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Package Version Package Name Package Description Reference Codes Issue Date
0590B CDIP40 ceramic dual in-line package (600 mil); 40 leads; F: no window; FA: with window 2011-01-17
5678H HUQFN HWQFN
FSL1168-02 SSOP plastic thermal enhanced thin shrink small outline package; 28 leads; body 9.7 x 4.4 x 1.2 mm; lead pitch 0.65 mm (EIAJ);MO-153-AE(JEDEC);IEC 2006-08-18
NAU000 NAU000 Uncased 2009-07-16
OL-74AUP1T97UK WLCSP wafer level chip-scale package; 6 bumps; 0.65 x 0.44 x 0.27 mm 2015-05-06
OL-BGU8004 WLCSP wafer level chip-size package; 6 balls; 0.65 x 0.44 x 0.29 mm 2013-11-04
OL-BGU8006 WLCSP wafer level chip-size package; 6 balls; 0.65 x 0.44 x 0.29 mm 2012-07-25
OL-BGU8H1UK WLCSP wafer level chip-size package; 6 balls; 0.65 x 0.44 x 0.29 mm 2014-08-25
OL-BGU8L1UK WLCSP wafer level chip-size package; 6 balls; 0.65 x 0.44 x 0.29 mm 2014-08-25
OL-BGU8M1UK WLCSP wafer level chip-size package; 6 balls; 0.65 x 0.44 x 0.29 mm 2014-08-25
OL-IP3047CX6 WLCSP Wafer level chip-size package; 6 bumps (3 x 2) ---(EIAJ);---(JEDEC);---(IEC) 2011-06-06
OL-IP3048CX5 WLCSP Wafer level chip-size package; 5 bumps (2-1-2) ---(EIAJ);---(JEDEC);---(IEC) 2011-06-06
OL-IP3053CX10 WLCSP Wafer level chip-size package; 10 bumps (4-2-4) ---(EIAJ);---(JEDEC);---(IEC) 2011-06-06
OL-IP3053CX15 WLCSP Wafer level chip-size package; 15 bumps (6-3-6) ---(EIAJ);---(JEDEC);---(IEC) 2011-06-06
OL-IP3053CX20 WLCSP Wafer level chip-size package; 20 bumps (8-4-8) ---(EIAJ);---(JEDEC);---(IEC) 2011-06-06
OL-IP3053CX5 WLCSP Wafer level chip-size package; 5 bumps (2-1-2) ---(EIAJ);---(JEDEC);---(IEC) 2011-06-06
OL-IP3088CX10 WLCSP Wafer level chip-size package; 10 bumps (4-2-4) ---(EIAJ);---(JEDEC);---(IEC) 2011-06-06
OL-IP3088CX15 WLCSP Wafer level chip-size package; 15 bumps (6-3-6) ---(EIAJ);---(JEDEC);---(IEC) 2011-06-06
OL-IP3088CX20 WLCSP Wafer level chip-size package; 20 bumps (8-4-8) ---(EIAJ);---(JEDEC);---(IEC) 2011-06-06
OL-IP3088CX5 WLCSP Wafer level chip-size package; 5 bumps (2-1-2) ---(EIAJ);---(JEDEC);---(IEC) 2011-06-06
OL-IP3319CX6 WLCSP Wafer level chip-size package; 6 bumps (2 x 3) 2013-06-11
OL-IP3337CX18 WLCSP Wafer level chip-size package; 18 bumps 2011-07-06
OL-IP3338CX24 WLCSP Wafer level chip-size package; 24 bumps 2011-07-06
OL-IP3348CX10 WLCSP Wafer level chip-size package; 10 bumps (4-2-4) ---(EIAJ);---(JEDEC);---(IEC) 2011-06-06
OL-IP3348CX15 WLCSP Wafer level chip-size package; 15 bumps (6-3-6) ---(EIAJ);---(JEDEC);---(IEC) 2011-07-06
OL-IP3348CX20 WLCSP Wafer level chip-size package; 20 bumps (8-4-8) ---(EIAJ);---(JEDEC);---(IEC) 2011-06-07
OL-IP3348CX5 WLCSP Wafer level chip-size package; 5 bumps (2-1-2) ---(EIAJ);---(JEDEC);---(IEC) 2011-06-07
OL-IP4035CX24 WLCSP Wafer level chip-size package; 24 bumps (5 x 5 - A1) ---(EIAJ);---(JEDEC);---(IEC) 2011-05-26
OL-IP4041CX25 WLCSP Wafer level chip-size package; 25 bumps (5 x 5) ---(EIAJ);---(JEDEC);---(IEC) 2011-05-26
OL-IP4043CX5_LF WLCSP Wafer level chip-size package; 5 bumps; 1.12 x 1.12 x 0.70 mm (EIAJ);(JEDEC);IEC 2011-07-18
OL-IP4044CX8 WLCSP Wafer level chip-size package; 8 bumps; 1.49 x 1.46 x 0.70 mm (EIAJ);(JEDEC);IEC 2011-07-18
OL-IP4051CX11 WLCSP Wafer level chip-size package; 11 bumps; 1.96 x 1.44 x 0.70 mm 2005-08-26
OL-IP4052CX20 WLCSP Wafer level chip-size package; 20 bumps; 2.54 x 1.96 x 0.70 mm 2008-11-11
OL-IP4052CX20_LF WLCSP Wafer level chip-size package; 20 bumps; 2.54 x 1.96 x 0.735 mm (EIAJ);(JEDEC);IEC 2011-07-20
OL-IP4060CX16 WLCSP wafer level chip-size package; 16 bumps 2009-03-12
OL-IP4064CX8 WLCSP Wafer level chip-size package; 8 bumps; 1.41 x 1.41 x 0.7 mm 2010-11-02
OL-IP4067CX9 WLCSP Wafer level chip-size package; 5 bumps; 1.46 x 1.52 x 0.70 mm 2011-04-28
OL-IP4080CX20 WLCSP Wafer level chip-size package; 20 bumps; 2.51 x 2.01 x 0.70 mm 2008-11-11
OL-IP4085CX4 WLCSP Wafer level chip-size package; 4 bumps; 0.91 x 0.91 x 0.70 mm 2011-06-06
OL-IP4302CX2 WLCSP Wafer level chip-size package; 2 bumps; 0.52 x 0.72 x 0.42 mm 2008-05-20
OL-IP4303CX4 WLCSP Wafer level chip-size package; 4 bumps; 0.76 x 0.76 x 0.66 mm (EIAJ);(JEDEC);IEC 2010-11-08
OL-IP4307CX4 WLCSP Wafer level chip-size package; 4 bumps; 0.76 x 0.76 x 0.66 mm (EIAJ);(JEDEC);IEC 2011-04-26
OL-IP4309CX9 WLCSP Wafer level chip-size package; 9 bumps; 1.16 x 1.16 x 0.66 mm 2008-09-24
OL-IP4332CX5 WLCSP Wafer level chip-size package; 5 bumps; 0.76 x 1.06 x 0.66 mm 2011-04-28
OL-IP4337CX18 WLCSP WLCSP18: wafer level chip-size package; 18 bumps ---(EIAJ);---(JEDEC);---(IEC) 2011-05-26
OL-IP4338CX24 WLCSP WLCSP24: wafer level chip-size package; 24 bumps ---(EIAJ);---(JEDEC);---(IEC) 2011-05-26
OL-IP4342CX5 WLCSP Wafer level chip-size package; 5 bumps; 0.76 x 1.06 x 0.66 mm 2008-08-15
OL-IP4343CX5_LF WLCSP Wafer level chip-size package; 5 bumps; 0.93 x 0.93 x 0.66 mm (EIAJ);(JEDEC);IEC 2011-07-18
OL-IP4350CX24 WLCSP Wafer level chip-size package; 24 bumps; 2.11 x 1.95 x 0.70 mm 2011-06-06
OL-IP4351CX11 WLCSP Wafer level chip-size package; 11 bumps; 1.61 x 1.21 x 0.70 mm (EIAJ);(JEDEC);IEC 2011-07-18
OL-IP4352CX24 WLCSP Wafer level chip size package; 24 bumps; 2.01 x 2.02 x 0.61 mm 2009-07-06
OL-IP4358CX6 WLCSP Wafer level chip-size package; 6 bumps; 1.16 x 0.76 x 0.68 mm 2008-10-10
OL-IP4359CX4 WLCSP Wafer level chip-size package; 4 bumps; 0.76 x 0.76 x 0.66 mm 2011-06-06
OL-IP4365CX11 WLCSP Wafer level chip-size package; 11 bumps 2011-07-06
OL-IP4366CX8 WLCSP Wafer level chip-size package; 8 bumps (3 x 3 - A1) 2011-07-06
OL-IP4385CX4 WLCSP Wafer level chip-size package; 4 bumps; 0.76 x 0.76 x 0.66 mm 2007-09-03
OL-IP4386CX4 WLCSP Wafer level chip-size package; 4 bumps; 0.76 x 0.76 x 0.66 mm 2011-06-06
OL-IP4387CX4 WLCSP Wafer level chip-size package; 4 bumps; 0.76 x 0.76 x 0.66 mm 2011-06-06
OL-IP4852CX25 WLCSP Wafer level chip-size package; 25 bumps; 2.01 x 2.01 x 0.66 mm 2006-09-23
OL-IP4853CX24 WLCSP Wafer level chip-size package; 24 bumps; 2.01 x 2.01 x 0.66 mm (EIAJ);(JEDEC);IEC 2008-04-14
OL-IP4855CX25 WLCSP Wafer level chip-size package; 25 bumps; 2.01 x 2.01 x 0.66 mm 2013-04-15
OL-LD6938 WLCSP Wafer level chip-size package; 6 bumps (2 x 3) 2013-06-11
OL-LPC1102UK WLCSP Wafer level chip-size package; 16 bumps; 2.17 x 2.32 x 0.6 mm - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2010-10-18
OL-LPC1768UK WLCSP WLCSP100: wafer level chip-scale package; 100 balls; 5.074 x 5.074 x 0.6 mm ---(EIAJ);---(JEDEC);---(IEC) 2013-11-04
OL-LPC5410 WLCSP wafer level chip-scale package; 49 bumps; 3.29 x 3.29 x 0.54 mm (backside coating included) 2014-11-03
OL-NCX8200UK WLCSP wafer chip-scale package; 9 bumps; 1.22 x 1.22 x 0.5 mm 2014-12-16
OL-NTB0104UK WLCSP wafer level chip-size package, 12 bumps ---(EIAJ);---(JEDEC);---(IEC) 2011-06-16
OL-NTS0104UK WLCSP wafer level chip-size package, 12 bumps 2011-07-28
OL-NVT4555UK WLCSP wafer level chip-scale package, 12 balls; 1.19 x 1.62 x 0.56 mm ---(EIAJ);---(JEDEC);---(IEC) 2013-02-26
OL-NVT4857 WLCSP wafer level chip-scale package; 20 bumps; 2.1 x 1.7 x 0.49 mm (Backside coating included) 2015-07-21
OL-NX18P3001UK WLCSP wafer level chip-scale package; 12 bumps; 1.36 x 1.66 x 0.51 mm, 0.4 mm pitch (Backside coating included) 2013-05-23
OL-NX1A4WP WLCSP wafer level chip-scale package; 42 bumps; 3.56 x 3.41 x 0.57 mm (backside coating included) 2015-01-19
OL-NX20P3000UK WLCSP wafer level chip-size package; 16 bumps ---(EIAJ);---(JEDEC);---(IEC) 2011-11-04
OL-NX3DV1066 WLCSP wafer level chip-size package; 16 bumps 2012-01-10
OL-NX3P1107 WLCSP wafer level chip-size package; 4 bumps; 0.96 x 0.96 x 0.55 mm (Backside coating included) ---(EIAJ);---(JEDEC);---(IEC) 2012-07-02
OL-NX3P1107UK WLCSP wafer level chip-size package; 4 bumps ---(EIAJ);---(JEDEC);---(IEC) 2012-07-02
OL-NX3P1108 WLCSP wafer level chip-size package; 4 bumps; 0.96 x 0.96 x 0.55 mm (Backside coating included) ---(EIAJ);---(JEDEC);---(IEC) 2012-07-02
OL-NX3P1108UK WLCSP wafer level chip-size package; 4 bumps; 0.96 x 0.96 x 0.55 mm (Backside coating included) ---(EIAJ);---(JEDEC);---(IEC) 2012-07-02
OL-NX3P190 WLCSP wafer level chip-size package.4 bumps; body 0.76 x 0.76 x 0.51 mm. (Backside Coating included) ---(EIAJ);---(JEDEC);---(IEC) 2011-06-09
OL-NX3P190UK WLCSP wafer level chip-size package; 4 bumps ---(EIAJ);---(JEDEC);---(IEC) 2012-07-02
OL-NX3P191 WLCSP Wafer level chip-size package.4 bumps; body 0.76 x 0.76 x 0.51 mm. (Backside Coating included) ---(EIAJ);---(JEDEC);---(IEC) 2011-06-10
OL-NX3P191UK WLCSP wafer level chip-size package; 4 bumps ---(EIAJ);---(JEDEC);---(IEC) 2012-07-02
OL-NX3P2902B WLCSP wafer level chip-scale package; 4 bumps; 0.77 x 0.77 x 0.51 mm (Backside coating included) ---(EIAJ);---(JEDEC);---(IEC) 2013-04-02
OL-NX5P1000 WLCSP WLCSP12: wafer level chip-scale package; 12 bumps 2013-03-29
OL-NX5P1100 WLCSP WLCSP12: wafer level chip-scale package; 12 bumps; 1.36 x 1.66 x 0.51 mm, 0.4 mm pitch (Backside coating included) 2013-12-20
OL-NX5P2090UK WLCSP Wafer level chip-size package; 9 bumps 2013-03-27
OL-NX5P2190 WLCSP wafer level chip-scale package; 9 bumps; body 1.36 x 1.36 x 0.51 mm (Backside coating included) 2014-02-14
OL-NX5P2924B WLCSP wafer level chip-scale package; 6 bumps; 0.87 x 1.37 x 0.50 mm 2014-01-21
OL-NX5P2924C WLCSP wafer level chip-scale package, 6 bumps; 0.87 x 1.37 x 0.50 mm 2015-04-21
