 mm body PQFP-G160(JEDEC) 2017-06-11
QFP64 QFP64, plastic, quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body MS-026 BCD(JEDEC) 2016-01-25
QFP240 QFP240, plastic, quad flat package; 240 terminals; 0.5 mm pitch; 32 mm x 32 mm x 3.4 mm body F-PQFP-G240(JEDEC) 2017-06-11
QFP256S QFP256S, plastic, quad flat package; 256 terminals; 0.65 mm pitch; 45.7 mm x 45.7 mm x 4.9 mm body PQFP-G132(JEDEC) 2017-06-11
PGA132 PGA132, plastic, pin grid array; 132 pins; 2.54 mm pitch; 34.8 mm x 34.8 mm x 3.18 mm body PPGA-P132(JEDEC) 2017-06-11
BGA416 plastic, ball grid array; 416 bumps; 1.0 mm pitch; 27 mm x 27 mm x 1.95 mm body 2016-07-01
LBGA672 LBGA672, plastic, low profile ball grid array; 672 balls; 1 mm pitch; 35 mm x 35 mm x 0.95 mm body 2016-02-24
LBGA740 LBGA740, plastic, low profile ball grid array; 740 balls; 1 mm pitch; 37.5 mm x 37.5 mm x 1.05 mm body 2016-02-01
BGA360 BGA360, plastic, ball grid array; 360 balls; 1 mm pitch; 23 mm x 23 mm x 1.9 mm body 2017-06-11
SO8 SO8, plastic, small outline package; 8 terminals; 1.27 mm pitch; 7.36 mm x 7.36 mm x 4.19 mm body 2016-02-01
SO8 SO8, plastic, small outline package; 8 terminals; 1.27 mm pitch; 8.26 mm x 8.26 mm x 4.8 mm body R-PDSO-G8(JEDEC) 2017-06-11
BGA255 BGA255, plastic, ball grid array; 255 balls; 1.27 mm pitch; 23 mm x 23 mm x 1.9 mm body PBGA-B255(JEDEC) 2017-06-11
BGA388 BGA388, plastic ball grid array package; 388 balls; 1 mm pitch; 27 mm x 27 mm x 1.95 mm body MS-034 AAL-1(JEDEC) 2016-03-04
BGA672 BGA672, plastic, ball grid array; 672 balls; 0.5 mm pitch; 27 mm x 27 mm x 1.73 mm body 2017-06-11
FBGA425 plastic, fine-pitch ball grid array; 425 bumps; 0.8 mm pitch; 19 mm x 19 mm x 1.7 mm body 2016-01-07
FBGA457 FBGA457, plastic, fine-pitch ball grid array; 457 balls; 0.8 mm pitch; 19 mm x 19 mm x 1.55 mm body 2017-06-11
FBGA512 FBGA512, plastic, fine-pitch ball grid array; 512 balls; 0.8 mm pitch; 25 mm x 25 mm x 1.9 mm body 2017-06-11
FBGA529 FBGA529, plastic, fine-pitch ball grid array; 529 bumps; 0.8 mm pitch; 19 mm x 19 mm x 1.64 mm body 2016-01-05
FBGA561 FBGA561, plastic, fine-pitch ball grid array; 561 balls; 0.8 mm pitch; 23 mm x 23 mm x 1.95 mm body 2017-06-11
FM14F FM14F, plastic, flange mount flat package; 14 terminals; 9.02 mm x 17.53 mm x 2.59 mm body 2017-06-11
FM14F TO-270 WB-14 LEAD 2017-06-11
FM14F TO-270 WB-14 GULL 2017-06-11
FM14F TO-272 WB-14 LEAD 2017-06-11
FM15F FM15F, plastic, flange mount flat package; 15 terminals; 9.02 mm x 17.53 mm x 2.59 mm body 2017-06-11
FM15F FM15F, plastic, flange mount flat package; 15 terminals; 9.02 mm x 17.53 mm x 2.59 mm body 2017-06-11
FM15F FM15F, plastic, flange mount flat package; 15 terminals; 9.02 mm x 17.53 mm x 2.59 mm body 2017-06-11
FM16 TO-270 WB-16 GULL 2017-06-11
FM16 FM16, plastic, flange mount package; 16 terminals; 9.02 mm x 17.53 mm x 2.59 mm body 2017-06-11
FM16 FM16, plastic, flange mount package; 16 terminals; 9.02 mm x 23.62 mm x 2.59 mm body PDIL-G16(JEDEC) 2017-06-11
FM16 FM16, plastic, flange mount package; 16 terminals; 9.02 mm x 23.62 mm x 2.59 mm body PDIL-G16(JEDEC) 2017-06-11
FM16 FM16, plastic, flange mount package; 16 terminals; 9.02 mm x 23.62 mm x 3.18 mm body 2017-06-11
FM16F TO-270 WB-16 PLASTIC 2017-06-11
FM16F TO-272 WB-16 2017-06-11
FM16F TO-270 WBL 16 PLASTIC 2017-06-11
FM16F FM16F, plastic, flange mount flat package; 16 terminals; 11 mm x 23.62 mm x 3.17 mm body 2017-06-11
CRPM4 studded ceramic package; 4 leads 1999-03-29
CRPM4 studded ceramic package; 4 leads 1999-03-29
FM17F FM17F, plastic, flange mount flat package; 17 terminals; 9.02 mm x 17.53 mm x 2.59 mm body 2017-06-11
FM17F plastic, flange mounted package; 17 leads flat; 1.02 mm pitch; 17.53 x 9.02 x 2.59 mm body 2016-07-05
FM17F FM17F, plastic, flange mount flat package; 17 terminals; 9.02 mm x 17.53 mm x 2.59 mm body 2017-06-11
FM2 FM2, plastic, flange mount package; 2 terminals; 6.1 mm x 9.65 mm x 2.03 mm body PDIP-G2(JEDEC) 2017-06-11
PDIP3 PDIP3, plastic shrink dual in-line package; 3 leads; 9.65 mm x 6.1 mm x 2.03 mm body 2017-03-24
FM2F FM2F, plastic, flange mount flat package; 2 terminals; 6.35 mm x 23.62 mm x 2.59 mm body PDIL-F2(JEDEC) 2017-06-11
FM4 FM4, plastic, flange mount package; 4 terminals; 9.02 mm x 17.53 mm x 2.59 mm body 2017-06-11
FM4F TO-272 WB-4 2017-06-11
FM4F TO-270 WB-4 2017-06-11
FM4F TO-270 WB-4 GULL 2017-06-11
TO-2704 TO-270423.75*9.25*3.17 2017-03-21
FM6 FM6, plastic, flange mount package; 6 terminals; 6.35 mm x 23.62 mm x 2.62 mm body PDIL-C6(JEDEC) 2017-06-11
FM6F FM6F, plastic, flange mount flat package; 6 terminals; 6.35 mm x 23.62 mm x 2.59 mm body PDIL-F6(JEDEC) 2017-06-11
FM6F FM6F, plastic, flange mount flat package; 6 terminals; 9.02 mm x 17.53 mm x 2.59 mm body PDIP-F4(JEDEC) 2017-06-11
FM8 FM8, plastic, flange mount package; 8 terminals; 6.35 mm x 23.62 mm x 2.62 mm body PDIL-C8(JEDEC) 2017-06-11
FM8F FM8F, plastic, flange mount flat package; 8 terminals; 6.35 mm x 23.62 mm x 2.59 mm body 2017-06-11
HBGA668 HBGA668, plastic, thermal enhanced ball grid array; 668 balls; 1 mm pitch; 29 mm x 29 mm x 1.8 mm body HT-PBGA-B668(JEDEC) 2017-06-11
HBGA689 HBGA689, plastic, thermal enhanced ball grid array; 689 bumps; 1.0 mm pitch; 31 mm x 31 mm x 2.23 mm body 2016-01-21
HSOP32 HSOP32, plastic, heatsink, small outline; leaded package; 32 terminals; 0.65 mm pitch; 11 mm x 7.5 mm x 2.2 mm body 2017-03-24
HSOP32 plastic, heatsink small outline package; 32 terminals; 0.65 mm pitch; 11 mm x 7.5 mm x 2.3 mm body 2016-01-07
HSOP32 HSOP32, plastic, thermal enhanced small outline package; 32 terminals; 0.65 mm pitch; 7.5 mm x 11 mm x 2.33 mm body E-PDSO-G32(JEDEC) 2017-06-11
HSOP32 HSOP32, plastic, thermal enhanced small outline package; 32 terminals; 0.65 mm pitch; 4.6 mm x 7 mm exposed pad 2018-03-08
HSOP54 HSOP54, plastic, thermal enhanced small outline package; 54 terminals; 0.65 mm pitch; 7.5 mm x 17.9 mm x 2.22 mm body 2016-03-02
HSOP54 HSOP54, plastic, heatsink small outline package; W/B, tooth gap design, 54 terminals; 0.65 mm pitch; 4.6 mm x 10.4 mm exposed pad 2018-01-05
HSOP54 HSOP54, plastic, heatsink small outline package; 54 terminals; 0.65 mm pitch; 17.9 mm x 7.5 mm x 2.45 mm body 2017-03-24
HSOP54 HSOP54, plastic, thermal enhanced small outline package; 54 terminals; 0.65 mm pitch; 7.5 mm x 17.9 mm x 2.33 mm body E-PDSO-G54(JEDEC) 2017-06-11
HTQFN32 HTQFN32, plastic, thermal enhanced thin quad flatpack; no leads; 32 terminals; 1 mm pitch; 10 mm x 10 mm x 1.55 mm body PBMA-N32(JEDEC) 2017-06-11
HTSSOP16 HTSSOP16, plastic, thermal enhanced thin shrink small outline package; 16 terminals; 0.65 mm pitch; 4.4 mm x 5 mm x 1.05 mm body TS-PDSO-G16(JEDEC) 2017-06-11
HVLGA71 HVLGA71, plastic, thermal enhanced, very thin, low profile land grid array package; 71 balls; 0.5 mm pitch; 9 mm x 9 mm x 0.9 mm body PBMA-N71(JEDEC) 2017-06-11
LBGA352 LBGA352, plastic, low profile ball grid array; 352 balls; 1.27 mm pitch; 35 mm x 35 mm x 1.05 mm body HT-PBGA-B352(JEDEC) 2017-06-11
LBGA480 LBGA480, plastic, low profile ball grid array; 480 balls; 1.27 mm pitch; 37.5 mm x 37.5 mm x 1.05 mm body HT-PBGA-B480(JEDEC) 2017-06-11
SENSOR4F SENSOR4F, sensor package; 4 terminals; 2.54 mm pitch; 17.78 mm x 29.48 mm x 8 mm body E-PSXA-F4(JEDEC) 2017-06-11
SENSOR4F SENSOR4F, sensor package; 4 terminals; 2.54 mm pitch; 17.78 mm x 29.48 mm x 10.67 mm body E-PSXC-F4(JEDEC) 2017-06-11
SENSOR4F SENSOR4F, sensor package; 4 terminals; 2.54 mm pitch; 17.78 mm x 29.48 mm x 10.67 mm body E-PSXC-F6(JEDEC) 2017-06-11
SENSOR4F SENSOR4F, sensor package; 4 terminals; 2.54 mm pitch; 19.05 mm x 27.94 mm x 8 mm body E-PSXD-F4(JEDEC) 2017-06-11
SIL3 SIL3, plastic, DIL-bent-SIL package; 3 terminals; 1.5 mm pitch; 4.15 mm x 5.5 mm x 1.5 mm body PSSO-F3(JEDEC) 2017-06-11
SO8 plastic small outline package; 8 leads; body width 7.5 mm 2003-02-19
SIL4 SIL4, plastic, DIL-bent-SIL package; 4 terminals; 1.7 mm pitch; 9.2 mm x 10 mm x 4.4 mm body 2017-06-11
SO16 SO16, plastic, small outline package; 16 terminals; 1.27 mm pitch; 7.5 mm x 10.3 mm x 3.43 mm body F-PDSO-G16(JEDEC) 2017-06-11
SSOP32 SSOP32, plastic, shrink small outline package; 32 terminals; 0.65 mm pitch; 7.5 mm x 11 mm x 2.5 mm body 2016-02-29
SSOP32 SSOP32; plastic, shrink small outline package; 32 terminals; 0.65 mm pitch; 11 mm x 7.5 mm x 2.3 mm body 2016-01-07
SO4 SO4, plastic, small outline package; 4 terminals; 1.15 mm pitch; 1.25 mm x 2 mm x 1 mm body PDSO-G4(JEDEC) 2017-06-11
SSOP54 SSOP54, plastic, shrink small outline package; 54 terminals; 0.65 mm pitch; 7.5 mm x 17.9 mm x 2.5 mm body E-PDSO-G54(JEDEC) 2017-06-11
TLGA99 TLGA99, plastic, thin low profile land grid array; 99 balls; 9.5 mm x 9.5 mm x 1.1 mm body 2016-03-21
TQFN24 TQFN24, plastic, thin quad flatpack; no leads; 24 terminals; 0.5 mm pitch; 5 mm x 3 mm x 1 mm body 2017-06-11
TSON14 TSON14, plastic, thin small outline package; no leads; 14 terminals; 0.4 mm pitch; 5 mm x 3 mm x 1 mm body PBMA-N14(JEDEC) 2017-06-11
TSON8 TSON8, plastic, thin small outline; no leads; 8 terminals; 1.25 mm pitch; 3 mm x 5 mm x 1.1 mm body 2017-06-11
TSON8 TSON8, plastic, thin small outline package; no leads; 8 terminals; 1.25 mm pitch; 5 mm x 3 mm x 1.2 mm body PBMA-N14(JEDEC) 2017-06-11
TSOP6 TSOP6, plastic, thin small outline package; 6 terminals; 0.65 mm pitch; 1.25 mm x 2 mm x 1 mm body PDSO-G6(JEDEC) 2017-06-11
TSSOP24 TSSOP24, plastic, thin shrink small outline package; 24 terminals; 0.65 mm pitch; 5.6 mm x 7.8 mm x 1.05 mm body 2017-06-11
UNIBODY4F UNIBODY4F, unibody package; 4 terminals; 2.54 mm pitch; 15.56 mm x 15.56 mm x 5.33 mm body E-PSXA-F4(JEDEC) 2017-06-11
VQFN16 VQFN16, plastic, very thin quad flatpack; no leads; 16 terminals; 0.5 mm pitch; 3 mm x 3 mm x 1 mm body 2017-06-11
WLCSP120 WLCSP 120 5.29*5.28*.36 2017-06-11
WLCSP142 WLCSP 142 4.8*5.6*0.6P.4 2017-06-11
WLCSP143 WLCSP 143 6.44*5.55*0.56 2017-06-11
WLCSP169 WLCSP169, wafer level chip-size package; 169 terminals; 0.4 mm pitch; 5.5 mm x 5.63 mm x 0.6 mm body 2017-06-11
WLCSP173 WLCSP173, wafer level chip-size package; 173 terminals; 0.5 mm pitch; 7.74 mm x 7.9 mm x 0.6 mm body 2017-06-11
WLCSP211 WLCSP211, , wafer level chip-size package; 211 terminals; 0.5 mm pitch; 9.33 mm x 7.91 mm x 0.6 mm body 2017-06-11
WLCSP36 WLCSP36, , wafer level chip-size package; 36 terminals; 0.4 mm pitch; 2.98 mm x 3.07 mm x 0.6 mm body 2017-06-11
WLCSP36 WLCSP36, wafer level chip-scale package, 36 terminals, 0.4 mm pitch, 2.8 mm x 2.52 mm x 0.5 mm body (backside coating included) 2018-11-01
WLCSP36 WLCSP36, wafer level chip-scale package, 36 terminals, 0.4 mm pitch, 2.8 mm x 2.52 mm x 0.525 mm body (backside coating included) 2018-11-30
WLCSP36 WLCSP36, wafer level chip-scale package, 36 terminals, 0.4 mm pitch, 2.8 mm x 2.52 mm x 0.5 mm body 2018-12-04
WLCSP36 WLCSP36, wafer level chip-scale package, 36 terminals, 0.4 mm pitch, 2.79 mm x 2.59 mm x 0.525 mm body 2019-04-18
WLCSP36 WLCSP36, , wafer level chip-size package; 36 terminals; 0.4 mm pitch; 3.06 mm x 3.06 mm x 0.6 mm body 2017-06-11
WLCSP36 WLCSP36, , wafer level chip-size package; 36 terminals; 0.4 mm pitch; 2.67 mm x 2.82 mm x 0.56 mm body 2017-06-11
WLCSP36 WLCSP36, wafer level chip-scale package; 36 bumps; 0.4 mm pitch, 2.62 mm x 2.51 mm x 0.525 mm body (backside coating included) 2017-12-20
WLCSP36 WLCSP36, wafer level chip-scale package; 36 bumps; 0.4 mm pitch, 2.62 mm x 2.51 mm x 0.5 mm body 2017-12-08
WLCSP36 WLCSP36, wafer level chip-scale package; 36 bumps; 0.4 mm pitch, 2.62 mm x 2.51 mm x 0.5 mm body 2017-09-18
WLCSP36 WLCSP36, wafer level chip-scale package; 36 bumps; 0.4 mm pitch, 2.62 mm x 2.51 mm x 0.525 mm body 2017-09-18
WLCSP36 WLCSP36, wafer level chip-scale package, 36 terminals, 0.4 mm pitch, 3.9 mm x 1.9 mm x 0.525 mm body (backside coating included) 2018-06-20
WLCSP36 WLCSP36, wafer level chip-scale package, 36 terminals, 0.4 mm pitch, 2.8 mm x 2.52 mm x 0.525 mm body (backside coating included) 2018-11-01
WLCSP35 WLCSP35, , wafer level chip-size package; 35 terminals; 0.4 mm pitch; 2.99 mm x 2.53 mm x 0.6 mm body 2017-06-11
WLCSP64 WLCSP 64 3.4*3.3*0.6P0.4 2017-06-11
WLCSP64 WLCSP64, , wafer level chip-size package; 64 terminals; 0.4 mm pitch; 3.38 mm x 3.48 mm x 0.32 mm body 2017-06-11
WLCSP64 WLCSP64, wafer level chip-scale package; 64 bumps; 3.24 mm x 3.24 mm x 0.625 mm body (backside coating included) 2018-08-02
WLCSP80 WLCSP 80 4.1*3.6*0.6 P.4 2017-06-11
WLCSP80 WLCSP 80 4.3*3.6*.34 P.4 2017-06-11
WLCSP89 wafer level chip-scale package, 89 bumps, 0.4 mm pitch, 3.63 mm x 3.58 mm x 0.38 mm body 2016-09-05
CFM4F CFM4F, ceramic, flange mount flat package; 4 terminals; 9.78 mm x 20.58 mm x 3.75 mm body 2017-06-11
CFM4F CFM4F, ceramic, flange mount flat package; 4 terminals; 9.78 mm x 20.58 mm x 3.75 mm body 2017-06-11
CFM4F CFM4F, ceramic, flange mount flat package; 4 terminals; 9.78 mm x 23.12 mm x 3.75 mm body 2017-06-11
CFM4F CFM4F, ceramic, flange mount flat package; 4 terminals; 10.16 mm x 41.1 mm x 4.58 mm body 2017-06-11
CFM2F CFM2F, ceramic, flange mount flat package; 2 terminals; 13.72 mm x 34.04 mm x 4.41 mm body 2017-06-11
CFM2F NI-880S 2017-06-11
CFM2F NI-880XS-2 2017-06-11
CFM2F CFM2F, ceramic, flange mount flat package; 2 terminals; 5.85 mm x 20.32 mm x 3.82 mm body 2017-06-11
CFM2F CFM2F, ceramic, flange mount flat package; 2 terminals; 5.84 mm x 20.32 mm x 3.81 mm body 2017-06-11
CFM2F CFM2F, ceramic, flange mount flat package; 2 terminals; 9.78 mm x 34.04 mm x 3.75 mm body 2017-06-11
CFM2F NI-780S 2017-06-11
CFM8F CFM8F, ceramic, flange mount flat package; 8 terminals; 10.16 mm x 41.15 mm x 4.45 mm body 2017-06-11
CFM8F CFM8F, ceramic, flange mount flat package; 8 terminals; 10.16 mm x 32.26 mm x 4.45 mm body 2017-06-11
CFM8F CFM8F, ceramic, flange mount flat package; 8 terminals; 10.16 mm x 32.26 mm x 4.45 mm body 2017-06-11
CFM8F CFM8F, ceramic, flange mount flat package; 8 terminals; 9.78 mm x 20.58 mm x 3.75 mm body 2017-06-11
CFM8F CFM8F, ceramic, flange mount flat package; 8 terminals; 9.78 mm x 20.58 mm x 3.75 mm body 2017-06-11
CFM8F CFM8F, ceramic, flange mount flat package; 8 terminals; 9.78 mm x 23.12 mm x 3.75 mm body 2017-06-11
CFM8F CFM8F, ceramic, flange mount flat package; 8 terminals; 9.78 mm x 23.12 mm x 3.75 mm body 2017-06-11
CFM6F CFM6F, ceramic, flange mount flat package; 6 terminals; 9.78 mm x 20.58 mm x 3.75 mm body 2017-06-11
CFM6F NI-780S-6 2017-06-11
CFM6F NI-780S-4L2L 2017-06-11
CFM6F CFM6F, ceramic, flange mount flat package; 6 terminals; 9.78 mm x 20.58 mm x 3.75 mm body 2017-06-11
CFM6F CFM6F, ceramic flange mount flat package; 6 terminals; 5.36 mm pitch, 9.78 mm x 20.58 mm x 3.75 mm body 2018-05-30
CFM6F CFM6F, ceramic flange mount flat package; 6 terminals; 4.445 mm pitch, 9.78 mm x 20.58 mm x 3.75 mm body 2018-08-14
CFM6F CFM6F, ceramic, flange mount flat package; 6 terminals; 10.16 mm x 32.26 mm x 4.58 mm body 2017-06-11
CFM6F CFM6F, ceramic, flange mount flat package; 6 terminals; 10.16 mm x 32.26 mm x 4.45 mm body 2017-06-11
ACP-1230S-4L2S CFM6F, ceramic, flange mount flat package; 6 terminals; 10.16 mm x 32.26 mm x 4.45 mm body 2017-06-26
CFM6F CFM6F, ceramic, flange mount flat package; 6 terminals; 9.78 mm x 23.12 mm x 3.75 mm body 2017-06-11
CFM6F CFM6F, ceramic, flange mount flat package; 6 terminals; 9.78 mm x 23.12 mm x 3.75 mm body 2017-06-11
CFM6F CFM6F, ceramic, flange mount flat package; 6 terminals; 9.78 mm x 23.12 mm x 3.75 mm body 2017-06-11
CFM2 CFM2, ceramic, flange mount package; 2 terminals; 9.78 mm x 20.58 mm x 3.75 mm body 2017-06-11
CFM2 CFM2, ceramic, flange mount package; 2 terminals; 13.72 mm x 23.12 mm x 4.41 mm body 2017-06-11
CFM2 NI-880XS-2 GULL 2017-06-11
CFM2 CFM2, ceramic, flange mount package; 2 terminals; 9.78 mm x 23.12 mm x 3.75 mm body 2017-06-11
CFM4 NI-780S-4G 2017-06-11
CFM4 CFM4, ceramic, flange mount package; 4 terminals; 9.78 mm x 20.58 mm x 3.75 mm body 2017-06-11
CFM4 CFM4, ceramic, flange mount package; 4 terminals; 10.16 mm x 32.26 mm x 4.45 mm body 2017-06-11
CFM4 CFM4, ceramic, flange mount package; 4 terminals; 10.16 mm x 32.26 mm x 4.58 mm body 2017-06-11
CFM8 CFM8, ceramic, flange mount package; 8 terminals; 9.78 mm x 20.58 mm x 3.75 mm body 2017-06-11