OL-NX5P2924C_NX5P2924D_NX5P2925C WLCSP wafer level chip-scale package, 6 bumps; 0.87 x 1.37 x 0.50 mm 2014-10-16
OL-NX5P2925C WLCSP wafer level chip-scale package, 6 bumps; 0.87 x 1.37 x 0.50 mm 2015-04-21
OL-NX5P3001 WLCSP wafer level chip-scale package; 12 bumps; 1.36 x 1.66 x 0.51 mm, 0.4 mm pitch (Backside coating included) 2013-05-23
OL-NXH1501UK WLCSP wafer level chip-scale package; 39 balls ---(EIAJ);---(JEDEC);---(IEC) 2013-06-06
OL-NXH5104UK WLCSP wafer level chip-scale package; 13 bumps; 2.74 x 2.80 x 0.38 mm 2015-10-05
OL-NXH9003UK WLCSP wafer level chip-scale package; 89 bumps; 3.63 x 3.58 x 0.38 mm (EIAJ);(JEDEC);IEC 2015-04-22
OL-OP567 UC Wire bond die ; 5.47 x 4.47 x 0.24 mm 2008-08-08
OL-OP629_ABD UC Wire bond die; 5 bonding pads; 4.47 x 5.47 x 0.24 mm 2009-08-07
OL-PCA85132U UC Bare die; 197 bumps ---(EIAJ);---(JEDEC);---(IEC) 2011-10-26
OL-PCA85133 UC Bare die; 110 bumps ---(EIAJ);---(JEDEC);---(IEC) 2011-10-26
OL-PCA85232U UC Bare die; 197 bumps ---(EIAJ);---(JEDEC);---(IEC) 2011-09-06
OL-PCA85233 UC Bare die; 110 bumps ---(EIAJ);---(JEDEC);---(IEC) 2011-09-06
OL-PCA8533-1 UC Bare die; 99 bumps 2011-12-05
OL-PCA8538U UC Bare die; 247 bumps ---(EIAJ);---(JEDEC);---(IEC) 2013-01-07
OL-PCA8576DU_2DA UC Bare die; 59 bumps 2011-12-07
OL-PCA9410 WLCSP wafer level chip-scale package; 9 bumps; 1.24 x 1.24 x 0.525 mm (backside coating included) 2015-07-23
OL-PCA9411 WLCSP wafer level chip-scale package; 9 bumps; 1.24 x 1.24 x 0.525 mm (backside coating included) 2015-09-29
OL-PCA9620U UC Bare die; 80 bonding pads ---(EIAJ);---(JEDEC);---(IEC) 2011-11-23
OL-PCE85133 UC Bare die; 110 bumps 2012-02-29
OL-PCF2003DUS WLCSP wafer level chip-scale package; 8 bumps; 1.16 x 0.86 x 0.48 mm 2015-08-17
OL-PCF2119X UC Bare die: 168 bumps ---(EIAJ);---(JEDEC);---(IEC) 2011-11-01
OL-PCF85132U UC Bare die; 197 bumps ---(EIAJ);---(JEDEC);---(IEC) 2011-10-26
OL-PCF85133 UC Bare die; 110 bumps ---(EIAJ);---(JEDEC);---(IEC) 2011-10-26
OL-PCF8523U UC Bare die; 12 bumps (6-6); 1.58 x 2.15 x 0.22 mm 2010-09-27
OL-PCF8531U UC Wire bond die; 248 bonding pads 2011-12-14
OL-PCF8532U UC Bare die; 197 bumps ---(EIAJ);---(JEDEC);---(IEC) 2011-10-26
OL-PCF8533-2 UC Bare die; 99 bumps ---(EIAJ);---(JEDEC);---(IEC) 2011-10-26
OL-PCF8534AU UC Wire bond die; 76 bonding pads ---(EIAJ);---(JEDEC);---(IEC) 2011-10-26
OL-PCF8538U UC Bare die; 247 bumps ---(EIAJ);---(JEDEC);---(IEC) 2013-01-07
OL-PCF8566U UC Wire bond die; 40 bonding pads ---(EIAJ);---(JEDEC);---(IEC) 2011-10-26
OL-PCF8576CU UC Wire bond die; 56 bonding pads ---(EIAJ);---(JEDEC);---(IEC) 2011-10-26
OL-PCF8576DU_2DA UC Bare die; 59 bumps ---(EIAJ);---(JEDEC);---(IEC) 2011-10-26
OL-PCF8576DU_DA UC Wire bond die; 59 bonding pads ---(EIAJ);---(JEDEC);---(IEC) 2011-10-26
OL-PCF8577CU UC Wire bond die; 40 bonding pads ---(EIAJ);---(JEDEC);---(IEC) 2011-11-02
OL-PCF8811MU UC Wire bond die; 248 bonding pads 2011-12-14
OL-PCF8811U UC Wire bond die; 248 bonding pads 2011-12-14
OL-PCT2202 WLCSP wafer level chip-scale package; 6 bumps; 0.69 x 1.09 x 0.38 mm (Backside coating included) 2014-11-19
OL-PEMI4CSP_RT WLCSP Wafer level chip-size package; 10 bumps (4-2-4) 2011-07-06
OL-PEMI4CSP_RW WLCSP Wafer level chip-size package; 10 bumps (4-2-4) 2011-07-06
OL-PEMI6CSP_RT WLCSP Wafer level chip-size package; 15 bumps (6-3-6) 2011-07-06
OL-PEMI6CSP_RW WLCSP Wafer level chip-size package; 15 bumps (6-3-6) 2011-07-06
OL-PEMI8CSP_RT_P WLCSP Wafer level chip-size package; 20 bumps (8-4-8) 2011-07-06
OL-PEMI8CSP_RW_P WLCSP Wafer level chip-size package; 20 bumps (8-4-8) 2011-07-06
OL-PMCM4401UPE WLCSP WLCSP4: wafer level chip-size package; 4 bumps (2 x 2) 2016-06-28
OL-PMCM4401VNE WLCSP WLCSP4: wafer level chip-size package; 4 bumps (2 x 2) 2015-07-07
OL-PMCM440VNE WLCSP WLCSP4: wafer level chip-size package; 4 bumps (2 x 2) 2014-07-02
OL-PMCM440VPE WLCSP WLCSP4: wafer level chip-size package; 4 bumps (2 x 2) (EIAJ);(JEDEC);IEC 2014-06-18
OL-PMCM6501VNE WLCSP WLCSP6: wafer level chip-size package; 6 bumps (3 x 2) 2015-07-07
OL-PMCM6501VPE WLCSP WLCSP6: wafer level chip-size package; 6 bumps (3 x 2) 2015-07-20
OL-PMCM650VNE WLCSP WLCSP6: wafer level chip-size package; 6 bumps (3 x 2) 2015-03-25
OL-PN548 WLCSP wafer level chip-scale package; 42 bumps; 2.88 x 2.80 x 0.54 mm (backside coating included) 2015-08-06
OL-PN549 WLCSP wafer level chip-scale package; 42 bumps; 2.88 x 2.80 x 0.54 mm (backside coating included) 2015-08-06
OL-PN550 WLCSP wafer level chip-scale package; 49 bumps; 3.29 x 3.29 x 0.54 mm (backside coating included) 2015-08-06
OL-SA58635UK WLCSP Wafer level chip-size package; 16 balls; 1.7 x 1.7 x 0.56 mm 2010-01-19
OL-SA58671UK WLCSP Wafer level chip-size package; 16 balls; 2.06 x 2.11 x 0.6 mm 2007-10-17
OL-SA58672UK WLCSP Wafer level chip-size package; 9 bumps; 1.66 X 1.71 X 0.6 mm 2008-06-12
OL-TA111 UC Bare die; 5.5 mm x 4.5 mm (EIAJ);(JEDEC);IEC 2012-11-21
OL-TA150KGD UC Bare die; 7.5mm x 4.6 mm 2012-11-21
OL-TA151KGD UC Bare die; 6.2mm x 3.7 mm 2012-11-02
OL-TDA1308AUK WLCSP Wafer level chip-size package; 8 bumps; 0.61 x 0.84 x 0.38 mm 2006-12-15
OL-TDA19988AU UC Bare die; 84 bond pads 2011-04-13
OL-TDA19988BU UC Bare die; 84 bond pads ---(EIAJ);---(JEDEC);---(IEC) 2011-06-10
OL-TFA9860 WLCSP wafer level chip-size package; 49 bumps; 3.37 x 2.97 mm ---(EIAJ);---(JEDEC);---(IEC) 2013-03-07
OL-TFA9881UK WLCSP Wafer level chip-size package; 9 bumps; 1.3 x 1.3 x 0.6 mm 2010-10-06
OL-TFA9882UK WLCSP WLCSP9: wafer level chip-size package; 9 bumps ---(EIAJ);---(JEDEC);---(IEC) 2011-05-26
OL-TFA9897 WLCSP wafer level chip-scale package; 30 bumps; 2.06 x 2.72 x 0.50 mm 2014-10-09
OL-TFA9897A WLCSP wafer level chip-scale package; 30 bumps; 2.06 x 2.72 x 0.50 mm 2015-04-17
OL-TFA9897B WLCSP wafer level chip-scale package; 30 bumps; 2.06 x 2.72 x 0.525 mm (backside coating included) 2015-03-13
OL-TFA9897C WLCSP wafer level chip-scale package; 30 bumps; 2.06 x 2.72 x 0.525 mm (Backside coating include) 2015-05-07
OL-TFA9981UK WLCSP Wafer level chip-size package; 9 bumps; 1.3 x 1.3 x 0.6 mm 2010-10-25
PCA9412 WLCSP9 wafer level chip-scale package; 9 bumps; 1.24 x 1.24 x 0.525 mm (backside coating included) 2016-08-04
PN80V UFLGA64 plastic ultra thin fine-pitch land grid array package; 64 lands 2016-04-21
SOD106 SMA; PMOS transfer-moulded thermo-setting plastic small rectangular surface mounted package; 2 connectors DO-214AC(JEDEC) 2006-03-16
SOD107A ALF2 hermetically sealed plastic package; axial leaded; 2 leads 1998-08-04
SOD107B ALF2 hermetically sealed plastic package; axial leaded; 2 leads 1998-08-05
SOD110 SOD2 ceramic, very small ceramic rectangular surface-mounted package; 2 terminals; 2 mm x 1.25 mm x 1.6 mm body 2006-03-16
SOD113 TO-220F plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 2-lead TO-220 "full pack" 2-lead TO-220F(JEDEC) 2015-07-28
SOD113A TO-220F plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 2-lead TO-220F "full pack" 2 LEADS TO220F(JEDEC) 2014-01-14
SOD118A ALF2 hermetically sealed plastic package; axial leaded; 2 leads 1998-05-28
SOD118B ALF2 hermetically sealed plastic package; axial leaded; 2 leads 1998-05-28
SOD119AB GALF2 hermetically sealed glass package; axial leaded; 2 leads 1998-12-04
SOD119AC GALF2 hermetically sealed glass package; axial leaded; 2 leads 1999-06-24
SOD119AD GALF2 hermetically sealed glass package; axial leaded; 2 leads 1999-06-24
SOD123 SOD123 plastic, surface-mounted package; 2 leads; 2.675 mm x 1.6 mm x 1.15 mm body 2016-08-31
SOD123F SOD123F plastic, surface-mounted package; 2 leads; 2.6 mm x 1.6 mm x 1.1 mm body 2006-03-16
SOD123GW SOD123GW Plastic surface-mounted package; 2 leads (EIAJ);(JEDEC);IEC 2016-05-26
SOD123W SOD123W plastic, surface mounted package; 2 terminals; 2.6 mm x 1.7 mm x 1 mm body 2008-11-06
SOD124 SOD2 transfer-moulded thermo-setting plastic small rectangular surface mounted package; 2 connectors DO-214AC(JEDEC) 2006-03-16
SOD125A ALF2 hermetically sealed plastic package; axial leaded; 2 leads 2000-03-06
SOD128 SOD128 plastic, surface mounted package; 2 terminals; 4 mm pitch; 3.8 mm x 2.6 mm x 1 mm body 2007-09-12
SOD132 SOD132 Hermetically sealed plastic package; SMB; 2 leads SMB. DO-214AA(JEDEC) 2013-03-20
SOD141 DO-201AD Hermetically sealed plastic package; axial leaded; 2 leads DO-201AD(JEDEC) 2010-05-18
SOD142 SOD142 Plastic Single-ended through-hole package; Heatsink mounted; 1 mounting hole; 2-lead TO-247 TO-247(JEDEC) 2012-11-27
SOD1608 DFN1608D-2 plastic, leadless ultra small plastic package; 2 terminals; 0.94 mm pitch; 1.6 mm x 0.8 mm x 0.37 mm body 2011-11-29
SOD27 ALF2 glass, hermetically sealed glass package; axial leaded; 2 leads; 4.25 mm x 1.85 mm body SC-40(EIAJ);DO-34(JEDEC);A24(IEC) 2014-02-26
SOD323 SOD323 plastic, surface-mounted package; 2 leads; 1.3 mm pitch; 1.7 mm x 1.25 mm x 0.95 mm body SC-76(EIAJ) 2006-03-16
SOD323F SOD323F plastic, surface-mounted package; 2 leads; 1.7 mm x 1.25 mm x 0.7 mm body SC-90(EIAJ) 2006-03-16
SOD523 SOD523 plastic, surface-mounted package; 2 leads; 1.2 mm x 0.8 mm x 0.6 mm body SC-79(EIAJ) 2006-03-16
SOD523V SC-79 plastic surface-mounted package; 2 leads SC-79(EIAJ) 2006-03-16
SOD57 GALF2 hermetically sealed glass package; axial leaded; 2 leads 1997-10-14