PLD4L PLD4L, plastic, RF over-molded package designation; 4 terminals; 5.85 mm x 6.61 mm x 1.74 mm body PDFP-D2(JEDEC) 2017-06-11
PLD4L PLD4L, plastic, RF over-molded package designation; 4 terminals; 0 mm pitch; 5.85 mm x 6.61 mm x 1.74 mm body 2017-06-11
CFM2F CFM2F, ceramic, flange mount flat package; 2 terminals; 9.78 mm x 20.32 mm x 3.67 mm body 2017-06-11
CFM2F CFM2F, ceramic, flange mount flat package; 2 terminals; 9.78 mm x 20.32 mm x 3.66 mm body 2016-03-18
CFM2 CFM2, ceramic, flange mount package; 2 terminals; 3.68 mm x 4.7 mm x 2.51 mm body 2017-06-11
CFM2 CFM2, ceramic, flange mount package; 2 terminals; 5.85 mm x 20.32 mm x 3.83 mm body 2017-06-11
FM2 FM2, plastic, flange mount package; 2 terminals; 9.96 mm x 20.57 mm x 3.81 mm body 2017-06-11
FM2 FM2, plastic, flange mount package; 2 terminals; 9.96 mm x 20.57 mm x 3.81 mm body 2017-06-11
FM4F FM4F, plastic, flange mount flat package; 4 terminals; 9.96 mm x 32.26 mm x 3.81 mm body 2017-06-11
FM4F FM4F, plastic, flange mount flat package; 4 terminals; 9.96 mm x 23.21 mm x 3.81 mm body 2017-06-11
FM4F FM4F, plastic, flange mount flat package; 4 terminals; 9.96 mm x 20.57 mm x 3.81 mm body 2017-06-11
FM4F FM4F, plastic, flange mount flat package; 4 terminals; 9.96 mm x 20.57 mm x 3.81 mm body 2017-06-11
FM4F FM4F, plastic, flange mount flat package; 4 terminals; 9.96 mm x 20.57 mm x 3.81 mm body 2017-06-11
FM6F FM6F, plastic, flange mount flat package; 6 terminals; 9.96 mm x 32.26 mm x 3.81 mm body 2017-06-11
FM6F FM6F, plastic, flange mount flat package; 6 terminals; 9.96 mm x 32.26 mm x 3.81 mm body 2017-06-11
FM8F FM8F, plastic, flange mount flat package; 8 terminals; 6.1 mm x 9.65 mm x 2.03 mm body 2017-06-11
FM2F FM2F, plastic, flange mount flat package; 2 terminals; 6.1 mm x 10.67 mm x 2.03 mm body PDIP-F2(JEDEC) 2017-06-11
FM2F FM2F, plastic, flange mount package; 2 terminals; 9.96 mm x 20.57 mm x 3.81 mm body 2019-02-08
FM4 FM4, plastic, flange mount package; 4 terminals; 9.96 mm x 32.26 mm x 3.81 mm body 2017-06-11
FM4 FM4, plastic, flange mount package; 4 terminals; 9.96 mm x 20.57 mm x 3.81 mm body 2017-06-11
FM4 FM4, plastic, flange mount package; 4 terminals; 9.96 mm x 20.57 mm x 3.81 mm body 2017-06-11
CFM4F NI-780S-4L 2017-06-11
CFM4F NI-780H-4L 2017-06-11
CFM2F CFM2F, ceramic, flange mount flat package; 2 terminals; 9.78 mm x 10.16 mm x 3.66 mm body 2017-06-11
CFM4F NI-1230S 2017-06-11
CFM4F CFM4F, ceramic, flange mount flat package; 4 terminals; 10.16 mm x 32.26 mm x 4.45 mm body 2017-06-11
HVQFN28 plastic thermal enhanced very thin quad flat package; no leads; 28 terminals; body 3.5 x 5.5 x 0.85 mm MO-220(JEDEC) 2016-04-26
HLQFN26 HLQFN26, thermal enhanced low profile quad flat package, no leads, 1 mm pitch, 10 mm x 6 mm x 1.348 mm body 2017-07-20
HUQFN16 plastic thermal enhanced ultra thin quad flat package; no leads; 16 terminals; body 2.4 x 1.6 x 0.5 mm 2016-04-26
WLCSP75 WLCSP75, wafer level chip-size package; 75 terminals; 0.4 mm pitch; 3.8 mm x 3.89 mm x 0.56 mm body 2017-06-11
LFBGA304 LFBGA304, plastic, low profile fine-pitch ball grid array; 304 balls; 0.5 mm pitch; 12 mm x 12 mm x 1.11 mm body 2017-06-11
WLCSP25 wafer level chip-scale package, 25 bumps 2016-04-26
LBGA121 LBGA121, plastic, low profile ball grid array; 121 balls; 1 mm pitch; 12 mm x 12 mm x 1.12 mm body PBGA-B121(JEDEC) 2017-06-11
LFBGA347 LFBGA347, plastic, low profile fine-pitch ball grid array; 347 balls; 0.5 mm pitch; 12 mm x 12 mm x 1.3 mm body 2017-06-11
LFBGA236 LFBGA236, plastic, low profile fine-pitch ball grid array; 236 balls; 0.5 mm pitch; 9 mm x 9 mm x 1.24 mm body 2017-06-11
TFBGA488 TFBGA488, plastic, thin fine-pitch ball grid array; 488 balls; 0.4 mm pitch; 12 mm x 12 mm x 1.04 mm body MO-298 TLAA-1(JEDEC) 2016-05-17
FBGA621 FBGA621, plastic, fine-pitch ball grid array; 621 balls; 0.65 mm pitch; 17 mm x 17 mm x 1.97 mm body 2017-06-11
FBGA621 FBGA621, fine-pitch ball grid array package; 621 terminals, 0.65 mm pitch, 17 mm x 17 mm x 2.03 mm body 2017-03-27
FBGA621 FBGA621, fine-pitch ball grid array package; 621 terminals, 0.65 mm pitch, 17 mm x 17 mm x 1.97 mm body 2019-05-28
LFBGA186 MAPBGA 186 12*12*0.8P0.8 2017-06-11
SIL4 SIL4, plastic, DIL-bent-SIL package; 4 terminals; 1.27 mm pitch; 6.35 mm x 9.25 mm x 3.63 mm body R-PSIP-F4(JEDEC) 2017-06-11
SO8 SO8, plastic, small outline package; 8 terminals; 2.54 mm pitch; 10.67 mm x 10.67 mm x 5.46 mm body E-PDIP-T8(JEDEC) 2017-06-11
BGA1517 BGA1517, plastic ball grid array package; 1517 balls, 1 mm pitch, 40 mm x 40 mm x 3.36 mm body 2017-12-18
VFBGA361 VFBGA361, plastic, very thin fine-pitch ball grid array; 361 balls; 0.5 mm pitch; 10 mm x 10 mm x 0.8 mm body VFBGA(JEDEC) 2017-06-11
VFBGA176 VFBGA176, plastic, very thin fine-pitch ball grid array; 176 balls; 0.5 mm pitch; 9 mm x 9 mm x 0.86 mm body 2018-07-13
VFBGA36 plastic very thin fine-pitch ball grid array package, 36 balls 2016-03-02
SENSOR6F SENSOR6F, sensor package; 6 terminals; 2.54 mm pitch; 17.78 mm x 29.47 mm x 8.01 mm body E-PSXB-F6(JEDEC) 2017-06-11
SO8 SO8, plastic, small outline package; 8 terminals; 2.54 mm pitch; 10.67 mm x 10.67 mm x 12.96 mm body E-PDSO-F8(JEDEC) 2017-06-11
WLCSP wafer level chip-scale package; 29 bumps; 1.14 x 1.14 x 0.28 mm 2016-10-04
CFM4F CFM4F, ceramic, flange mount flat package; 4 terminals; 9.78 mm x 34.04 mm x 5.13 mm body 2017-06-11
UFLGA64 plastic ultra thin fine-pitch land array package: 64 lands 2016-04-04
TO-220F; SC-67 plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 3 lead TO-220 "full pack" exposed tabs 2002-03-12
VFBGA64 plastic very thin fine-pitch ball grid array package; 64 balls 2016-05-18
HVSON16 HVSON16, plastic, thermal enhanced very thin small outline; no leads; 16 terminals; 0.65 mm pitch; 4 mm x 6 mm x 0.9 mm body NON-JEDEC(JEDEC) 2017-06-11
SO8 SO8, plastic, small outline package; 8 terminals; 2.54 mm pitch; 10.67 mm x 10.67 mm x 12.96 mm body E-PDIP-F8(JEDEC) 2017-10-24
TFBGA265S TFBGA265S, plastic thin fine-pitch ball grid array; 265 balls, 0.75 mm interstitial pitch, 13 mm x 13 mm x 1.04 mm body 2018-09-14
TFBGA265S TFBGA265S, plastic thin fine-pitch ball grid array; 265 balls, 0.75 mm pitch, 13 mm x 13 mm x 1.04 mm body 2017-09-14
DBS27P plastic DIL-bent-SIL(special bent) power package; 27 leads (lead length 6.8 mm) 2016-06-09
VFLGA211 VFLGA211, plastic, very thin fine-pitch land grid array package; 211 balls; 0.5 mm pitch; 9.6 mm x 9.6 mm x 0.805 mm body 2018-12-06
TO-220F plastic, single-ended package; 3 leads; 2.54 mm pitch; 15.5 mm x 10 mm x 4.3 mm body 3-lead TO-220F(JEDEC) 2006-02-14
TO-220F plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 3 lead TO-220 "full pack" 2002-03-12
PLCC44 plastic leaded chip carrier; 44 leads EDR-7319(EIAJ);MS-018(JEDEC);112E10(IEC) 2001-11-14
PLCC44 PLCC44, plastic leaded chip carrier; 44 terminals; 1.27 mm pitch; 16.58 mm x 16.58 mm x 4.57 mm body PQCC-J44(JEDEC) 2017-06-11
WLCSP8 Bumped die with 8 functional bumps; 2.51 mm x 2.51 mm x 0.16 mm 2016-10-04
WLCSP7 WLCSP7, , wafer level chip-size package; 7 terminals; 0 mm pitch; 0.38 mm x 1.47 mm x 0.38 mm body 2017-06-11
CFM2 CFM2, ceramic, flange mount package; 2 terminals; 3.75 mm x 34.04 mm x 3.75 mm body 2016-03-07
WLCSP210 WLCSP210, wafer level chip-size package; 210 terminals; 0.4 mm pitch; 6.33 mm x 6.62 mm x 0.56 mm body 2017-06-11
WLCSP210 WLCSP210, wafer level chip-size package; 210 terminals; 0.4 mm pitch; 6.94 mm x 6.94 mm x 0.56 mm body 2017-06-11
SIL6 SIL6, plastic, DIL-bent-SIL package; 6 terminals; 2.54 mm pitch; 15.56 mm x 15.56 mm x 5.34 mm body E-PSXA-F6(JEDEC) 2017-06-11
HX2QFN20 plastic, thermal enhanced super thin quad flat package; no leads; 20 terminals; 0.4 mm pitch, 3.0 mm x 2.0 mm x 0.35 mm body 2016-06-10
LFBGA393 LFBGA393, plastic, low profile fine-pitch ball grid array; 393 balls; 0.5 mm pitch; 14 mm x 14 mm x 1.11 mm body 2017-06-11
LFBGA393 LFBGA393, plastic, low profile fine-pitch ball grid array; 393 balls; 0.5 mm pitch; 14 mm x 14 mm x 1.38 mm body 2017-06-16
PLCC68 plastic leaded chip carrier; 68 leads EDR-7319(EIAJ);MS-018(JEDEC);112E10(IEC) 2001-11-14
PLCC68 plastic leaded chip carrier; 68 leads; pedestal, 1.27 mm pitch, 24.15 mm x 24.15 mm x 3.56 mm body MO-047(JEDEC);112E10(IEC) 2001-11-14
PLCC68 PLCC68, plastic leaded chip carrier; 68 terminals; 1.27 mm pitch; 24.2 mm x 24.2 mm x 4.57 mm body PQCC-J68(JEDEC) 2017-06-11
UFBGA16 plastic ultra thin fine-pitch ball grid array package; 16 balls 2016-06-16
WLCSP47 wafer level chip-scale package; 47 bumps; 3.20 mm x 3.28 mm x 0.365 mm body 2016-08-01
HX2QFN16 plastic, thermal enhanced super thin quad flat package; no leads; 16 terminals; body 2.6 x 2.6 x 0.35 mm 2016-06-16
WLCSP48 wafer level chip-scale package; 48 bumps; 3.72 mm x 2.79 mm x 0.525 mm (Backside coating included) 2016-10-04
WLCSP48 WLCSP48, wafer level chip-scale package; 48 bumps; 0.4 mm pitch, 2.51 mm x 3.55 mm x 0.5 mm body 2017-12-11
WLCSP48 WLCSP48, wafer level chip-scale package; 48 bumps; 0.4 mm pitch, 2.51 mm x 3.55 mm x 0.525 mm body 2017-12-11
WLCSP48 WLCSP48, wafer level chip-scale package; 48 bumps; 0.4 mm pitch, 2.51 mm x 3.55 mm x 0.50 mm body 2017-12-19
WLCSP48 WLCSP48, wafer level chip-scale package; 48 bumps; 0.4 mm pitch, 2.51 mm x 3.55 mm x 0.525 mm body 2017-12-08
LFBGA141 LFBGA141, plastic, low profile fine-pitch ball grid array; 141 balls; 0.65 mm pitch; 10 mm x 10 mm x 1.38 mm body 2017-06-11
PLCC84 plastic leaded chip carrier; 84 leads EDR-7319(EIAJ);MS-018(JEDEC);112E13(IEC) 2001-11-14
PLCC84 plastic leaded chip carrier; 84 leads; pedestal, 1.27 mm pitch, 29.24 mm x 29.24 mm x 3.68 mm body MO-047(JEDEC);112E13(IEC) 2001-11-14
PLCC84 PLCC84, plastic leaded chip carrier; 84 terminals; 1.27 mm pitch; 29.28 mm x 29.28 mm x 4 mm body PQCC-J84(JEDEC) 2017-06-11
WLCSP56 wafer level chip-scale package; 56 bumps; 0.35 mm pitch, 2.94 mm x 2.59 mm x 0.415 mm body (backside coating included) 2016-08-09
WLCSP56 WLCSP56, wafer level chip-scale package; 56 bumps; 0.35 mm pitch, 2.95 mm x 2.6 mm x 0.415 mm body (backside coating included) 2019-01-23
CLSON12 CLSON12, ceramic, low-profile small outline package, no lead; 12 terminals; 0.8 mm pitch; 4 mm x 5 mm x 1.365 mm body 2018-12-19
SO14 plastic small outline package; 14 leads; 9.9 mm x 3.9 mm x 1.35 mm body 2016-08-17
X2QFN24 plastic, thermal enhanced super thin quad flat package; no leads; 24 terminals; 2.0 mm x 2.0 mm x 0.35 mm body 2016-08-19
X2QFN16 plastic, thermal enhanced super thin quad flat package; no leads; 16 terminals; 1.6 mm x 1.6 mm x 0.35 mm body 2016-08-19
HLQFP64 plastic, thermal enhanced low profile quad flat package; 64 leads; 14 x 14 x 1.5 mm body; exposed die pad 2016-09-01
BGA1313 BGA1313, ball grid array package, 1313 terminals, 0.75 mm pitch, 29 mm x 29 mm x 2.37 mm body 2019-06-04
VSO56 plastic very small outline package; 56 leads 2003-02-19
VSO56 plastic very small outline package; 56 leads; face down 2003-02-19
WLCSP8 WLCSP8, wafer level chip-scale package; 8 bumps; 0.810 mm x 0.505 mm x 0.23 mm body 2017-03-08
HX2QFN24 plastic, thermal enhanced super thin quad flat package; no leads; 24 terminals; 0.4 mm pitch, 2.4 mm x 3.2 mm x 0.35 mm body 2016-12-16
WLCSP214 WLCSP214, wafer level chip-scale package, 214 terminals, 0.5 mm pitch, 9.418 mm x 7.918 mm x 0.55 mm body 2018-03-28
FBGA448 FBGA448, fine-pitch ball grid array package, 448 terminals, 0.75 mm pitch, 17 mm x 17 mm x 2.46 mm body 2019-06-04
LFLGA54 LFLGA54, plastic low profile, fine pitch, land grid array package; 54 terminals; 0.5 mm pitch; 6 mm x 9.7 mm x 1.17 mm body 2017-01-23
CFM4F CFM4F, ceramic, flange mount flat package; 4 terminals; 5.845 mm x 16.35 mm x 3.975 mm body 2017-06-11
WLCSP56 WLCSP56, wafer level chip-scale package; 56 bumps, 0.4 mm pitch, 4.39 mm x 3.59 mm x 0.5 mm body 2018-02-08
FBGA525 FBGA525, fine-pitch ball grid array package; 525 terminals, 0.8 mm pitch, 19 mm x 19 mm x 2.47 mm body 2017-01-24
FBGA525 FBGA525, fine-pitch ball grid array package; 525 balls, 0.8 mm pitch, 19 mm x 19 mm x 2.37 mm body 2018-10-17
FBGA609 FBGA609, fine-pitch ball grid array package; 609 terminals, 0.8 mm pitch, 21 mm x 21 mm x 2.37 mm body 2019-06-04
WLCSP72 WLCSP72, wafer level chip-scale package; 72 bumps; 0.35 mm pitch, 2.99 mm x 3.54 mm x 0.355 mm body 2018-01-22
WLCSP72 WLCSP72, wafer level chip-scale package; 72 bumps; 3.54 mm x 2.99 mm x 0.365 mm body 2017-02-21
WLCSP72 WLCSP72, wafer level chip-scale package; 72 bumps; 0.35 mm pitch, 3.54 mm x 2.99 mm x 0.49 mm body 2018-04-27
WLCSP72 WLCSP72, wafer level chip-scale package; 72 bumps; 3.54 mm x 2.99 mm x 0.365 mm body (backside coating included) 2019-07-04
HQFN24 HQFN24, thermal enhanced quad flat package, no leads, step-cut wettable flank, 24 terminals, 0.8 mm pitch, 6 mm x 6 mm x 1.98 mm body 2018-12-25
HQFN24 HQFN24, thermal enhanced quad flat package, no leads, 0.1 dimple wettable flank, 24 terminals, 0.8 mm pitch, 6 mm x 6 mm x 1.98 mm body 2019-07-26
HQFN24 HQFN24, thermal enhanced quad flat package, no leads, 0.1 dimple wettable flank, 24 terminals, 0.8 mm pitch, 6 mm x 6 mm x 2.2 mm body 2019-07-26
WLCSP41 WLCSP41, wafer level chip-scale package; 41 bumps; 1.500 mm x 1.455 mm x 0.275 mm body 2017-06-14
HX2QFN HX2QFN16, plastic, thermal enhanced super-thin quad; flat non-leaded package; 16 terminals; 0.4 mm pitch; 2.3 mm x 2.3 mm x 0.38 mm body 2017-06-14
LFBGA249 LFBGA249, plastic low profile fine-pitch ball grid array package; 249 balls; 12.0 mm x 12.0 mm x 1.30 mm body 2017-08-17
SIL13P plastic single in-line power package; 13 leads 2003-03-12
SIL3 SIL3, plastic DIL-bent-SIL package, 3 terminals; 5.44 mm pitch; 15.92 mm x 20.96 mm x 5.07 mm body 2019-02-13
HQFN24 plastic thermal enhanced quad flat package; no leads, 0.1 dimple wettable flank; 24 terminals; 0.5 mm pitch, 4 mm x 4 mm x 1.98 mm body 2019-06-27
HQFN24 plastic thermal enhanced quad flat package; no leads; 24 terminals; 0.5 mm pitch, 4 mm x 4 mm x 1.98 mm body 2019-07-12
FBGA417 FBGA417, fine-pitch ball grid array package, 417 terminals, 0.8 mm pitch, 17 mm x 17 mm x 2.58 mm body 2019-06-04
HQFN36 HQFN36, plastic, thermal enhanced quad flatpack; no leads; 36 terminals; 0.8 mm pitch; 12 mm x 12 mm x 2.1 mm body I-PQFP-N36(JEDEC) 2017-06-11
HLLGA17R HLLGA17R, thermal enhanced low profile land grid array package, 17 terminals, 0.65 mm pitch, 4 mm x 3 mm x 1.348 mm body 2019-02-18
HX2QFN14 HX2QFN14, plastic thermal enchanced super thin quad flat package; no leads; 14 terminals; 3.5 mm x 3.5 mm x 0.32 mm body 2017-07-24
SIL3 SIL3, plastic, DIL-bent-SIL package; 3 terminals; 2.54 mm pitch; 14.32 mm x 9.96 mm x 2.50 mm body 2019-02-13
HQFN23 HQFN23, thermal enhanced qual flat package, no leads, 23 terminals, 0.9 mm pitch, 12 mm x 12 mm x 2.1 mm body 2018-07-03
HQFN23 HQFN23, thermal enhanced qual flat package, no leads, 23 terminals, 0.9 mm pitch, 12 mm x 12 mm x 2.1 mm body 2018-07-16
FBGA780 FBGA780, plastic, fine-pitch ball grid array; 780 balls, 0.65 mm pitch, 19 mm x 19 mm x 2.37 mm body 2017-09-14
WLCSP40 WLCSP40, wafer level chip-scale package; 40 bumps; 0.4 mm pitch; 2.25 mm x 3.45 mm x 0.525 mm body (backside coating included) 2017-09-13
VFBGA100 VFBGA100, very thin fine-pitch ball grid array package, 100 terminals, 0.5 mm pitch, 6 mm x 6 mm x 0.8 mm body 2018-04-03
VFBGA180 VFBGA180, plastic, very thin fine pitch ball grid array; 180 bumps; 0.5 mm pitch; 8 mm x 8 mm x 0.86 mm body 2017-10-12
HWFLGA36 HWFLGA36, plastic thermal enhanced very very thin fine-pitch land grid array package, 0.4 mm pitch, 2.1 mm x 6 mm x 0.637 mm body 2018-09-03
SIP4 plastic single-ended flat package; 4 in-line leads 1997-06-02
WLCSP72 WLCSP72, wafer level chip-scale package, 72 bumps, 4.46 mm x 3.96 mm x 0.53 mm body 2017-10-05
FBGA1150 FBGA1150, plastic, fine-pitch ball grid array package, 1150 balls, 0.65 mm pitch, 23 mm x 23 mm x 2.37 mm body 2019-06-13
PLLMC14 PLLMC14, plastic leadless module carrier, 14 terminals, 2.6 mm pitch, 15 mm x 12.8 mm x 0.39 mm body 2019-01-25
FBAG352 FBGA352, plastic fine-pitch ball grid array package, 352 balls, 0.8 mm pitch, 17 mm x 17 mm x 1.63 mm body 2017-11-28