SOD59 TO-220AC plastic single-ended package; heatsink mounted; 1 mounting hole; 2-lead TO-220AC 2-lead TO-220AC(JEDEC) 2012-11-27
SOD59A TO-220AC Plastic single-ended package; heatsink mounted; 1 mounting hole; 2-lead TO-220AC 2015-03-30
SOD64 GALF2 hermetically sealed glass package; axial leaded; 2 leads 1997-10-14
SOD66 DO-41 glass, hermetically sealed glass package; 2 leads; 4.8 mm x 2.6 mm body DO-41(JEDEC) 1997-06-20
SOD68 DO-34 glass, hermetically sealed glass package; 2 leads; 3.04 mm x 1.6 mm body DO-34(JEDEC) 1997-06-09
SOD70 PBCYT2 plastic near cylindrical single-ended package; 2 in-line leads 2006-09-15
SOD723 SOD2 plastic surface mounted package; 2 leads 2006-03-16
SOD80C LLDS; MiniMelf glass, hermetically sealed glass surface-mounted package; 2 connectors; 3.5 mm x 1.5 mm body 100H01(IEC) 2006-03-16
SOD81 GALF2 hermetically sealed glass package; axial leaded; 2 leads 1997-06-20
SOD83A GALF2 hermetically sealed glass package; axial leaded; 2 leads 1997-06-11
SOD83B GALF2 hermetically sealed glass package; axial leaded; 2 leads 1997-06-27
SOD87 MELF glass, hermetically sealed glass surface mounted package; 2 terminals; 3.5 mm x 2.1 mm body 100H03(IEC) 2006-03-16
SOD882 DFN1006-2 plastic, leadless ultra small package; 2 terminals; 0,65 mm pitch; 1 mm x 0.6 mm x 0.48 mm body 2014-08-26
SOD882D DFN1006D-2 plastic, leadless ultra small plastic package; 2 terminals; 0.65 mm pitch; 1 mm x 0.6 mm x 0.4 mm body 2010-09-27
SOD882T SOD2 leadless ultra small plastic package; 2 terminals; body 1.0 x 0.6 x 0.4 mm 2006-04-12
SOD88A GALF2 hermetically sealed glass package; axial leaded; 2 leads 1997-06-20
SOD88B GALF2 hermetically sealed glass package; axial leaded; 2 leads 1997-06-20
SOD89A GALF2 hermetically sealed glass package; axial leaded; 2 leads 1997-06-20
SOD89B GALF2 hermetically sealed glass package; axial leaded; 2 leads 1997-06-20
SOD91 GALF2 hermetically sealed glass package; axial leaded; 2 leads 1997-06-09
SOD923 SOD2 Microlead ultra small surface-mounted plastic package; 2 leads ---(EIAJ);---(JEDEC);---(IEC) 2011-04-12
SOD95 TO-220 plastic single-ended package; low-profile 2-lead TO-220 2-lead TO-220(JEDEC) 1999-09-13
SOD962 DSN0603-2 DSN0603-2: leadless ultra small package; 2 terminals; body 0.6 x 0.3 x 0.3 mm 2010-07-23
SOD962-2 SOD2 silicon, leadless ultra small package; 2 terminals; 0.4 mm pitch; 0.6 mm x 0.3 mm x 0.3 mm body 2013-07-17
SOD963 DSN1608-2 silicon, leadless very small package; 2 terminals; 0.6 mm pitch; 1.6 mm x 0.8 mm x 0.25 mm body 2015-08-06
SOD964 DSN1608-2 plastic, leadless very small package; 2 terminals; 0.6 mm pitch; 1.6 mm x 0.8 mm x 0.29 mm body 2015-05-15
SOD972 DFN0603-2 plastic, ultra small and leadless full encapsulated package; 2 terminals; 0.4 mm pitch; 0.63 mm x 0.33 mm x 0.2 mm body 2016-10-10
SOD992 DSN0402-2 silicon, leadless tiny package; 2 terminals; 0.25 mm pitch; 0.4 mm x 0.2 mm x 0.1 mm body 2015-08-25
SOD993 DSN1006-2 silicon, leadless ultra small package; 2 terminals; 0.65 mm pitch; 1 mm x 0.6 mm x 0.27 mm body 2014-10-24
SOD995 DSN1006U-2 silicon, leadless ultra small package; 2 terminals; 0.325 mm pitch; 1 mm x 0.6 mm x 0.27 mm body 2014-12-09
SOP022-1 LGA274 land grid array package; 274 lands 2013-04-16
SOP022-2 LGA350 land grid array package; 350 lands 2013-08-02
SOT1000-1 HVQFN36R plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; resin based; body 6 x 5 x 0.85 mm 2008-03-14
SOT1001-1 HVQFN36R plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; resin based; body 5.5 x 4.5 x 0.85 mm 2007-11-14
SOT1003-1 HVQFN plastic thermal enhanced very thin quad flat package; no leads; 25 terminals; body 5 x 5 x 0.85 mm 2016-05-19
SOT1008-1 HUQFN60U plastic thermal enhanced ultra thin quad flat package; no leads; 60 terminals; UTLP based; body 5 x 5 x 0.55 mm ---(EIAJ);---(JEDEC);---(IEC) 2008-04-10
SOT100A CRDB4 hermetic ceramic surface mounted package; 4 leads 2006-03-16
SOT101-1 DIP24 plastic, dual in-line package; 24 leads; 2.54 mm pitch; 31.7 mm x 13.8 mm x 5.1 mm body SC-509-24(EIAJ);MO-015(JEDEC);051G02(IEC) 2003-02-13
SOT1011-1 HLQFN48R plastic thermal enhanced low profile quad flat package; no leads; 48 terminals; body 7 x 7 x 1.28 mm 2007-11-14
SOT1012-1 TFBGA100 plastic thin fine-pitch ball grid array package; 100 balls MO-195(JEDEC) 2007-06-05
SOT1016-1 TFBGA160 plastic thin fine-pitch ball grid array package; 160 balls 2007-07-27
SOT1017-1 LQFP176 plastic low profile quad flat package; 176 leads; body 20 x 20 x 1.4 mm MS-026(JEDEC) 2007-08-20
SOT1018-1 BGA256 plastic ball grid array package; 256 balls 2007-08-20
SOT1019-1 LFBGA208 plastic low profile fine-pitch ball grid array package; 208 balls 2007-08-20
SOT102-1 DIP18 plastic dual in-line package; 18 leads (300 mil) MS-001(JEDEC) 2003-02-13
SOT102-2 DIP18 plastic dual in-line package; 18 leads (300 mil); slim corner leads MS-011(JEDEC) 2003-02-13
SOT102-4 DIP18 plastic dual in-line package; 18 leads (300 mil); long body MS-001(JEDEC) 2003-03-12
SOT1020-1 LFBGA256 plastic low profile fine-pitch ball grid array package; 256 balls 2007-08-20
SOT1020-2 LFBGA256 LFBGA256, low profile fine-pitch ball grid array; 256 terminals, 0.8 mm pitch, 14 mm x 14 mm x 1.6 mm body 2017-03-13
SOT1020-3 LFBGA256 LFBGA256, low profile fine-pitch ball grid array; 256 terminals, 0.8 mm pitch, 14 mm x 14 mm x 1.35 mm body 2018-05-04
SOT1021-1 LFBGA324 plastic low profile fine-pitch ball grid array package; 324 balls 2007-08-20
SOT1022-1 LFBGA477 plastic low profile fine-pitch ball grid array package; 477 balls 2007-07-27
SOT1023 LFPAK56; Power-SO8 plastic, single-ended surface-mounted package (LFPAK56); 4 leads; 1.27 mm pitch; 4.58 mm x 5.13 mm x 1.03 mm body 2013-03-05
SOT1024-1 LFBGA169 plastic low profile fine-pitch ball grid array package; 169 balls 2007-08-21
SOT1024-2 LFBGA169 plastic low profile fine-pitch ball grid array package; 169 balls ---(EIAJ);---(JEDEC) 2008-08-07
SOT1025-1 HUQFN60U plastic thermal enhanced ultra thin quad flat package; no leads; 60 terminals; UTLP based - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2007-11-14
SOT1026-1 HWQFN28 plastic thermal enhanced very very thin quad flat package; no leads; 28 terminals - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2007-08-23
SOT1027-1 BGA596 plastic ball grid array package; 596 balls - - -(JEDEC) 2007-11-06
SOT1028-1 LFBGA296 plastic low profile fine-pitch ball grid array package; 296 balls 2007-09-28
SOT1029-1 LFBGA161 plastic low profile fine-pitch ball grid array package; 161 balls - - -(EIAJ);- - -(JEDEC) 2007-09-28
SOT1031-1 HWQFN48R plastic thermal enhanced very very thin quad flat package; no leads; 48 terminals; resin based; body 7 x 7 x 0.7 mm 2007-12-01
SOT1031-2 HWQFN48R plastic thermal enhanced very very thin quad flat package; no leads; 48 terminals; resin based; body 7 x 7 x 0.7 mm 2008-03-26
SOT1032-1 HVQFN108U plastic thermal enhanced very thin quad flat package; no leads; 108 terminals; UTLP based; body 8 x 8 x 0.9 mm 2008-10-17
SOT1032-2 HVQFN108U plastic thermal enhanced very thin quad flat package; no leads; 108 terminals; low stand-off height; UTLP based; body 8 x 8 x 0.9 mm 2008-10-16
SOT1032-3 HVQFN108U plastic thermal enhanced very thin quad flat package; no leads; 108 terminals; low stand-off height; UTLP based; body 8 x 8 x 0.9 mm 2008-10-17
SOT1033-1 HWQFN56R plastic thermal enhanced very very thin quad flat package; no leads; 56 terminals; resin based; body 11 x 5 x 0.7 mm 2007-12-01
SOT1033-2 HWQFN56R HWQFN56R, thermal enhanced very very thin quad flatpack; no leads, 56 terminals, 0.5 mm pitch, 5 mm x 11 mm x 0.71 mm body 2018-05-25
SOT1034-1 BGA736 plastic ball grid array package; 736 balls 2007-09-28
SOT1035-1 HBGA736 plastic thermal enhanced ball grid array package; 736 balls; heatsink 2009-08-14
SOT1036-1 HUQFN76U plastic thermal enhanced ultra thin quad flat package; no leads; 76 terminals; UTLP based; body 6 x 6 x 0.55 mm ---(EIAJ);---(JEDEC);---(IEC) 2007-12-01
SOT1039-1 HXQFN16U plastic thermal enhanced extremely thin quad flat package; no leads; 16 terminals; UTLP based; body 3 x 3 x 0.5 mm 2007-12-01
SOT1039-2 HXQFN16(U) HXQFN16 (U) plastic thermal enhanced extremely thin quad flat package; no leads; 16 terminals, 0.5 mm pitch, 3 mm x 3 mm x 0.5 mm body 2011-03-30
SOT1040-1 FCS2 plastic flip chip strap package; 2 leads; 9 mm wide tape 2007-10-18
SOT1041-1 FCS2 plastic flip chip strap package; 2 leads; 12 mm wide tape 2007-10-18
SOT1042 FCS2 polymer strap package; 2 leads; 14 mm wide tape 2011-04-21
SOT1042-1 FCS2 plastic flip chip strap package; 2 leads; 14 mm wide tape 2007-10-18
SOT1045-1 DHXQFN20U plastic dual in-line compatible thermal enhanced extremely thin quad flat package; no leads; 20 terminals; UTLP based - - -(EIAJ);- - -(IEC) 2009-08-04
SOT1045-2 DHXQFN20 plastic, dual in-line compatible thermal enhanced extremely thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 0.5 mm body ---(EIAJ);---(JEDEC);---(IEC) 2011-08-18
SOT1046-1 HXQFN16U plastic thermal enhanced extremely thin quad flat package; no leads; 16 terminals; UTLP based - - -(EIAJ);- - -(IEC) 2007-12-01
SOT1046-2 HXQFN16 plastic thermal enhanced extremely thin quad flat package; no leads; 16 terminals - - -(EIAJ);- - -(IEC) 2011-03-30
SOT1047-1 BGA485 plastic ball grid array package; 485 balls MS-034(JEDEC);144E(IEC) 2007-11-14