XQFN16 XQFN16, plastic, extremely thin quad flat package; no leads; 16 terminals; 0.4 mm pitch, 2.2 mm x 2.8 mm x 0.50 mm body 2017-12-07
WLCSP43 WLCSP43, wafer level chip-scale package; 43 bumps; 0.4 mm pitch, 4.045 mm x 3.16 mm x 0.38 mm body 2018-04-12
FBAG501 FBGA501, plastic fine-pitch ball grid array package, 501 balls, 0.8 mm pitch, 21 mm x 21 mm x 1.63 mm body 2017-12-12
HUQFN18 plastic thermal enhanced ultra thin quad flat package; no leads; 18 terminals; 0.4 mm pitch, 2.6 mm x 2.6 mm x 0.55 mm body 2019-03-01
HUQFN18 HUQFN18, thermal enhanced ultra thin quad flat package; no leads; step-cut wettable flank, 18 terminals, 0.4 mm pitch, 2.6 mm x 2.6 mm x 0.55 mm body 2019-03-20
RDBS27P RDBS27P, right-angle DIL-bent-SIL package, 27 terminals, 1.0 mm pitch, 15.9 mm x 29.1 mm x 4.5 mm body 2018-01-17
LFBGA485 LFBGA485, plastic, low profile fine-pitch ball grid array package; 485 balls; 0.5 mm pitch; 14 mm x 14 mm x 1.25 mm body 2018-01-12
VFBGA42 VFBGA42, plastic very thin fine-pitch ball grid array package, 42 balls, 0.4 mm pitch, 2.6 mm x 3 mm x 0.9 mm body 2018-02-01
WLCSP8 WLCSP8, wafer level chip-scale package, 8 terminals, 0.205 mm pitch, 1.16 mm x 0.86 mm x 0.48 mm body 2018-03-07
WLCSP81 WLCSP81, wafer level chip-scale package; 81 bumps; 0.35 mm pitch, 3.55 mm x 3.36 mm x 0.365 mm body 2018-02-12
WLCSP81 WLCSP81, wafer level chip-scale package; 81 bumps; 0.35 mm pitch, 3.55 mm x 3.36 mm x 0.365 mm body (backside coating included) 2018-03-14
LFBGA486 LFBGA486, low profile fine-pitch ball grid array, 486 balls, 0.5 mm pitch, 14 mm x 14 mm x 1.15 mm body 2018-08-02
LFBGA486 LFBGA486, low profile fine-pitch ball grid array, 486 balls, 0.5 mm pitch, 14 mm x 14 mm x 1.15 mm body 2018-03-01
LFBGA196 LFBGA196, low profile fine pitch ball grid array, 196 terminals, 0.8 mm pitch, 12 mm x 12 mm x 1.37 mm body 2018-03-26
HX2QFN20 HX2QFN20, thermal enhanced super thin quad flat package; no leads; 20 terminals, 0.4 mm pitch, 3.0 mm x 3.0 mm x 0.32 mm body MO-288(JEDEC) 2019-05-16
WLCSP68 WLCSP68, wafer level chip-scale package, 68 terminals; 0.35 mm pitch, 3.78 mm x 3.06 mm x 0.49 mm body (backside coating included) 2018-05-16
VFBGA115 VFBGA115, very thin, fine-pitch ball grid array package, 0.5 mm pitch, 7 mm x 7 mm x 0.86 mm body 2018-05-18
FBAG957 FBGA957, fine-pitch ball grid array package, 0.65 mm pitch, 21 mm x 21 mm x 2.37 mm body 2018-05-18
FBGA187 FBGA187, fine-pitch ball grid array package, 187 terminals, 0.5 mm pitch, 9 mm x 9 mm x 1.87 mm body 2018-05-28
WLCSP36 WLCSP36, wafer level chip scale package, 36 terminals, 1.63 mm x 1.53 mm x 0.225 mm body 2018-10-16
VFBGA98 VFBGA98, very thin fine-pitch ball grid array package, 98 terminals, 0.5 mm pitch, 7 mm x 7 mm x 0.86 mm body 2018-09-26
VFBGA36 VFBGA36, very thin fine-pitch ball grid array package, 36 terminals, 0.5 mm pitch, 3.5 mm x 3.5 mm x 0.8 mm body 2018-06-28
X2SON8 X2SON8, super thin small outline package, no leads; 8 terminals; 0.35 mm pitch; 1.4 mm x 1.0 mm x 0.32 mm body 2018-08-06
LFBGA269 LFBGA269, low-profile fine-pitch ball grid array package, 269 terminals, 0.8 mm pitch, 14 mm x 14 mm x 1.37 mm body 2018-07-06
TO-247F plastic single-ended package; heatsink mounted; 1 mounting hole; 3 lead TO-247 "full pack" 3-lead TO-247F(JEDEC) 1999-09-13
HLLAG33R HLLGA33R, thermal enhanced low profile land grid array, 33 terminals, 0.8 mm pitch, 10 mm x 6 mm x 1.365 mm body 2018-08-22
HTQFN24 HTQFN24, thermal enhanced thin quad flat package; no leads; step-cut wettable flank; 24 terminals, 0.5 mm pitch, 4 mm x 4 mm x 1 mm body 2019-01-03
HTQFN24 HTQFN24, thermal enhanced thin quad flat package; no leads; dimple wettable flank; 24 terminals, 0.5 mm pitch, 4 mm x 4 mm x 1 mm body 2019-04-11
HTQFN24 HTQFN24, thermal enhanced thin quad flat package; no leads; step-cut wettable flank; 24 terminals, 0.5 mm pitch, 4 mm x 4 mm x 1 mm body 2019-01-15
HLSON16 HLSON16, thermal enhanced low profile small outline; no leads, 16 terminals, 0.125 dimple wettable flank, 0.5 mm pitch, 4.5 mm x 3.5 mm x 1.45 mm body 2019-02-12
FBGA477 FBGA477, fine-pitch ball grid array package, 477 terminals, 0.75 mm pitch, 17 mm x 17 mm x 2.03 mm body 2018-09-21
WLCSP40 WLCSP40, wafer level chip scale package, 40 terminals, 1.83 mm x 1.62 mm x 0.225 mm body 2018-10-16
WLCSP12 WLCSP12, wafer level chip scale package; 12 terminals, 0.5 mm pitch, 2.06 mm x 2.018 mm x 0.6 mm body 2019-06-11
FM8F FM8F, flange mount package, 8 terminals, 5.16 mm pitch, 9.6 mm x 20.395 mm x 3.965 mm body 2019-04-18
FM8F FM8F, flange mount package, 8 terminals, 5.16 mm pitch, 9.6 mm x 20.395 mm x 4.25 mm body 2019-04-18
WFBGA249 WFBGA249, very-very thin, fine-pitch, ball grid array package, 249 terminals, 0.4 mm pitch, 7 mm x 7 mm x 0.725 mm body 2018-11-19
FM6F FM6F, flange mount package, 6 terminals, 20.4 mm x 9.8 mm x 4.26 mm body 2019-04-18
FBGA388 FBGA388, fine-pitch ball grid array package, 388 terminals, mixed pitch (min = 0.56 mm), 15 mm x 15 mm x 1.54 mm body, customized array 2019-06-20
FBGA388 FBGA388, fine-pitch ball grid array package, 388 terminals, mixed pitch (min = 0.56 mm), 15 mm x 15 mm x 1.96 mm body, customized array 2019-05-01
WLCSP36 WLCSP36, wafer level chip scale package, 36 terminals, 0.3 mm pitch, 1.895 mm x 1.895 mm x 0.38 mm body (backside coating included) 2019-02-25
LFBGA164 LFBGA164, low profile fine-pitch ball grid array package, 164 terminals, 0.5 mm pitch, 8 mm x 8 mm x 1.146 mm body 2019-06-18
HWFLGA16 HWFLGA16, thermal enhanced very-very thin fine-pitch land grid array package, 16 terminals, 0.4 mm pitch, 2 mm x 2 mm x 0.637 mm body 2019-04-26
SIL5 SIL5, single in-line package, 5 terminals, 1.27 mm pitch, 8.0 mm x 4.65 mm x 2.65 mm body 2019-04-01
X2SON8 X2SON8, super thin small outline; no leads, 8 terminals, 0.35 mm pitch, 1.35 mm x 1 mm x 0.32 mm body MO-287(JEDEC) 2019-06-11
X2SON4 X2SON4, super thin small outline; no leads, 4 terminals, 0.65 mm pitch, 1.6 mm x 1.6 mm x 0.32 mm body MO-287(JEDEC) 2019-04-04
HLLGA31R HLLGA31R, thermal enhanced low profile land grid array package, 31 terminals, 1 mm pitch, 10 mm x 8 mm x 1.365 mm body 2019-03-26
BGA548 BGA548, ball grid array package, 548 terminals, 0.5 mm pitch, 15 mm x 15 mm x 1.94 mm body 2019-05-09
HWFLGA38 HWFLGA38, thermal enhanced very very thin fine-pitch land grid array package, 38 terminals, 0.35 mm pitch, 4 mm x 3 mm x 0.645 mm body 2019-05-13
FM6F FM8F, flange mount package, 6 terminals, 9.14 mm pitch, 19.455 mm x 32.255 mm x 3.81 mm body 2019-07-11
FBGA957 FBGA957, fine-pitch ball grid array package; 957 terminals, 0.65 mm pitch, 21 mm x 21 mm x 2.16 mm body 2019-06-03
FBGA780 FBGA780, fine-pitch ball grid array package, 780 terminals, 0.65 mm pitch, 19 mm x 19 mm x 2.16 mm body 2019-06-06
WLCSP48 WLCSP48, wafer level chip-scale package; 48 bumps; 3.15 mm x 2.89 mm x 0.38 mm body 2019-08-13
FBGA576 FBGA576, fine-pitch ball grid array package, 576 terminals, 0.75 mm pitch, 19 mm x 19 mm x 2.011 mm body 2019-06-25
FBGA621 FBGA621, plastic, fine-pitch ball grid array package; 621 balls; 0.8 mm pitch; 21 mm x 21 mm x 2.37 mm body 2019-08-30
HLSON6 HLSON6, thermal enhanced low profile small outline package, no leads, 6 terminals, 1.3 mm pitch, 4.5 mm x 4.0 mm x 1.2 mm body 2019-08-01
QFP44 plastic quad flat package; 44 leads (lead length 2.35 mm); body 14 x 14 x 2.2 mm 133E01(IEC) 2003-02-25
DIP24 plastic, dual in-line package; 24 leads; 2.54 mm pitch, 31.7 mm x 6.5 mm x 4.7 mm body MS-001(JEDEC) 2003-03-12
SC-73 plastic, surface-mounted package with increased heatsink; 4 leads; 4.6 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body SC-73(EIAJ) 2006-03-16
SO4 plastic small outline package; 4 leads; body width 3.5 mm TO-261(JEDEC) 2003-02-19
I2PAK plastic, single-ended package (I2PAK); 3 terminals; 2.54 mm pitch; 11 mm x 10 mm x 4.3 mm body TO-262(JEDEC) 2009-08-25
I2PAK plastic single-ended package (I2PAK); TO-262 TO-262(JEDEC) 2009-08-25
I2PAK plastic, single-ended package (I2PAK); 3 leads; 2.54 mm pitch; 11 mm x 10 mm x 4.5 mm body 2016-06-08
I2PAK plastic, single-ended package (I2PAK); 3 leads; 2.54 mm pitch; 11 mm x 10 mm x 4.5 mm body 2016-08-08
TO-236AB plastic, surface-mounted package; 3 terminals; 1.9 mm pitch; 2.9 mm x 1.3 mm x 1 mm body TO-236AB(JEDEC) 2006-03-16
SDIP32 plastic shrink dual in-line package; 32 leads (400 mil) 2003-02-13
SDIP32 SDIP32, plastic, shrink dual in-line package; 32 terminals; 1.778 mm pitch; 9.9 mm x 28.1 mm x 4.9 mm body E-PDIP-T32(JEDEC) 2017-06-11
SDIP24 plastic shrink dual in-line package; 24 leads (400 mil) 2003-02-13
PLCC52 plastic leaded chip carrier; 52 leads EDR-7319(EIAJ);MS-018(JEDEC);112E11(IEC) 2001-11-15
PLCC52 plastic leaded chip carrier; 52 leads; pedestal, 1.27 mm pitch, 19.1 mm x 19.1 mm x 4.38 mm body MO-047(JEDEC);112E11(IEC) 2001-11-15
PLCC52 PLCC52, plastic leaded chip carrier; 52 terminals; 1.27 mm pitch; 19.12 mm x 19.12 mm x 4.57 mm body PQCC-J52(JEDEC) 2017-06-11
DIP48 plastic dual in-line package; 48 leads (600 mil) MS-011(JEDEC) 2003-02-13
DBS17P plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) 2003-03-12
DBS17P plastic DIL-bent-SIL power package; 17 leads (lead length 7.7 mm) 2003-03-12
SDIP52 plastic shrink dual in-line package; 52 leads (600 mil) MS-020(JEDEC) 2003-02-13
CPGA68 ceramic pin grid array package; 68 pins; body 27.9 x 27.9 x 2.4 mm 2002-11-01
CPGA84 ceramic pin grid array package; 84 pins; body 27.9 x 27.9 x 2.3 mm 2002-11-01
CPGA120 ceramic pin grid array package; 120 pins; body 33.5 x 33.5 x 2.6 mm 2002-11-01
PLCC28 plastic, leaded chip carrier; 28 leads; 1.27 mm pitch; 11.48 mm x 11.48 mm x 4.38 mm body EDR-7319(EIAJ);MS-018(JEDEC);112E08(IEC) 2001-11-15
PLCC28 plastic leaded chip carrier; 28 leads; pedestal, 1.27 mm pitch, 11.5 mm x 11.5 mm x 4.38 mm body MO-047(JEDEC);112E08(IEC) 2001-11-15
TO-220-5 plastic, single-ended package; 5 leads; 1.7 mm pitch; 15.5 mm x 10 mm x 4.3 mm body 5-lead TO-220(JEDEC) 2006-02-14
TO-220-5 option plastic single-ended package; heatsink mounted; 1 mounting hole; 5-lead TO-220 lead form option 5-lead TO-220(JEDEC) 2006-02-14
TO-220-5 plastic, single-ended package (heatsink mounted, 1 mounting hole); 5 leads; 1.7 mm pitch; 15.5 mm x 10 mm x 4.3 mm body 5-lead TO-220(JEDEC) 2001-01-11
TO-220-5 option plastic, single-ended package; 5 leads; 1.7 mm pitch; 15.5 mm x 10 mm x 4.3 mm body 5-lead TO-220(JEDEC) 2001-01-11
SSOP20 plastic shrink small outline package; 20 leads; body width 4.4 mm MO-152(JEDEC) 2003-02-19
DIP14 plastic, dual in-line package; 14 leads; 2.54 mm pitch; 19 mm x 6.35 mm x 4.2 mm body SC-501-14(EIAJ);MO-001(JEDEC);050G04(IEC) 2003-02-13
SDIP42 plastic shrink dual in-line package; 42 leads (600 mil) MS-020(JEDEC) 2003-02-13
SDIP42 SDIP42, plastic, shrink dual in-line package; 42 terminals; 1.778 mm pitch; 13.97 mm x 36.83 mm x 5.08 mm body E-PDIP-T42(JEDEC) 2017-06-11
SDIP64 plastic shrink dual in-line package; 64 leads (750 mil) MS-021(JEDEC) 2003-02-13
SDIP64 plastic shrink dual in-line package; 64 leads (750 mil); face down MS-021(JEDEC) 2006-02-24
TO-220 plastic single-ended package; 5-lead low-profile TO-220 1997-06-11
SO32 plastic small outline package; 32 leads; body width 7.5 mm MO-119(JEDEC) 2003-02-19
QFP44 plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm 2003-02-25
QFP80 plastic quad flat package; 80 leads (lead length 1.6 mm); body 14 x 20 x 3.0 mm MS-022(JEDEC);112E08(IEC) 2003-02-25
LQFP48 plastic, low profile quad flat package; 48 leads; 0.5 mm pitch; 7 mm x 7 mm x 1.4 mm body MS-026(JEDEC);136E05(IEC) 2003-02-25
LQFP48 LQFP48, plastic, low profile quad flat package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1.4 mm body L-PQFP-G48(JEDEC) 2017-06-11
LQFP64 plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm MS-026(JEDEC);136E10(IEC) 2003-02-25
LQFP80 plastic low profile quad flat package; 80 leads; body 12 x 12 x 1.4 mm MS-026(JEDEC) 2003-02-25
LQFP80 LQFP80, plastic, low profile quad flat package; 80 terminals; 0.5 mm pitch; 12 mm x 12 mm x 1.6 mm body FL-PQFP-G80(JEDEC) 2017-06-11
SQFP208 plastic shrink quad flat package; 208 leads (lead length 1.3 mm); body 28 x 28 x 3.4 mm; high stand-off height MS-029(JEDEC) 2003-02-25
QFP100 plastic quad flat package; 100 leads (lead length 1.95 mm); body 14 x 20 x 2.7 mm; high stand-off height MO-112(JEDEC) 2003-02-25
QFP100 plastic quad flat package; 100 leads (lead length 1.95 mm); 0.65 mm pitch, 14 mm x 20 mm x 2.8 mm body MO-112(JEDEC) 2003-02-25
QFP100 plastic quad flat package; 100 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm MO-112(JEDEC) 2003-02-25
QFP80 plastic quad flat package; 80 leads (lead length 1.95 mm); body 14 x 20 x 2.7 mm; high stand-off height MO-112(JEDEC) 2003-02-25
QFP80 plastic quad flat package; 80 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm MO-112(JEDEC) 2003-02-25
QFP80 plastic quad flat package; 80 leads (lead length 1.95 mm; slope angle 60 deg); body 14 x 20 x 2.8 mm 2003-02-25
QFP64 plastic quad flat package; 64 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm MO-112(JEDEC) 2003-02-25
TO-126 plastic single-ended leaded (through hole) package; mountable to heatsink, 1 mounting hole; 3 leads TO-126(JEDEC) 1997-03-04
QFP128 plastic quad flat package; 128 leads (lead length 1.6 mm); body 28 x 28 x 3.4 mm; high stand-off height MS-022(JEDEC);134E13(IEC) 2003-02-25
QFP128 plastic quad flat package; 128 leads (lead length 1.95 mm); body 28 x 28 x 3.4 mm; lead angle 60 deg MO-112(JEDEC) 2003-02-19
QFP160 plastic quad flat package;160 leads (lead length 1.95 mm); body 28 x 28 x 3.4 mm; high stand-off height MO-112(JEDEC) 2003-02-25
QFP160 plastic quad flat package; 160 leads (lead length 1.6 mm); body 28 x 28 x 3.4 mm; high stand-off height MS-022(JEDEC);135E12(IEC) 2003-02-25
QFP160 plastic quad flat package;160 leads (lead length 1.95 mm); body 28 x 28 x 3.4 mm; lead angle 60 deg MO-112(JEDEC) 2004-09-13
QFP160 QFP160, plastic, quad flat package; 160 terminals; 0.65 mm pitch; 28 mm x 28 mm x 3.3 mm body PQFP-G160(JEDEC) 2017-06-11
SC-70 plastic, surface-mounted package; 3 leads; 1.3 mm pitch; 2 mm x 1.25 mm x 0.95 mm body SC-70(EIAJ) 2006-03-16
SQFP240 plastic shrink quad flat package; 240 leads (lead length 1.3 mm); body 32 x 32 x 3.4 mm; high stand-off height MS-029(JEDEC) 2003-05-21
SSOP14 plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body MO-150(JEDEC) 2003-02-19
SSOP16 plastic, shrink small outline package; 16 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body MO-150(JEDEC) 2003-02-19
SSOP16 SSOP16, plastic, shrink small outline package; 16 terminals; 0.65 mm pitch; 5.3 mm x 5.45 mm x 2 mm body 2017-06-11
SSOP20 plastic, shrink small outline package; 20 leads; 0.65 mm pitch; 7.2 mm x 5.3 mm x 2 mm body MO-150(JEDEC) 2003-02-19
SSOP20 SSOP20, plastic, shrink small outline package; 20 terminals; 0.65 mm pitch; 5.3 mm x 7.2 mm x 1.8 mm body 2017-06-11
SSOP24 plastic, shrink small outline package; 24 leads; 0.65 mm pitch; 8.2 mm x 5.3 mm x 2 mm body MO-150(JEDEC) 2003-02-19
SSOP28 plastic, shrink small outline package; 28 leads; 0.65 mm pitch; 10.2 mm x 5.3 mm x 2 mm body MO-150(JEDEC) 2003-02-19
DFP4 Plastic surface-mounted flat pack package; 4 leads 2006-03-16
SO4 plastic surface-mounted package; 4 leads 2006-03-16
CMPAK-4 plastic surface-mounted package; reverse pinning; 4 leads 2006-03-16
SMT3; MPAK plastic, surface-mounted package; 3 leads; 1.9 mm pitch; 2.9 mm x 1.5 mm x 1.15 mm body SC-59A(EIAJ);TO-236(JEDEC) 2006-03-16
QFP120 plastic quad flat package; 120 leads (lead length 1.6 mm); body 28 x 28 x 3.4 mm; high stand-off height MS-022(JEDEC);134E11(IEC) 2003-02-25
RBS9MPF plastic rectangular-bent single in-line medium power package with fin; 9 leads 2003-03-12
SOT353 plastic, surface-mounted package; 5 leads; 1.3 mm pitch; 2 mm x 1.25 mm x 0.95 mm body SC-88A(EIAJ) 2006-03-16
TSSOP5 plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body SC-88A(EIAJ);MO-203(JEDEC) 2003-02-19
SMS9P plastic surface-mounted single in-line power package; 9 leads 2006-03-16
TSSOP24 plastic, thin shrink small outline package; 24 leads; 0.65 mm pitch; 7.8 mm x 4.4 mm x 1.1 mm body MO-153(JEDEC) 2003-02-19