SOT1048-1 TFBGA296 plastic thin fine-pitch ball grid array package; 296 balls MO-216(JEDEC) 2007-11-02
SOT1049-1 XQFN10U plastic extremely thin quad flat pack package; no leads; 10 terminals; UTLP based - - -(EIAJ);MO-255(JEDEC);- - -(IEC) 2010-02-05
SOT1049-2 XQFN10U plastic extremely thin quad flat pack package; no leads; 10 terminals; UTLP based - - -(EIAJ);MO-255(JEDEC);- - -(IEC) 2010-02-05
SOT1049-3 XQFN10 plastic, extremely thin quad flat package; 10 terminals; 0.5 mm pitch; 1.55 mm x 2 mm x 0.5 mm body MO255(JEDEC) 2011-03-30
SOT1050 USON6 plastic ultra thin small outline package; no leads; 6 terminals 2008-06-03
SOT1051-1 TFBGA273 plastic thin fine-pitch ball grid array package; 273 balls MO-195(JEDEC) 2007-11-14
SOT1052-1 HXSON8 plastic thermal enhanced extremely thin small outline package; no leads; 8 terminals; body 2 x 3 x 0.5 mm MO-229(JEDEC) 2008-03-11
SOT1054-1 HVSON14 plastic thermal enhanced very thin small outline package; no leads; 14 terminals; body 3 x 4 x 0.85 mm ---(EIAJ);---(JEDEC);---(IEC) 2008-03-06
SOT1055-1 HVQFN41 plastic thermal enhanced very thin quad flat package; no leads; 41 terminals; body 7 x 7 x 0.85 mm 2008-01-23
SOT1056-1 HVQFN38R plastic thermal enhanced very thin quad flat package; no leads; 38 terminals; resin based; body 4 x 4 x 0.9 mm 2007-11-30
SOT1058-1 LFBGA136 plastic low profile fine-pitch ball grid array package; 136 balls 2008-01-03
SOT1059-1 XSON10U plastic, extremely thin small outline package; no leads; 10 terminals; 0.5 mm pitch; 2.5 mm x 1 mm x 0.5 mm body 2008-01-18
SOT1061 DFN2020-3 plastic, thermal enhanced ultra thin small outline package; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body 2008-10-07
SOT1061D DFN2020D-3 plastic, thermal enhanced ultra thin small outline package; no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body 2015-01-09
SOT1062-1 LFBGA286 plastic low profile fine-pitch ball grid array package; 286 balls MO-205(JEDEC) 2008-01-28
SOT1063-1 VFBGA48 plastic very thin fine-pitch ball grid array package; 48 balls ---(JEDEC) 2008-03-17
SOT1064-1 LFBGA84 plastic low profile fine-pitch ball grid array package; 84 balls ---(EIAJ);---(JEDEC);---(IEC) 2008-04-02
SOT1065-1 TFBGA54 plastic thin fine-pitch ball grid array package; 54 balls ---(EIAJ);---(JEDEC);---(IEC) 2008-03-27
SOT1067-1 MLSSN4R metal low profile special-shape package; no leads; 4 terminals; resin based; body 4.72 x 3.76 x 1.1 mm - - -(EIAJ);- - -(JEDEC);- - -IEC 2008-08-20
SOT1068-1 HUQFN16U plastic thermal enhanced ultra thin quad flat package; no leads; 16 terminals; UTLP based; body 3 x 3 x 0.55 mm 2008-02-26
SOT1069-1 HWSON8 plastic thermal enhanced very very thin small outline package; no leads; 8 terminals; body 2 x 3 x 0.8 mm (EIAJ);MO-229(JEDEC);IEC 2009-08-10
SOT1069-2 HWSON8 HWSON8: plastic thermal enhanced very very thin small outline package, no leads; 8 terminals; MO-229(JEDEC) 2009-05-25
SOT1070-1 LFBGA296 plastic low profile fine-pitch ball grid array package; 296 balls 2008-02-11
SOT1071-1 VFBGA81 plastic very thin fine-pitch ball grid array package; 81 balls 2008-02-08
SOT1072-1 LFBGA169 plastic low profile fine-pitch ball grid array package; 169 balls ---(EIAJ);MO-275(JEDEC) 2008-04-02
SOT1073-1 TFBGA64 plastic thin fine-pitch ball grid array package; 64 balls 2008-03-14
SOT1074-1 HWQFN48 plastic thermal enhanced very very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.65 mm ---(EIAJ);---(JEDEC);---(IEC) 2008-03-14
SOT1075-1 LFBGA49 plastic low profile fine-pitch ball grid array package; 49 balls ---(JEDEC) 2008-03-17
SOT1077-1 LFBGA487 plastic low profile fine-pitch ball grid array package; 487 balls 2008-03-19
SOT1077-2 LFBGA487 plastic low profile fine-pitch ball grid array package; 487 balls 2009-02-19
SOT1078-1 VFBGA144 plastic very thin fine-pitch ball grid array package; 144 balls ---(JEDEC) 2008-04-07
SOT1079-1 LFBGA141 plastic low profile fine-pitch ball grid array package; 141 balls ---(EIAJ);---(JEDEC) 2008-04-10
SOT108-1 SO14 plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body MS-012(JEDEC);076E06(IEC) 2003-02-19
SOT108-2 SO14 plastic small outline package; 14 leads; body width 3.9 mm; body thickness 1.47 mm MS-012(JEDEC) 2003-02-19
SOT108-4 SO14 SOICN 14 3.9*8.65*1.75 2017-06-11
SOT1080-1 HUQFN24U plastic thermal enhanced ultra thin quad flat package; no leads; 24 terminals; UTLP based; body 3 x 3 x 0.55 mm ---(EIAJ);---(JEDEC);---(IEC) 2008-04-17
SOT1081-1 XSON10U plastic, extremely thin small outline package; 10 terminals; 0.35 mm pitch; 1.7 mm x 1 mm x 0.35 mm body ---(EIAJ);---(IEC) 2008-04-18
SOT1081-2 XSON10 plastic, extremely thin small outline package; 10 terminals; 0.35 mm pitch; 1.7 mm x 1 mm x 0.5 mm body - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2011-03-30
SOT1082-1 VSON6U plastic very thin small outline package; no leads; 6 terminals; UTLP based ---(EIAJ);---(JEDEC);---(IEC) 2009-06-17
SOT1085-1 LFBGA273 plastic low profile fine-pitch ball grid array package; 273 balls MO-195(JEDEC) 2008-04-29
SOT1086-1 HVSON14 plastic thermal enhanced very thin small outline package; no leads; 14 terminals; body 3 x 4.5 x 0.85 mm MO-229(JEDEC) 2008-07-03
SOT1086-2 HVSON14 plastic, thermal enhanced very thin small outline package; no leads; 14 terminals MO-229(JEDEC) 2010-07-15
SOT1086-3 HVSON14 plastic, thermal enhanced very thin small outline package; no leads; 14 terminals MO-229(JEDEC) 2011-08-30
SOT1087-1 VFBGA100 plastic very thin fine-pitch ball grid array package; 100 balls ---(EIAJ);---(JEDEC);---(IEC) 2008-05-27
SOT1087-2 VFBGA100 VFBGA100, plastic, very thin fine-pitch ball grid array; 100 balls; 0.5 mm pitch; 6 mm x 6 mm x 0.66 mm body 2017-06-11
SOT1088-1 HBGA520 plastic thermal enhanced ball grid array package; 520 balls; heatsink MS-034(JEDEC);144E(IEC) 2008-06-03
SOT1089 XSON8 plastic, extremely thin small outline package; no leads; 8 terminals; 0.55 mm pitch; 1.35 mm x 1 mm x 0.5 mm body MO-252(JEDEC) 2010-04-12
SOT1089-1 XSON8 plastic, extremely thin small outline package; no leads; 8 terminals - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2010-06-30
SOT109-1 SO16 plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body MS-012(JEDEC);076E07(IEC) 2003-02-19
SOT109-2 SO16 plastic small outline package; 16 leads; body width 3.9 mm; low stand-off height MS-012(JEDEC);076E07(IEC) 2003-02-19
SOT109-3 SO16 plastic small outline package; 16 leads; body width 3.9 mm; body thickness 1.47 mm MS-012AC(JEDEC) 2003-02-19
SOT109-5 SO16 SO16, plastic, small outline; leaded package; 16 terminals; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body 2017-03-24
SOT1090-1 BGA426 plastic ball grid array package; 426 balls ---(EIAJ);MS-034(JEDEC);144E(IEC) 2008-06-19
SOT1091-1 TFBGA49 plastic thin fine-pitch ball grid array package; 49 balls ---(JEDEC) 2008-06-23
SOT1092-1 HVQFN36 plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; body 6 x 6 x 0.85 mm MO-220(JEDEC) 2008-11-12
SOT1092-2 HVQFN36 plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; body 6 mm x 6 mm x 0.85 mm 2009-02-24
SOT1092-2(D) HVQFN36 plastic thermal enhanced very thin quad flat package; no leads; 0.1 dimple wettable flank; 36 terminals; 0.5 mm pitch, 6 mm x 6 mm x 0.85 mm body 2018-03-08
SOT1092-2(DD) HVQFN36 plastic thermal enhanced very thin quad flat package; no leads; dimple wettable flank; 36 terminals; 0.5 mm pitch, 6 mm x 6 mm x 0.85 mm body 2018-01-09
SOT1092-3 HVQFN36 plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; 0.5 mm pitch; 6 mm x 6 mm x 0.85 mm body MO-220(JEDEC) 2012-01-10
SOT1092-4 HVQFN36 plastic thermal enhanced very thin quad flat package; no leads; 36 terminals; body 6 mm x 6 mm x 0.85 mm 2016-10-03
SOT1092-5 HVQFN36 HVQFN36, plastic thermal enhanced very thin quad flat package; no leads, wettable flanks, 36 terminals; body 6 mm x 6 mm x 0.85 mm 2017-09-09
SOT1092-6(DD) HVQFN36 HVQFN36, plastic thermal enhanced very thin quad flat package; no leads; dimple wettable flank; 36 terminals, 0.5 mm pitch, 6 mm x 6 mm x 0.85 mm body 2018-05-29
SOT1093-1 TQFP80 TQFP80: plastic thin quad flat package; 80 leads; body 14 x 14 x 1.1 mm MS-026(JEDEC);136E19(IEC) 2008-11-14
SOT1094-1 BGA376 plastic ball grid array package; 376 balls - - -(EIAJ);MS-034(JEDEC);144E(IEC) 2008-11-14
SOT1095-1 HBGA624 plastic thermal enhanced ball grid array package; 624 balls; heatsink - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2008-11-17
SOT1096-1 BGA452 plastic ball grid array package; 452 balls MS-034(JEDEC);144E(IEC) 2008-11-14
SOT1097-1 LBGA228 plastic low profile ball grid array package; 228 balls - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2008-11-17
SOT1097-2 LBGA228 plastic low profile ball grid array package; 228 balls - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2009-12-01
SOT1098-1 LFBGA268 plastic low profile fine-pitch ball grid array package; 268 balls 2008-11-17
SOT1099-1 LQFP256 plastic low profile quad flat package; 256 leads; body 28 x 28 x 1.4 mm MS-026(JEDEC);136E31(IEC) 2009-04-08
SOT110-1 SIL9MPF plastic single in-line medium power package with fin; 9 leads 2003-03-12
SOT1102-1 BGA456 BGA456: plastic ball grid array package; 456 balls - - -(EIAJ);MS-034(JEDEC);144E(IEC) 2008-11-19