TQFP64 plastic thin quad flat package; 64 leads; body 10 x 10 x 1.0 mm MS-026(JEDEC);137E10(IEC) 2002-03-14
LQFP32 plastic low profile quad flat package; 32 leads; body 7 mm x 7 mm x 1.4 mm MS-026(JEDEC);136E03(IEC) 2005-11-09
LQFP plastic, low profile quad; flat leaded package; 32 terminals; 0.80 mm pitch; 7 x 7 x 1.4 mm body (EIAJ);MS-026 BBA(JEDEC);IEC 2016-06-06
LQFP plastic, low profile quad; flat leaded package; 32 terminals; 0.80 mm pitch; 7 mm x 7 mm x 1.4 mm body 2016-05-19
TSSOP20 plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body MO-153(JEDEC) 2003-02-19
TSSOP20 TSSOP20, plastic, thin shrink small outline package; 20 terminals; 0.65 mm pitch; 4.4 mm x 6.5 mm x 1.05 mm body TS-PDSO-G20(JEDEC) 2017-06-11
TSSOP28 plastic thin shrink small outline package; 28 leads; body width 4.4 mm MO-153(JEDEC) 2003-02-19
TSSOP28 TSSOP28, plastic, thin shrink small outline package; 28 terminals; 0.65 mm pitch; 4.4 mm x 9.7 mm x 0.95 mm body MO-153 AE(JEDEC) 2016-03-08
TSSOP48 plastic, thin shrink small outline package; 48 leads; 0.5 mm pitch; 12.8 mm x 6.1 mm x 1.2 mm body MO-153(JEDEC) 2003-02-19
TSSOP6 plastic, surface-mounted package; 6 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body SC-88(EIAJ) 2006-03-16
TSSOP56 plastic, thin shrink small outline package; 56 leads; 0.5 mm pitch; 14 mm x 6.1 mm x 1.2 mm body MO-153(JEDEC) 2003-02-19
SSOP16 plastic shrink small outline package; 16 leads; body width 4.4 mm MO-152(JEDEC) 2003-02-19
SSOP48 plastic, shrink small outline package; 48 leads; 0.635 mm pitch; 15.9 mm x 7.5 mm x 2.8 mm body MO-118(JEDEC) 2003-02-19
SSOP56 plastic, shrink small outline package; 56 leads; 0.635 mm pitch; 18.45 mm x 7.5 mm x 2.8 mm body MO-118(JEDEC) 2003-02-18
TQFP80 plastic thin quad flat package; 80 leads; body 12 x 12 x 1 mm MS-026(JEDEC) 2003-02-25
TQFP44 plastic thin quad flat package; 44 leads; body 10 x 10 x 1.0 mm MS-026(JEDEC);137E08(IEC) 2002-03-14
QFP52 plastic quad flat package; 52 leads (lead length 1.6 mm); body 10 x 10 x 2 mm MS-022(JEDEC);135E04(IEC) 2003-02-25
QFP52 plastic, quad flat package; 52 leads; 0.65 mm pitch; 10 mm x 10 mm x 2 mm body MS-022(JEDEC) 2003-02-25
DIP16 plastic dual in-line package; 16 leads (300 mil); long body SC-503-16(EIAJ);MO-001(JEDEC);050G09(IEC) 2003-02-13
DIP16 DIP16, plastic, dual in-line package; 16 terminals; 2.54 mm pitch; 6.6 mm x 19.18 mm x 4.44 mm body E-PDIP-T16(JEDEC) 2017-06-11
DIP16 plastic, dual in-line package; 16 leads; 2.54 mm pitch; 19 mm x 6.35 mm x 4.2 mm body 2003-02-13
PLCC20 plastic, leaded chip carrier; 20 leads; 1.27 mm pitch; 9 mm x 9 mm x 4.5 mm body EDR-7319(EIAJ);MS-018(JEDEC);112E04(IEC) 2001-11-20
PLLMC plastic leadless module carrier 2003-09-23
TQFP100 plastic thin quad flat package; 100 leads; body 14 x 14 x 1 mm MS-026(JEDEC);137E20(IEC) 2003-02-25
SQFP128 plastic shrink quad flat package;128 leads (lead length 1.6 mm); body 14 x 20 x 2.72 mm 2003-02-25
LQFP44 plastic low profile quad flat package; 44 leads; body 10 x 10 x 1.4 mm MS-026(JEDEC);136E08(IEC) 2002-06-07
LQFP44 LQFP44, plastic, low profile quad flat package; 44 terminals; 0.8 mm pitch; 10 mm x 10 mm x 1.4 mm body L-PQFP-G44(JEDEC) 2017-06-11
CDFM2 flanged ceramic package; 2 mounting holes; 2 leads (EIAJ);(JEDEC);IEC 2010-11-08
CDFM2 flangeless ceramic package; 2 leads 1997-05-29
QFP64 plastic, quad flat package; 64 leads; 0.8 mm pitch; 14 mm x 14 mm x 2.7 mm body MS-022(JEDEC);134E07(IEC) 2003-02-20
HSOP20 plastic, heatsink small outline package; 20 leads, 1.27 mm pitch, 15.9 mm x 11.0 mm x 3.35 mm body 2003-07-23
HSOP20 HSOP20, plastic, heatsink small outline package; 20 terminals; 1.27 mm pitch; 11 mm x 15.9 mm x 3.2 mm body 2017-03-24
HDIP18 plastic heat-dissipating dual in-line package; 18 leads 2003-02-13
TOP-3D plastic single-ended through-hole package; mountable to heatsink; 1 mounting hole; 3 in-line leads 1998-11-06
SDIP56 plastic shrink dual in-line package; 56 leads (600 mil) 2003-02-13
SDIP56 SDIP56, plastic, shrink dual in-line package; 56 terminals; 1.778 mm pitch; 13.97 mm x 52.08 mm x 5.08 mm body E-PDIP-T56(JEDEC) 2017-06-11
LQFP32 plastic low profile quad flat package; 32 leads; body 5 x 5 x 1.4 mm MS-026(JEDEC);136E01(IEC) 2003-02-20
LQFP32 LQFP32, plastic, low profile quad flat package; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 1.4 mm body FL-PQFP-G32(JEDEC) 2017-06-11
TSSOP14 plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body MO-153(JEDEC) 2003-02-18
TSSOP16 plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.1 mm body MO-153(JEDEC) 2003-02-18
TSSOP16 TSSOP16, plastic, thin shrink small outline package; 16 terminals; 0.65 mm pitch; 4.4 mm x 5 mm x 1.05 mm body TS-PDSO-G14(JEDEC) 2017-06-11
TSSOP plastic, thin shrink small outline package; 16 terminals; 0.65 mm pitch; 5 mm x 4.4 mm x 1.05 mm body 2016-05-26
D2PAK plastic, single-ended surface-mounted package (D2PAK); 3 terminals (one lead cropped); 2.54 mm pitch; 11 mm x 10 mm x 4.3 mm body 2013-02-25
D2PAK plastic, single-ended surface-mounted package (D2PAK); 3 leads; 2.54 mm pitch; 11 mm x 10 mm x 4.3 mm body 2013-03-12
LQFP100 LQFP100, plastic low profile quad flat package; 100 leads; 0.5 mm pitch, 14 mm x 14 mm x 1.4 mm body MS-026(JEDEC);136E20(IEC) 2003-02-20
LQFP100 LQFP100, plastic, low profile quad flat package; 100 terminals; 0.5 mm pitch; 14 mm x 14 mm x 1.4 mm body FL-PQFP-G100(JEDEC) 2017-06-11
LQFP100 LQFP100, plastic, low profile quad flat package; 100 terminals; 0.5 mm pitch; 14 mm x 14 mm x 1.7 mm body FL-PQFP-G100(JEDEC) 2017-06-11
CDIP8 ceramic surface mounted package; 8 leads 2001-03-01
CDIP8 ceramic surface mounted package; 8 leads 1998-01-27
DBS23P plastic DIL-bent-SIL power package; 23 leads (straight lead length 3.2 mm) 2002-04-24
DBS23P plastic DIL-bent-SIL power package; 23 leads (lead length 12 mm) 2002-04-24
LQFP64 plastic low profile quad flat package; 64 leads; body 7 x 7 x 1.4 mm MS-026(JEDEC);136E06(IEC) 2003-02-20
SC-75 plastic, surface-mounted package; 3 leads; 1 mm pitch; 1.6 mm x 0.75 mm x 0.9 mm body SC-75(EIAJ) 2013-06-07
HSOP20 plastic, heatsink small outline package; 20 leads; low stand-off height 2003-07-23
HSOP20 plastic, heatsink small outline package; 20 leads; low stand-off height, 1.27 mm pitch, 15.9 mm x 11.0 mm x 3.35 mm body 2003-07-23
HSOP20 plastic, heatsink small outline package; 20 leads; low stand-off height 2005-03-10
LQFP128 plastic low profile quad flat package; 128 leads; body 14 x 14 x 1.4 mm MS-026(JEDEC) 2003-02-20
LQFP128 LQFP128, plastic, low profile quad flat package; 128 terminals; 0.4 mm pitch; 14 mm x 14 mm x 1.4 mm body FL-PQFP-G128(JEDEC) 2017-06-11
LQFP128 plastic low profile quad flat package; 128 leads; body 14 x 20 x 1.4 mm MS-026(JEDEC);136E28(IEC) 2003-02-20
LQFP128 LQFP128, plastic, low profile quad flat package; 128 terminals; 0.5 mm pitch; 14 mm x 20 mm x 1.4 mm body FLR-PQFPG128(JEDEC) 2017-06-11
D2PAK plastic, single-ended surface-mounted package (D2PAK); 5 leads; 1.7 mm pitch; 11 mm x 10 mm x 4.3 mm body 2006-03-16
D2PAK-7 plastic, single-ended surface-mounted package (D2PAK-7); 7 leads; 1.27 mm pitch; 11 mm x 10 mm x 4.3 mm body 2006-03-16
DPAK plastic, single-ended surface-mounted package (DPAK); 3 leads; 2.285 mm pitch; 6 mm x 6.6 mm x 2.3 mm body SC-63(EIAJ);TO-252(JEDEC) 2014-06-10
TO-247 plastic, single-ended through-hole package; 3 leads; 5.45 mm pitch; 20.45 mm x 15.6 mm x 4.95 mm body TO-247(JEDEC) 2013-03-25
HSQFP208 plastic thermal enhanced shrink quad flat package; 208 leads (lead length 1.3 mm); body 28 x 28 x 3.4 mm; high stand-off height; heatsink 2003-02-20
LQFP160 plastic low profile quad flat package; 160 leads; body 24 x 24 x 1.4 mm 2003-02-20
LQFP160 LQFP160, plastic, low profile quad flat package; 160 terminals; 0.5 mm pitch; 24 mm x 24 mm x 1.4 mm body FL-PQFP-G160(JEDEC) 2017-06-11
CRDB4 studless ceramic package; 4 leads 1999-03-29
CRPM4 studded ceramic package; 4 leads 1999-03-29
CDFM2 flanged hermetic ceramic package; 2 mounting holes; 2 leads 1999-03-29
SOJ40 plastic small outline package; 40 leads (J-bent); body width 10.16 mm MS-027(JEDEC) 2003-02-18
SOJ40 plastic small outline package; 40 leads (J-bent); body width 10.16 mm MS-027(JEDEC) 2003-04-08
SIP2 plastic single-ended multi-chip package; magnetized ferrite magnet (3.8 x 2 x 0.8 mm); 4 interconnections; 2 in-line leads 2000-08-31
SIP2 plastic single-ended multi-chip package; magnetized ferrite magnet (8 x 8 x 4.5 mm); 4 interconnections; 2 in-line leads 2000-08-31
SIP2 plastic single-ended multi-chip package; magnetized ferrite magnet (5.5 x 5.5 x 3 mm); 4 interconnections; 2 in-line leads 2000-08-31
SIP2 Plastic single-ended multi-chip package; magnetized ferrite magnet (4.25 x 5.2 x 3 mm); 4 interconnections; 2 in-line leads 2013-11-26+01:00
PLLMC6 palladium plated contact chip card module (super 35 mm tape format, 6-contact, transfer mould technology) (EIAJ);(JEDEC);IEC 2012-09-20
PLLMC6 palladium plated contact chip card module (super 35 mm tape format, 6-contact, transfer mould technology) (EIAJ);(JEDEC);IEC 2012-09-20
TSOP6 plastic, surface-mounted package (TSOP6); 6 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body SC-74(EIAJ) 2006-03-16
LQFP208 plastic low profile quad flat package; 208 leads; body 28 x 28 x 1.4 mm MS-026(JEDEC);136E30(IEC) 2003-02-20
LQFP208 LQFP208, plastic, low profile quad flat package; 208 terminals; 0.5 mm pitch; 28 mm x 28 mm x 1.4 mm body FL-PQFP-G208(JEDEC) 2017-06-11
RDBS13P plastic rectangular-DIL-bent-SIL (reverse bent) power package; 13 leads 2003-03-12
RDBS13P plastic rectangular-DIL-bent-SIL (reverse bent) power package; 13 leads, 1.7 mm pitch, 23.7 mm x 12 mm x 4.5 mm body 2003-03-12
HSQFP240 plastic, heatsink shrink quad flat package; 240 leads; body 32 x 32 x 3.4 mm 1999-11-12
HSQFP240 plastic thermal enhanced shrink quad flat package; 240 leads; body 32 x 32 x 3.4 mm; heatsink 2002-06-19
CDFM2 flanged ceramic package; 2 mounting holes; 2 leads 1999-12-28
HLQFP100 plastic thermal enhanced low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm; heatsink MS-026(JEDEC) 2003-02-20
HLQFP100 plastic thermal enhanced low profile quad flat package; 100 leads; exposed die pad 2015-07-06
HLQFP100 HLQFP100, plastic, thermal enhanced low profile quad flat package; 100 terminals; 0.5 mm pitch; 14 mm x 14 mm x 1.4 mm body 2016-03-18
HLQFP100 plastic, thermal enhanced low profile quad flat package; 100 leads; body 14 mm x 14 mm x 1.6 mm; exposed die pad 2017-03-03
BGA256 plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm MS-034(JEDEC);144E(IEC) 2003-01-22
BGA156 plastic, ball grid array package; 156 balls; 1 mm pitch; 15 mm x 15 mm x 1.15 mm body MS-034(JEDEC);144E(IEC) 2003-01-22
DBS17P plastic DIL-bent-SIL (special bent) power package; 17 leads (lead length 12 mm) 2003-03-12
SIP3 plastic single-ended multi-chip package; magnetized ferrite magnet (3.8 x 2 x 0.8 mm); 4 interconnections; 3 in-line leads 2000-08-31
SIP3 plastic single-ended multi-chip package; magnetized ferrite magnet (8 x 8 x 4.5 mm); 4 interconnections; 3 in-line leads 2000-08-31
SIP3 plastic single-ended multi-chip package; magnetized ferrite magnet (5.5 x 5.5 x 3 mm); 4 interconnections; 3 in-line leads 2000-08-31
SIP3 plastic single-ended multi-chip package; magnetized ferrite magnet (5.5 x 5.5 x 3 mm); 4 interconnections; 3 in-line leads 2003-06-11
TSSOP48 plastic, thin shrink small outline package; 48 leads; 0.4 mm pitch; 9.7 mm x 4.4 mm x 0.9 mm body MO-153(JEDEC) 2003-02-18
TSSOP56 plastic, thin shrink small outline package; 56 leads; 0.4 mm pitch; 11.3 mm x 4.4 mm x 1.2 mm body MO-194(JEDEC) 2001-11-24
LQFP144 plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm MS-026(JEDEC);136E23(IEC) 2003-02-20
LQFP144 LQFP144, plastic, low profile quad flat package; 144 terminals; 0.5 mm pitch; 20 mm x 20 mm x 1.4 mm body FL-PQFP-G144(JEDEC) 2017-06-11
TSSOP32 plastic, thin shrink small outline package; 32 leads; 0.65 mm pitch; 11 mm x 6.1 mm x 0.9 mm body MO-153(JEDEC) 2003-02-18
BGA292 plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm MS-034(JEDEC);144E(IEC) 2003-01-22
SC-89 plastic, surface-mounted package; 3 leads; 1 mm pitch; 1.6 mm x 0.85 mm x 0.7 mm body SC-89(EIAJ) 2006-03-16
QFP80 plastic quad flat package; 80 leads (lead length 1.6 mm); body 14 x 14 x 2.7 mm ED-7311EE(EIAJ);MS-022(JEDEC);135E06(IEC) 2002-10-04
PLLMC plastic leadless module carrier package; 35 mm wide tape 2013-01-16
PLLMC plastic leadless module carrier package; 35 mm wide tape 2006-05-22
PLLMC plastic leadless module carrier package; 35 mm wide tape 2007-10-18
PLLMC plastic leadless module carrier package; 35 mm wide tape 2011-02-18
PLLMC PLLMC, plastic leadless module carrier package; 35 mm wide tape 2017-08-17
TSSOP8 plastic, thin shrink small outline package; 8 leads; 0.65 mm pitch; 3 mm x 3 mm x 1.1 mm body 2003-02-18
TSSOP plastic, thin shrink small outline package; 8 leads; 0.65 mm pitch; 3 mm x 3 mm x 1.1 mm body 2002-01-16
LQFP176 plastic low profile quad flat package; 176 leads; body 24 x 24 x 1.4 mm MS-026(JEDEC);136E25(IEC) 2003-02-20
LQFP176 LQFP176, plastic, low profile quad flat package; 176 terminals; 0.5 mm pitch; 24 mm x 24 mm x 1.4 mm body FL-PQFP-G176(JEDEC) 2017-06-11
HLBGA304 plastic thermal enhanced low profile ball grid array package; 304 balls; body 31 x 31 x 0.9 mm; heatsink MO-149(JEDEC) 2005-09-01
TSSOP38 plastic, thin shrink small outline package; 38 leads; 0.5 mm pitch; 9.7 mm x 4.4 mm x 1.1 mm body MO-153(JEDEC) 2005-11-02
HTQFP80 plastic thermal enhanced thin quad flat package; 80 leads; body 14 x 14 x 1 mm; heatsink 2003-02-20
HTQFP80 HTQFP80, plastic, thermal enhanced thin quad flat package; 80 terminals; 0.65 mm pitch; 14 mm x 14 mm x 1 mm body TS-PQFP-G80(JEDEC) 2017-06-11
SMS13P plastic surface mounted single in-line power package; 13 leads 2003-03-12
SSOP16 plastic, shrink small outline package; 16 leads; 0.635 mm pitch; 4.9 mm x 3.9 mm x 1.73 mm body 2003-02-18
DBS27P plastic DIL-bent-SIL power package; 27 leads (lead length 7.7 mm) 2002-04-24
DBS9P plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad 2003-03-12
DBS7P plastic DIL-bent-SIL power package; 7 leads (lead length 12/11 mm); exposed die pad 2003-03-12
HTSSOP20 plastic thermal enhanced thin shrink small outline package; 20 leads; body width 4.4 mm; exposed die pad MO-153(JEDEC) 2005-11-02
HTSSOP20 TSSOP20EP4.4*6.5*1.1P.65 2017-06-11
RDBS13P plastic rectangular-DIL-bent-SIL power package; 13 leads 2003-03-12
RDBS13P plastic rectangular-DIL-bent-SIL power package; 13 leads 2003-03-12
TSSOP8 plastic, thin shrink small outline package; 8 terminals; 0.65 mm pitch; 3 mm x 4.4 mm x 1.1 mm body MO-153(JEDEC) 2003-02-18
BGA316 plastic ball grid array package; 316 balls; body 27 x 27 x 1.75 mm MS-034(JEDEC);144E(IEC) 2003-01-22
BGA388 plastic, ball grid array package; 388 balls; 1.27 mm pitch; 35 mm x 35 mm x 1.75 mm body MS-034(JEDEC);144E(IEC) 2003-01-23
BGA388 plastic ball grid array package; 388 balls; body 35 x 35 x 1.75 mm MS-034(JEDEC);144E(IEC) 2006-08-24
IPAK plastic, single-ended package (IPAK); 3 leads; 2.285 mm pitch; 6 mm x 6.6 mm x 2.3 mm body TO-251(JEDEC) 2006-02-14
IPAK plastic single-ended package (IPAK); 3 short leads (in line) TO-251(JEDEC) 2008-08-07
LFBGA64 plastic low profile fine-pitch ball grid array package; 64 balls; body 8 x 8 x 1.05 mm 2003-02-05
LFBGA96 plastic, low profile fine-pitch ball grid array package; 96 balls; 0.8 mm pitch; 13.5 mm x 5.5 mm x 1.5 mm body 2003-02-05
LFBGA114 plastic, low profile fine-pitch ball grid array package; 114 balls; 0.8 mm pitch; 16 mm x 5.5 mm x 1.5 mm body 2003-02-05
TO-92 plastic, single-ended leaded (through hole) package; 3 leads; 2.54 mm pitch; 4.6 mm x 3.9 mm x 5.1 mm body SC-43A(EIAJ);TO-92(JEDEC) 2004-11-16
TFBGA56 plastic thin fine-pitch ball grid array package; 56 balls; body 6 x 6 x 0.8 mm MO-195(JEDEC) 2002-06-10
TFBGA64 plastic thin fine-pitch ball grid array package; 64 balls; body 6 x 6 x 0.8 mm MO-195(JEDEC) 2002-04-09
HTQFP48 plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad MS-026(JEDEC) 2004-01-29
HTQFP48 plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad MS-026(JEDEC) 2004-01-29
HTQFP48 plastic thermal enhanced t