SOT1103-2 QFP80 QFP80, plastic, quad flat package; 80 terminals; 0.65 mm pitch; 14 mm x 14 mm x 2.2 mm body PQFP-G80(JEDEC) 2017-06-11
SOT1103-3 HQFP80 plastic, thermal enhanced quad; flat package; 80 terminals; 0.65 mm pitch; 14 mm x 14 mm x 2.3 mm body 2016-06-06
SOT1104-1 LFBGA135 plastic low profile fine-pitch ball grid array package; 135 balls ---(EIAJ);---(JEDEC) 2008-08-06
SOT1107-1 TFBGA296 plastic thin fine-pitch ball grid array package; 296 balls 2008-08-07
SOT1108-1 MTSSN4R metal thin special-shape package; no leads; 4 terminals; resin based; body 4 x 3 x 1 mm - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2008-08-20
SOT1109 HVSON12 plastic thermal enhanced very thin small outline package; no leads; 12 terminals; body 6 x 6 x 1 mm ---(EIAJ);---(JEDEC);---IEC 2008-09-24
SOT111-1 DBS9MPF plastic DIL-bent-SIL medium power package with fin; 9 leads 2003-03-12
SOT1113-1 HVQFN44 plastic thermal enhanced very thin quad flat package; no leads; 44 terminals 2010-07-23
SOT1113-2 HVQFN44 HVQFN44, plastic, thermal enhanced very thin quad flatpack; no leads; 44 terminals; 0.65 mm pitch; 9 mm x 9 mm x 1 mm body H-PQFN-N44(JEDEC) 2017-06-11
SOT1113-3 HVQFN44 HVQFN44, plastic, thermal enhanced very thin quad flatpack; no leads; 44 terminals; 0.65 mm pitch; 9 mm x 9 mm x 1 mm body HF-PQFN-N44(JEDEC) 2017-06-11
SOT1114-1 HWQFN56R plastic thermal enhanced very very thin quad flat package; no leads; 56 terminals; resin based; body 7 x 7 x 0.7 mm ---(EIAJ);---(JEDEC);---(IEC) 2008-10-07
SOT1115 XSON6 plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 0.9 mm x 1 mm x 0.35 mm body 2010-04-07
SOT1116 XSON8 plastic, extremely thin small outline package; 8 terminals; 0.55 mm pitch; 1.2 mm x 1 mm x 0.35 mm body 2010-04-07
SOT1118 HUSON6 plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body 2013-06-06
SOT1118D HUSON6 plastic, thermally enhanced ultra thin and small outline package; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body 2014-07-16
SOT1119-1 HBGA432 plastic thermal enhanced ball grid array package; 432 balls; heatsink ---(EIAJ);MS-034(JEDEC);144E(IEC) 2009-08-14
SOT1122 XSON3 plastic extremely thin small outline package; no leads; 3 terminals MO-252(JEDEC) 2009-10-09
SOT1122-1 XSON3 plastic extremely thin small outline package; no leads; 3 terminals 2013-07-11
SOT1123-1 HBGA324 plastic thermal enhanced ball grid array package; 324 balls; heatsink - - -(EIAJ);MS-034(JEDEC);144E(IEC) 2009-06-09
SOT1123-2 HBGA324 plastic thermal enhanced ball grid array package; 324 balls; heatsink - - -(EIAJ);MS-034(JEDEC);144E(IEC) 2010-01-06
SOT1128-1 HLQFP256 plastic thermal enhanced low profile quad flat package; 256 leads; body 28 x 28 x 1.4 mm; heatsink MS-026(JEDEC) 2008-12-19
SOT1129-1 BGA324 plastic ball grid array package; 324 balls; body 23 x 23 x 1.78 mm ---(EIAJ);MS-034(JEDEC);144E(IEC) 2009-02-05
SOT1129-2 BGA324 plastic ball grid array package; 324 balls - - -(EIAJ);MS-034(JEDEC);144E(IEC) 2009-03-31
SOT1129-3 BGA324 BGA324, plastic, ball grid array; 324 balls; 1 mm pitch; 23 mm x 23 mm x 1.95 mm body PBGA-B324(JEDEC) 2017-06-11
SOT1131-1 HSOP44 plastic, heatsink small outline package; 44 leads; low stand-off height, 0.65 mm pitch, 15.9 mm x 11.0 mm x 3.3 mm body 2010-08-18
SOT1133-1 HXQFN60U plastic thermal enhanced extremely thin quad flat package; no leads; 60 terminals; UTLP based - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2010-04-09
SOT1133-2 HXQFN60U plastic compatible thermal enhanced extremely thin quad flat package; no leads; 60 terminals 2011-08-22
SOT1134-1 HXQFN60U plastic, thermal enhanced extremely thin quad flat package; 60 terminals; 0.5 mm pitch; 4 mm x 6 mm x 0.5 mm body - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2009-01-22
SOT1134-2 HXQFN60U plastic, compatible thermal enhanced extremely thin quad flat package; 60 terminals; 0.5 mm pitch; 4 mm x 6 mm x 0.5 mm body 2011-08-22
SOT1136-1 BGA420 plastic ball grid array package; 420 balls - - -(EIAJ);MS-034(JEDEC);144E(IEC) 2009-05-20
SOT1139-1 BGA582 plastic ball grid array package; 582 balls, 1 mm pitch, 27 mm x 27 mm x 1.87 mm body MS-034 Compliant(JEDEC) 2009-05-26
SOT1140-1 BGA806 plastic ball grid array package; 806 balls MS-034 Compliant(JEDEC) 2009-05-26
SOT1141-1 LFBGA385 plastic low profile fine-pitch ball grid array package; 385 balls - - -(JEDEC) 2009-05-25
SOT1142-1 HBGA543 plastic thermal enhanced ball grid array package; 543 balls; heatsink - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2009-08-03
SOT1143-1 LFBGA417 plastic low profile fine-pitch ball grid array package; 417 balls 2009-06-19
SOT1144-1 HVQFN42 plastic thermal enhanced very thin quad flat package; no leads; 42 terminals 2009-08-28
SOT1145-1 TFBGA385 plastic thin fine-pitch ball grid array package; 385 balls - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2009-08-18
SOT1147-1 HXSON16U plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals;UTLP based - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2009-10-02
SOT1148-1 HBGA404 HBGA404, plastic thermal enhanced ball grid array; 404 balls; 1 mm pitch, 23 mm x 23 mm x 1.75 mm body MS-034(JEDEC);144E(IEC) 2017-06-14
SOT1149-1 BGA708 plastic ball grid array package; 708 balls MS-034D Compliant(EIAJ);MS-034D Compliant(JEDEC);MS-034D Compliant(IEC) 2010-10-19
SOT1150-1 BGA596 plastic ball grid array package; 596 balls (EIAJ);(JEDEC);IEC 2009-10-19
SOT1151-1 HBGA640 plastic thermal enhanced ball grid array package; 640 balls; heatsink MS-034D compliant(JEDEC) 2009-10-19
SOT1152-1 HVQFN32R plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; resin based - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2009-11-16
SOT1153-1 BGA456 plastic ball grid array package; 456 balls MS-034D compliant(JEDEC) 2009-11-16
SOT1154-1 DBSMS27P plastic dual bent surface mounted SIL power package; 27 leads 2013-02-13
SOT1155-1 TFBGA48 TFBAG48, plastic thin fine-pitch ball grid array package; 48 balls, 0.5 mm pitch, 4.5 mm x 4.5 mm x 0.8 mm body 2009-11-27
SOT1155-2 TFBGA48 plastic thin fine-pitch ball grid array package; 48 balls - - -(JEDEC) 2013-06-19
SOT1156-1 DFN2521-12 plastic, thermal enhanced extremely thin small outline package; 12 terminals; 0.4 mm pitch; 2.5 mm x 2.1 mm x 0.5 mm body - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2010-09-17
SOT1157-1 DFN1712-8 plastic, thermal enhanced extremely thin small outline package; 8 terminals; 0.4 mm pitch; 1.7 mm x 1.2 mm x 0.5 mm body - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2009-12-17
SOT1158-1 DFN2512-12 plastic, thermal enhanced extremely thin small outline package; 12 terminals; 0.4 mm pitch; 2.5 mm x 1.2 mm x 0.5 mm body - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2009-12-17
SOT1159_1 DFN3312-16 plastic, thermal enhanced extremely thin small outline package; 16 terminals; 0.4 mm pitch; 3.3 mm x 1.2 mm x 0.5 mm body - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2009-12-17
SOT115AE SFM8 rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; 8 gold-plated in-line leads (EIAJ);(JEDEC);IEC 2004-02-04
SOT115BA SFM7 rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC; 7 SN-plated in-line leads 2005-11-11
SOT115D SFM9 rectangular single-ended package; aluminium flange; 2 vertical mounting holes;2 x 6-32 UNC and 2 extra horizontal mounting holes; 9 gold-plated in-line leads 2004-02-04
SOT115J SFM7 rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads 2004-02-04
SOT115JA SFM7 rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads 2012-09-14
SOT115T SFO8 rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; optical input; 8 gold-plated in-line leads 2004-02-04
SOT115W SFO8 rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; optical input with connector; 8 gold-plated in-line leads 1999-04-13
SOT115X SFO8 rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; optical input with connector; 8 gold-plated in-line leads 2004-02-04
SOT115Y SFO8 rectangular single-ended package; aluminium flange; 2 vertical mounting holes; 2 x 6-32 UNC and 2 extra horizontal mounting holes; optical input with connector; 8 gold-plated in-line leads 2004-02-05
SOT116-1 DIP22 DIP22, plastic dual in-line package; 22 leads, 2.54 mm pitch, 27.94 mm x 8.7 mm x 3.81 mm body MS-010(JEDEC);060G07(IEC) 1999-12-27
SOT1160-1 XQFN10 plastic, extremely thin quad flat package; no leads; 10 terminals; 0.4 mm pitch; 1.4 mm x 1.8 mm x 0.5 mm body 2009-12-29
SOT1160-2 XQFN10 plastic, extremely thin quad flat package; no leads; 10 terminals; body 1.8 x 1.4 x 0.5 mm 2014-03-10
SOT1161-1 XQFN16 plastic, extermely thin quad flat package; 16 terminals; 0.4 mm pitch; 1.8 mm x 2.6 mm x 0.5 mm body 2009-12-29
SOT1161-2 XQFN16 XQFN16, plastic, extremely thin quad flat package; no leads; 16 terminals; 2.6 mm x 1.8 mm x 0.50 mm body 2017-01-24
SOT1162-1 BGA582 plastic ball grid array package; 582 balls MS-034D Compliant(JEDEC) 2009-12-29
SOT1163-1 HBGA360 plastic, thermal enhanced ball grid array package; 360 balls; heatsink - - -(EIAJ);MS-034(JEDEC);144E(IEC) 2010-01-22
SOT1164-1 BGA360 plastic ball grid array package; 360 balls - - -(EIAJ);MS-034(JEDEC);144E(IEC) 2010-01-22
SOT1165-1 DFN2510-10 plastic, extremely thin small outline package; 10 terminals; 0.5 mm pitch; 2.5 mm x 1 mm x 0.5 mm body - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2013-02-18
SOT1166-1 DFN1714-8 plastic, thermal enhanced ultra thin small outline package; 8 terminals; 0.4 mm pitch; 1.7 mm x 1.35 mm x 0.55 mm body - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2010-03-22
SOT1167-1 DFN2514-12 plastic, thermal enhanced ultra thin small outline package; 12 terminals; 0.4 mm pitch; 2.5 mm x 1.35 mm x 0.55 mm body - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2010-03-22
SOT1168-1 HUSON6 plastic, thermal enhanced ultra thin small outline package; 16 terminals; 0.4 mm pitch; 3.3 mm x 1.35 mm x 0.55 mm body - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2010-03-22
SOT1169-1 LFBGA256 plastic low profile fine-pitch ball grid array package; 256 balls 2010-03-01
SOT117-1 DIP28 plastic dual in-line package; 28 leads (600 mil) SC-510-28(EIAJ);MO-015(JEDEC);051G05(IEC) 2003-02-13
SOT117-2 DIP28 plastic dual in-line package; 28 leads (600 mil); long body SC-510-28(EIAJ);MS-011(JEDEC);051G06(IEC) 2003-03-12
SOT117-3 DIP28 plastic, dual in-line package; 2.54 mm pitch, 13.9 mm x 36.85 mm x 3.81 mm body 2017-03-21
SOT117-4 DIP28 DIP28, plastic, dual in-line package; 28 terminals; 2.54 mm pitch; 13.97 mm x 36.83 mm x 5.08 mm body E-PDIP-T28(JEDEC) 2017-06-11
SOT1172-1 HTSSOP28 plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad - - -(EIAJ);MO-153(JEDEC);- - -(IEC) 2010-03-31
SOT1172-2 HTSSOP28 plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad MO-153(JEDEC) 2010-07-13
SOT1172-3 HTSSOP28 plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad MO-153(JEDEC) 2013-09-12
SOT1172-4 HTSSOP28 HTSSOP28, plastic, thermal enhanced thin shrink small outline package; 28 terminals; 0.65 mm pitch; 4.4 mm x 9.7 mm x 1 mm body TS-PDSO-G28(JEDEC) 2017-06-11
SOT1173-1 HVQFN64R plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; resin based - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2010-04-02
SOT1174-1 XQFN12 plastic, extremely thin quad flat package; 12 terminals; 0.4 mm pitch; 1.7 mm x 2 mm x 0.5 mm body MO-288(JEDEC) 2010-04-21
SOT1175-1 SO7 plastic small outline package; 7 leads; body width 3.9 mm 2010-04-21
SOT1176-1 DFN2510A-10 plastic, extremely thin small outline package; 10 terminals; 0.5 mm pitch; 2.5 mm x 1 mm x 0.5 mm body - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2010-06-22
SOT1177-1 XSON10 plastic extremely thin small outline package; no leads; 10 terminals - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2010-11-08
SOT1178-1 DFN2110-9 plastic, extremely thin small outline package; 9 terminals; 0.4 mm pitch; 2.1 mm x 1 mm x 0.5 mm body - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2010-06-03
SOT1179-1 HVSON12 plastic thermal enhanced very thin small outline package; no leads; 12 terminals; body 4 x 6 x 0.85 mm ---(EIAJ);---(JEDEC);---IEC 2008-09-24
SOT1180-1 HWQFN32 plastic thermal enhanced very very thin quad flat package; no leads; 32 terminals 2010-08-05
SOT1181-1 HTQFP48 plastic thermal enhanced thin quad flat package; 48 leads; exposed die pad - - -(EIAJ);MS-026(JEDEC);- - -(IEC) 2010-08-04
SOT1181-2 HTQFP48 HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 10 mm x 10 mm x 1 mm; exposed die pad MS-026(JEDEC) 2012-10-23
SOT1182-1 HXQFN16 plastic thermal enhanced extremely thin quad flat package; no leads; 16 terminals - - -(EIAJ);- - -(IEC) 2010-09-16
SOT1183-1 HXQFN16 plastic thermal enhanced extremely thin quad flat package; no leads; 16 terminals - - -(EIAJ);- - -(IEC) 2010-07-29
SOT1184-1 HSOP14 plastic, heatsink small outline package; 14 leads - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2010-08-10
SOT1185-1 HVQFN32 HVQFN32: plastic termal enhanced very thin quad flat package; no leads; 32 terminals 2010-08-09
SOT1186-1 HSOP14F plastic, heatsink small outline package; 14 leads (flat) - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2010-09-20
SOT1187-1 XSON8 Plastic extremely thin small outline package; no leads; 8 terminals - - -(EIAJ);MO-229(JEDEC);- - -(IEC) 2010-10-07
SOT1188-1 SIL4 plastic, single in-line package 2010-10-04
SOT1188-2 SIL4 SIL4, plastic single in-line package, 4 terminals, 1.8 mm pitch, 11 mm x 7.4 mm x 1.95 mm body 2018-03-16
SOT1189-1 HXSON6 plastic, thermal enhanced extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1.6 mm x 1.6 mm x 0.5 mm body 2018-08-14
SOT1190-1 LFBGA144 plastic low profile fine-pitch ball grid array package; 144 balls, 0.8 mm pitch, 10 mm x 10 mm x 1 mm body MO-205(JEDEC) 2013-01-10
SOT1190-2 LFBGA144 plastic low profile fine-pitch ball grid array package; 144 balls - - -(EIAJ);MO-205(JEDEC) 2010-12-30
SOT1191-1 XQFN10 plastic, extremely thin quad flat package; no leads; 10 terminals - - -(EIAJ);MO255(JEDEC);- - -(IEC) 2010-12-06
SOT1192-1 HXSON4 plastic, thermal enhanced extremely thin small outline package; 4 terminals; 0.65 mm pitch; 1 mm x 1 mm x 0.5 mm body - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2011-01-20
SOT1193-1 XQFN8 Plastic, extremely thin quad flat package; no leads; 8 terminals - - -(EIAJ);MO-255(JEDEC);- - -(IEC) 2010-11-02
SOT1193-2 XQFN8 plastic, extremely thin quad flat package; no leads; 8 terminals - - -(EIAJ);MO-255(JEDEC);- - -(IEC) 2011-01-17
SOT1194-1 DFN1010C-4 plastic, thermal enhanced ultra thin small outline package; 4 terminals; 0.65 mm pitch; 1 mm x 1 mm x 0.55 mm body - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2011-01-25
SOT1196-1 SO12 SO12: plastic small outline package; 12 leads; body width 3.9 mm MS-012 Compliant(JEDEC) 2011-02-16
SOT1197-1 HXSON10 plastic, thermal enhanced extremely thin small outline package; 10 terminals; 0.5 mm pitch; 2.6 mm x 2.6 mm x 0.5 mm body 2011-01-20
SOT1198-1 HVQFN54R plastic thermal enhanced very thin quad flat package; no leads; 54 terminals; resin based - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2011-01-20
SOT1199-1 VFBGA24 plastic very thin fine-pitch ball grid array package; 24 balls 2011-02-16
SOT1202 XSON6 plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 1 mm x 1mm x 0.35 mm body 2010-04-06
SOT1202-2 X2SON6 X2SON6, plastic super thin small outline package; no leads; 6 terminals; 1.0 mm x 1.0 mm x 0.32 mm body 2018-03-08
SOT1203 XSON8 plastic, extremely thin small outline package; 8 terminals; 0.55 mm pitch; 1.35 mm x 1 mm x 0.35 mm body 2010-04-06
SOT1205 LFPAK56D plastic, single ended surface mounted package (LFPAK56D); 8 leads; 1.27 mm pitch; 4.7 mm x 5.3 mm x 1.05 mm body ---(EIAJ);---(JEDEC);---(IEC) 2014-10-28
SOT1207-1 SIL2 SIL2, plastic single in-line package; 2 terminals (EIAJ);(JEDEC);IEC 2016-03-07
SOT1209 HXSON6 plastic thermal enhanced super thin small outline package; no leads; 6 terminals; body 2 x 1.3 x 0.35 mm 2014-10-10
SOT120A CRPM4 studded ceramic package; 4 leads 1999-03-29
SOT1210 LFPAK33 Plastic, single ended surface mounted package (LFPAK33); 8 leads; 0.65 mm pitch; 2.7 mm x 3.4 mm x 0.9 mm body 2016-08-09
SOT1215 DFN1010D-3 plastic, thermal enhanced ultra thin small outline package; 3 terminals; 0.75 mm pitch; 1.1 mm x 1 mm x 0.37 mm body 2013-03-06
SOT1216 DFN1010B-6 plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.75 mm pitch; 1.1 mm x 1 mm x 0.37 mm body 2013-03-06
SOT1220 DFN2020MD-6 plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body 2012-05-03
SOT1222-1 HSOP6 plastic, heatsink small outline package; 6 leads 2012-07-02
SOT1222-2 HSOP6 plastic, heatsink small outline package; 6 leads 2015-06-08
SOT1225 DFN1612-8 plastic, extremely thin small outline package; 8 terminals; 0.4 mm pitch; 1.6 mm x 1.2 mm x 0.4 mm body 2012-07-24
SOT1226 X2SON5 plastic, thermal enhanced extremely thin small outline package; no leads; 5 terminals; 0.48 mm pitch; 0.8 mm x 0.8 mm x 0.35 mm body 2012-04-18
SOT1226-2 X2SON5 plastic thermal enhanced extremely thin small outline package; no leads; 5 terminals 2012-04-05
SOT1229 XSON6 plastic, extremely thin small outline package; 6 terminals; 0.4 mm pitch; 1.2 mm x 1.2 mm x 0.4 mm body 2013-06-26
SOT122E CRPM4 studded ceramic package; 4 leads 1999-03-29
SOT122F CRPM4 studded ceramic package; 4 leads 1999-03-29
SOT1230 XSON6 plastic very thin small outline package; no leads; 6 terminals; body 1.1 x 0.9 x 0.47 mm 2013-01-08
SOT1232 XSON6 XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1.1 x 0.7 x 0.37 mm 2013-11-08
SOT1232-1 XSON6 plastic flip-chip quad flat package; no leads; 6 terminals; body 1.1 x 0.7 x 0.37 mm 2014-08-29
SOT1233 X2SON plastic, thermal enhanced extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1.35 mm x 0.8 mm x 0.35 mm body 2016-04-21
SOT1234 HX2SON6 plastic, thermal enhanced super thin small outline package; no leads; 6 terminals; 0.4 mm pitch, 1.4 mm x 1.2 mm x 0.32 mm body 2017-09-01
SOT1234-7 QFP80 QFP80, plastic, quad flat package; 80 terminals; 0.65 mm pitch; 14 mm x 14 mm x 2.2 mm body (SPC-PAE143-001 )(JEDEC) 2017-06-11
SOT1235 LFPAK88 Plastic, single-ended surface-mounted package (LFPAK88; Power-SO8); 4 leads 2016-06-02
SOT1236 LFPAK88D Plastic, single-ended surface-mounted package (LFPAK88D; Power-SO8); 4 leads 2016-06-02
SOT1249B LDMOST Earless flanged LDMOST ceramic package; 6 leads 2015-03-03
SOT1252 DFM8 Plastic earless flanged cavity package; 6 leads 2013-05-24
SOT1254 DPAK plastic, thermal enhanced small outline package (DFN56 AD); 8 Leads; 1.27 mm pitch; 6 mm x 5 mm x 0.9 mm body 2014-11-06
SOT1255 X2SON plastic, thermal enhanced extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 0.8 mm x 0.35 mm body 2015-07-22
SOT1259 TO3P Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO3P 2014-10-22
SOT1260-1 HX2SON plastic, thermal enhanced super thin small outline package; no leads; 8 terminals; body 1.5 x 1.5 x 0.3 mm 2014-06-11
SOT1261-1 SOT1261 plastic, thermal enhanced super thin quad flat package; no leads; 12 terminals; body 2.0 x 2.0 x 0.3 mm 2014-06-20
SOT1263 SOT1263 Microlead ultra small surface-mounted plastic package; 3 leads - - -(JEDEC) 2011-03-22
SOT1268 DFN1412-6 plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.5 mm pitch; 1.4 mm x 1.2 mm x 0.47 mm body 2016-09-02
SOT1288 SIP3 Plastic single-ended multi-chip package; 6 interconnections; 3 in-line leads 2016-08-02
SOT1288-2 SIP3 Plastic single-ended multi-chip package; 6 interconnections; 3 in-line leads 2013-08-05
SOT1288-3 SIL3 Plastic single-ended package; 6 interconnections; 3 in-line leads 2016-09-26
SOT1289 CFP15 plastic, thermal enhanced ultra thin SMD package; 3 terminals; 2.13 mm pitch; 5.8 x 4.3 x 0.78 mm body ---(EIAJ);---(JEDEC);---(IEC) 2014-04-29
SOT129-1 DIP40 plastic dual in-line package; 40 leads (600 mil) SC-511-40(EIAJ);MO-015(JEDEC);051G08(IEC) 2003-02-13
SOT129-4 DIP40 DIP40, plastic, dual in-line package; 40 terminals; 2.54 mm pitch; 13.97 mm x 52.07 mm x 5.08 mm body E-PDIP-T40(JEDEC) 2017-06-11
SOT1290 SOT1290 Plastic single-ended multi-chip package; magnetized ferrite magnet (2 x 3 x 1 mm); 2 in-line leads 2014-08-04
SOT1291 SOT1291 Plastic single-ended multi-chip package; magnetized trenched ferrite magnet (3.8 mm x 6.15 mm x 3.6 mm); 2 in-line leads 2014-07-21
SOT1301-1 HLQFN16R plastic thermal enhanced low profile quad flat package; no leads; 16 terminals ---(EIAJ);---(JEDEC);---(IEC) 2011-08-30
SOT1302-1 FBGA196 plastic fine-pitch ball grid array package; 196 balls MO-205(JEDEC) 2011-02-22
SOT1303-1 HLQFN56R plastic thermal enhanced low profile quad flat package; no leads; 56 terminals; resin based - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2011-03-16
SOT1304-1 HLQFP176 plastic thermal enhanced low profile quad flat package, 176 terminals, 0.4 mm pitch, 20 mm x 20 mm x 1.4 mm body MS-026(JEDEC) 2011-04-20
SOT1305-1 HSOP44 HSOP44: plastic, heatsink small outline package; 44 leads; low stand-off height ---(EIAJ);---(JEDEC);---(IEC) 2011-05-31
SOT1305-2 HSOP44 HSOP44, plastic, thermal enhanced small outline package; 44 terminals; 0.65 mm pitch; 15.9 mm x 11 mm x 3 mm body PDSO-G44(JEDEC) 2017-06-11
SOT1306-1 VFBGA64 Plastic very thin fine-pitch ball grid array package; 64 balls ---(EIAJ);---(JEDEC);---(IEC) 2011-06-10
SOT1307-1 VFBGA64 plastic very thin fine-pitch ball grid array package; 64 balls; ---(EIAJ);---(JEDEC);---(IEC) 2011-06-16
SOT1307-2 VFBGA64 VFBGA64, plastic very thin fine-pitch ball grid array package; 64 balls; 4.5 mm x 4.5 mm x 0.80 mm body 2017-10-20
SOT1308-1 HVSON16 Plastic thermal enhanced very thin small outline package; no leads; 16 terminals MO-229(JEDEC) 2011-07-04
SOT1308-2 HVSON16 HVSON16, plastic thermal enhanced very thin small outline package; no leads;16 terminals; 0.65 mm pitch, 3.5 mm x 5.5 mm x 0.85 mm body MO-229(JEDEC) 2015-09-08
SOT1309-1 XQFN8 plastic, extremely thin quad flat package; no leads MO-255(JEDEC) 2011-08-23
SOT131-2 SIL9P plastic single in-line power package; 9 leads 2003-03-12
SOT1310-1 XQFN24 plastic, extremely thin quad flat package; no leads; 0.4 mm pitch; 3.4 mm x 2.5 mm x 0.5 mm body MO-288(JEDEC) 2011-08-22
SOT1311-1 SO8 Plastic small outline package; 8 leads 2011-08-18
SOT1311-2 SO8 SO8, plastic, small outline package; 8 terminals; 1.27 mm pitch; 5.28 mm x 5.3 mm x 2.05 mm body E-PDSO-G8(JEDEC) 2017-06-11
SOT1312-1 HXSON4 HXSON4: plastic thermal enhanced extremely thin small outline package; no leads; 4 terminals; body 2.0 mm x 1.5 mm x 0.5 mm 2012-11-05
SOT1313-1 HLQFP208 plastic thermal enhanced low profile quad flat package: 208 leads ---(EIAJ);MS-026(JEDEC);---(IEC) 2011-11-04
SOT1313-2 HLQFP208 HLQFP208, plastic, thermal enhanced low profile quad flat package; 208 terminals; 0.5 mm pitch; 28 mm x 28 mm x 1.4 mm body 2017-06-11
SOT1314-1 VSON4 plastic very thin small outline package; no leads; 4 terminals ---(EIAJ);---(JEDEC);---(IEC) 2011-11-04
SOT1315-1 LFBGA170 plastic low profile fine-pitch ball grid array package; 170 balls ---(EIAJ);MO-205(JEDEC);---(IEC) 2011-11-04
SOT1316-1 LQFP48 plastic low profile quad flat package; 48 leads; body 10 x 10 x 1.4 mm 2011-11-03
SOT1317-1 HTQFN80R plastic thermal enhanced thin quad flat package; no leads; 80 terminals; resin based; body 12 x 12 x 1.1 mm 2012-10-30
SOT1318-1 HXQFN32 plastic, thermal enhanced extremely thin quad flat package; no leads; 32 terminals; 0.4 mm pitch; 4 mm x 4 mm x 0.5 mm body (EIAJ);(JEDEC);IEC 2011-11-30
SOT1320-1 VFBGA49 plastic very thin fine-pitch ball grid array package; 49 balls 2012-01-05
SOT1321-1 TFBGA132 plastic thin fine-pitch ball grid array package; 132 balls MO-205(JEDEC) 2012-01-25
SOT1322-1 LFBGA223 plastic low profile fine-pitch ball grid array package; 223 balls, 0.65 mm pitch, 12 mm x 12 mm x 1.3 mm body MO-205(JEDEC) 2012-01-25
SOT1323-1 VSON4 plastic very thin small outline package; no leads; 4 terminals 2012-03-08
SOT1324-1 FBGA144 plastic fine-pitch ball grid array package; 144 balls MO-205(JEDEC) 2012-03-08
SOT1325-1 HVSON10 plastic thermal enhanced very thin small outline package; no leads; 10 terminals MO-229(JEDEC) 2012-04-17
SOT1327-1 HWSON8 HWSON8: plastic thermal enhanced very very thin small outline package; no leads; 8 terminals MO-229(JEDEC) 2012-04-17
SOT1328-1 TFBGA80 plastic thin fine-pitch ball grid array package; 80 balls 2012-07-02
SOT1329-1 TFBGA100 plastic thin fine-pitch ball grid array package; 100 balls 2012-07-02
SOT1330-1 SO14 plastic small outline package; 14 leads 2012-07-13
SOT1331-1 HTSSOP38 plastic thermal enhanced thin shrink small outline package; 38 leads; body with 4.4 mm; lead pitch 0.5 mm; exposed die pad 2012-09-21
SOT1332-1 LFBGA267 plastic low profile fine-pitch ball grid array package; 267 balls 2012-09-20
SOT1333-1 DFN2520-9 plastic, extremely thin small outline package; 9 terminals; 0.5 mm pitch; 2 mm x 2.5 mm x 0.5 mm body MO-252(JEDEC) 2013-05-01
SOT1334-1 DFN4020-14 plastic, extremely thin small outline package; 14 terminals; 0.5 mm pitch; 2 mm x 4 mm x 0.5 mm body MO-252(JEDEC) 2013-05-01
SOT1335-1 HVQFN16 plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm 2012-09-21
SOT1336-1 TFBGA64 plastic thin fine-pitch ball grid array package; 64 balls 2012-09-25
SOT1337-1 XQFN10 plastic, extremely thin small outline package; 10 terminals; 0.4 mm pitch; 1.3 mm x 1.6 mm x 0.5 mm body MO-288(JEDEC) 2012-09-11
SOT1338-1 HXSON6 plastic extremely thin small outline package; no leads; 6 terminals; body 2.0 x 2.0 x 0.5 mm 2012-09-20
SOT1339-1 LFBGA217 plastic low profile fine-pitch ball grid array package; 217 balls MO-205(JEDEC) 2012-09-20
SOT1340-1 HXSON4 plastic extremely thin small outline package; no leads; 4 terminals; body 1.6 x 1.2 x 0.5 mm (EIAJ);(JEDEC);IEC 2012-09-10
SOT1341-1 XSON16 plastic extremely thin small outline package; no leads; 16 terminals; body 2.5 x 3.2 x 0.5 mm MO-252(JEDEC) 2013-02-13
SOT1342-1 XFBGA24 plastic, extremely thin fine-pitch ball grid array package; 24 balls 2012-09-25
SOT1343-1 TFBGA484 plastic thin fine-pitch ball grid array package; 484 balls, 0.65 mm pitch, 15 mm x 15 mm x 1.2 mm body 2012-11-26
SOT1344-1 UFLGA53R plastic fine-pitch land grid array package; 53 lands 2012-11-28
SOT1345-1 TFBGA50 plastic thin fine-pitch ball grid array package; 50 balls MO-195(JEDEC) 2013-07-17
SOT1346-1 XQFN20 plastic extremely thin small outline package; no leads; 20 terminals; body 2.00 x 2.70 x 0.40 mm - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2013-05-16
SOT1347-1 DIP8 plastic dual in-line package; 7 leads (300 mil) MO-001(JEDEC);076E03(IEC) 2013-01-21
SOT1348-1 HXSON6 plastic, thermal enhanced extremely thin small outline package; no leads; 6 terminals; body 2.0 x 2.0 x 0.5 mm 2015-05-15
SOT1349-1 WFBGA32 plastic very-very-thin profile fine-pitch ball grid array package; 32 balls 2013-02-21
SOT1350-1 UFLGA49 plastic ultra thin fine-pitch land grid array package; 49 lands 2013-06-04
SOT1353-1 TSOP6 plastic surface-mounted package (TSOP6); 6 leads SC-74(EIAJ) 2013-04-18
SOT1354-1 XFBGA16 plastic, extremely thin fine-pitch ball grid array package; 16 balls 2013-08-27
SOT1355-1 X2QFN X2QFN12: plastic, super thin quad flat package; no leads; 12 terminals; body 1.6 x 1.6 x 0.35 mm 2014-01-13
SOT1358-1 XSON7 plastic, extremely thin small outline package; 7 terminals; 0.5 mm pitch; 1.1 mm x 2.1 mm x 0.5 mm body 2013-09-12
SOT1359-1 HVFLGA Plastic thermal enhanced very thin profile fine pitch land grid array package; 36 terminals, 0.4 mm pitch, 5 mm x 5 mm x 0.72 mm body 2015-01-27
SOT1359-2 HVLGA HVLGA36, plastic thermal enchanced very thin profile land grid array package; 36 terminals; 5 mm x 5 mm x 0.72 mm body 2017-03-28
SOT136-1 SO28 plastic, small outline package; 28 leads; 1.27 mm pitch; 17.9 mm x 7.5 mm x 2.65 mm body MS-013(JEDEC);075E06(IEC) 2003-02-19
SOT136-3 SO28 SO28, plastic, small outline package; 28 terminals; 1.27 mm pitch; 7.5 mm x 17.93 mm x 2.35 mm body E-PDSO-G28(JEDEC) 2017-06-11
SOT1360-1 HVSON20 plastic thermal enhanced extremely thin quad flat package; no leads; 20 terminals; body 3.5 mm x 5.5 mm x 0.85 mm 2015-07-06
SOT1360-2 HVSON plastic thermal enhanced extremely thin quad flat package; no leads; 20 terminals; body 3.5 x 5.5 x 0.85 mm 2015-05-11
SOT1361-1 UFBGA24 UFBGA24: plastic ultra thin fine-pitch ball grid array package; 24 balls 2013-11-07
SOT1362-1 HWSON4 HWSON4: plastic thermal enhanced very very thin small outline package; no leads; 4 terminals; body 2.0 x 2.0 x 0.75 mm - - -(EIAJ);MO-229(JEDEC);- - -(IEC) 2013-11-20
SOT1363-1 WFBGA171 WFBGA171: plastic very-very-thin profile fine-pitch ball grid array package; 171 balls 2014-04-01
SOT1365-1 TFBGA48 Plastic thin fine-pitch ball grid array package; 48 balls, 0.65 mm pitch, 3 mm x 8 mm x 1.05 mm body 2014-08-12
SOT1369-2 HVQFN40 plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 5 mm x 5 mm x 0.85 mm 2015-01-08
SOT1369-3 HVQFN40 plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 5 mm x 5 mm x 0.85 mm 2016-05-18
SOT1369-4 HVQFN40 HVQFN40, plastic, thermally enhanced very thin quad; flat non-leaded package; 40 terminals; 0.4 mm pitch; 5 mm x 5 mm x 0.85 mm body 2017-03-24
SOT137-1 SO24 plastic, small outline package; 24 leads; 1.27 mm pitch; 15.4 mm x 7.5 mm x 2.65 mm body MS-013(JEDEC);075E05(IEC) 2003-02-19
SOT137-2 SO24 SO24, plastic, small outline package; 24 terminals; 1.27 mm pitch; 7.5 mm x 15.4 mm x 2.35 mm body E-PDSO-G24(JEDEC) 2017-06-11
SOT1372-1 SOT1372 plastic thermal enhanced very thin small package; no leads; 8 terminals; body 3 x 2 x 0.35 mm 2014-05-20
SOT1373-1 SOT1373 plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad 2014-05-20
SOT1375-4 WLCSP4 WLCSP4, wafer level chip-scale package, 4 terminals, 1.03 mm x 0.94 mm x 0.5 mm body 2016-04-26
SOT1376-2 WLCSP4 WLCSP4, wafer level chip-scale package; 4 bumps; 0.97 mm x 0.97 mm x 0.54 mm body (backside coating included) 2017-08-22
SOT1379-3 WLCSP6 WLCSP6, wafer level chip scale package, 6 terminals, 0.22 mm pitch, 0.66 mm x 0.45 mm x 0.23 mm body 2018-08-23
SOT1380-1 WLCSP6 wafer level chip-scale package; 6 bumps; 0.69 mm x 1.09 mm x 0.38 mm 2016-11-24
SOT1380-5 WLCSP6 WLCSP6, , wafer level chip-size package; 6 terminals; 0.4 mm pitch; 1.22 mm x 0.85 mm x 0.6 mm body 2017-06-11
SOT1384-4 WLCSP9 WLCSP9, wafer level chip-scale package; 9 bumps; 1.50 mm x 1.28 mm x 0.60 mm body 2017-03-03
SOT1384-5 WLCSP9 wafer level chip-scale package; 9 bumps; 1.24 mm x 1.24 mm x 0.525 mm body (backside coating included) 2018-08-08
SOT1385-2 WLCSP9 WLCSP9, wafer level chip-scale package; 9 bumps; 0.5 mm pitch, 1.49 mm x 1.49 mm x 0.555 mm body (backside coating included) 2018-03-06
SOT1390-1 WLCSP12 WLCSP12, wafer level chip scale package; 12 bumps; 0.4 mm pitch; 1.36 mm x 1.66 mm x 0.51 mm body (backside coating included) 2017-09-09
SOT1390-10 WLCSP12 WLCSP12, wafer level chip-scale package, 12 terminals, 0.4 mm pitch, 1.97 mm x 1.42 mm x 0.525 mm body 2018-06-19
SOT1390-5 WLCSP12 wafer level chip-scale package, 12 bumps 2016-03-02
SOT1390-6 WLCSP12 WLCSP12, wafer level chip-scale package; 12 bumps; 1.62 mm x 1.43 mm x 0.525 mm (backside coating included) 2017-01-11
SOT1390-7 WLCSP12 WLCSP12, wafer level chip-scale package; 12 bumps; 1.67 mm x 1.27 mm x 0.525 mm (backside coating included) 2017-04-24
SOT1390-8 WLCSP12 WLCSP12, wafer level chip scale package; 12 bumps; 0.4 mm pitch; 1.65 mm x 1.25 mm x 0.525 mm body (backside coating included) 2017-10-23
SOT1392-1 WLCSP wafer level chip-scale package; 15 bumps; 2.56 x 1.54 x 0.555 mm (Backside coating included) 2015-08-11
SOT1393-2 WLCSP16 WLCSP16, wafer level chip-scale package; 16 bumps; 1.84 mm x 1.84 mm x 0.5 mm body 2018-02-09
SOT1394-2 WLCSP16 wafer level chip-scale package; 16 bumps; 2.05 x 2.05 x 0.555 mm (Backside coating included) 2016-08-29
SOT1394-3 WLCSP16 WLCSP16, wafer level chip-scale package, 16 bumps, 2.20 mm x 2.20 mm x 0.555 mm body (backside coating included) 2018-03-12
SOT1397-2 WLCSP20 WLCSP20, wafer level chip-size package; 20 terminals; 0.4 mm pitch; 2 mm x 1.61 mm x 0.56 mm body NON-JEDEC(JEDEC) 2017-06-11
SOT1397-3 WLCSP20 WLCSP20, wafer level chip-size package; 20 terminals; 0.4 mm pitch; 1.94 mm x 1.99 mm x 0.6 mm body 2017-06-11
SOT1397-4 WLCSP20 wafer level chip-scale package, 20 bumps 2016-04-26
SOT1397-5 WLCSP20 WLCSP20, wafer level chip-size package; 20 terminals; 0.4 mm pitch; 2 mm x 1.61 mm x 0.32 mm body 2017-06-11
SOT1397-6 WLCSP20 WLCSP20, wafer level chip-scale package; 20 bumps; 1.70 mm x 2.16 mm x 0.525 mm body (backside coating included) 2017-01-19
SOT1397-7 WLCSP25 WLCSP25, wafer level chip-scale package; 25 bumps; 0.4 mm pitch, 2.09 mm x 2.09 mm x 0.525 mm body 2017-12-04
SOT1397-8 WLCSP20 WLCSP20, wafer level chip-scale package; 20 bumps; 0.4 mm pitch, 2.50 mm x 1.84 mm x 0.5 mm body 2018-05-24
SOT1399-1 WLCSP24 WLCSP24, wafer level chip-scale package; 24 bumps; 2.98 mm x 1.90 mm x 0.525 mm body (backside coating included) 2017-06-22
SOT1401-1 WLCSP25 wafer level chip-scale package, 25 balls; 2.51 mm x 2.51 mm x 0.5 mm body 2015-10-05
SOT1401-2 WLCSP25 WLCSP25, wafer level chip-scale package, 25 bumps, 2.27 mm x 2.17 mm x 0.62 mm 2017-05-12
SOT1401-3 WLCSP25 WLCSP25, wafer level chip-scale package, 25 bumps, 2.555 mm x 2.525 mm x 0.368 mm body (backside coating included) 2017-05-12
SOT1401-4 WLCSP25 wafer level chip-scale package, 25 balls; 0.4 mm pitch, 2.09 mm x 2.09 mm x 0.525 mm body 2018-08-03
SOT1403-1 WLCSP34 wafer level chip-scale package, 34 bumps 2016-08-08
SOT1404-2 WLCSP36 WLCSP 36 2.4*2.5*.6 P.35 2017-06-11
SOT1404-3 WLCSP wafer level chip-scale package; 36 bumps; 2.07 x 2.07x 0.42 mm 2016-04-26
SOT1408-1 SOT1408 plastic, super thin quad flat package; no leads; 12 terminals; body 2.10 x 1.25 x 0.35 mm MO-255(JEDEC) 2015-01-19
SOT141-6 DBS13P plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm) 2003-03-12
SOT141-8 DBS13P plastic DIL-bent-SIL power package; 13 leads (lead length 7.7 mm) 2003-03-12
SOT1411-1 WLCSP12 WLCSP12, wafer level chip scape package, 12 terminals, 1.58 mm x 2.15 mm x 0.22 mm body 2010-09-27
SOT142-1 SIL9MP plastic single in-line medium power package; 9 leads 2003-03-12
SOT1425-1 WLCSP9 WLCSP9, wafer level chip scape package, 9 terminals, 1.89 mm x 1.22 mm x 0.22 mm body 2013-07-16
SOT1425-2 WLCSP9 WLCSP9, wafer level chip scape package, 9 terminals, 1.89 mm x 1.22 mm x 0.17 mm body 2013-07-16
SOT1426-1 HUQFN32 plastic thermal enhanced ultra thin quad flat package; no leads; 32 terminals; body 5 mm x 5 mm x 0.56 mm 2014-08-07
SOT1426-2 HUQFN32 QFN 32 5*5*0.65 P0.5 2017-06-11
SOT1427-1 LFBGA159 plastic low profile fine-pitch ball grid array package; 159 balls 2014-07-26
SOT1428-1 HVQFN plastic thermal enhanced very thin quad flat package; no leads; 27 terminals; body 5 x 5 x 0.85 mm 2014-10-14
SOT1429-1 HSOP6F plastic, heatsink small outline package; 6 leads(flat) 2014-10-30
SOT1430-1 X2QFN plastic extremely thin small outline package; no leads; 10 terminals; body 1.6 x 1.3 x 0.33 mm 2015-02-10
SOT1431-1 HVFLGA44 Plastic, thermal enhanced very thin profile fine pitch land grid array package; 44 terminals, 0.4 mm pitch, 5 mm x 5 mm x 0.72 mm body 2016-08-12
SOT1432-1 TFBGA plastic thin fine-pitch ball grid array package; 321 balls 2014-11-17
SOT1435-1 HX2QFN plastic, thermal enhanced super thin quad flat package; no leads; 16 terminals; body 2.0 x 2.0 x 0.3 mm 2015-03-05
SOT1436-1 HX2SON plastic, thermal enhanced super thin small outline package; no leads; 10 terminals; 0.35 mm pitch, 2.0 mm x 1.7 mm x 0.3 mm body 2015-05-21
SOT1437-1 SO10 plastic small outline package; 10 leads; body width 3.9 mm; body thickness 1.35 mm 2015-03-06
SOT1438-1 HVSON plastic thermal enhanced extremely thin quad flat package; no leads; 28 terminals; body 3.5 x 7.5 x 0.85 2015-07-31
SOT1439-1 VFBGA40 plastic very thin fine-pitch ball grid array package; 40 balls 2015-04-02
SOT143B SOT143B plastic, surface-mounted package; 4 leads; 1.9 mm pitch; 2.9 mm x 1.3 mm x 1 mm body 2006-03-16
SOT143R SOT143R plastic surface-mounted package; reverse pinning; 4 leads SC-61AA(EIAJ) 2006-03-16
SOT144-1 PMFP8 plastic micro flat package; 8 leads (straight) 2003-03-12
SOT1440-2 WLCSP49 WLCSP49, wafer level chip-size package; 49 terminals; 0.054 mm pitch; 3.14 mm x 2.92 mm x 0.56 mm body 2017-06-11
SOT1442-1 DHXQFN plastic dual in-line compatible thermal enhanced super-thin quad flat package; no leads; 18 terminals; body 2.4 x 2.0 x 0.35 mm 2016-02-15
SOT1443-2 WLCSP wafer level chip-scale package; 30 bumps; 2.26 x 2.56 x 0.51 mm (backside coating included) 2015-06-11
SOT1443-3 WLCSP wafer level chip-scale package; 30 bumps; 2.06 x 2.72 x 0.525 mm (Backside coating included) 2016-04-26
SOT1444-10 WLCSP WLCSP49, wafer level chip-scale package; 49 bumps; 2.97 mm x 3.37 mm x 0.56 mm (backside coating included) 2017-01-06
SOT1444-12 WLCSP49 WLCSP49, wafer level chip-scale package, 49 terminals, 0.4 mm pitch, 2.915 mm x 3.142 mm x 0.564 mm body 2018-04-20
SOT1444-3 WLCSP wafer level chip-scale package; 49 bumps; 2.98 x 3.43 x 0.56 mm 2015-07-21
SOT1444-4 WLCSP wafer level chip-scale package; 49 bumps; 2.98 x 3.43 x 0.56 mm (Backside coating included) 2015-07-21
SOT1444-5 WLCSP49 WLCSP49, wafer level chip-scale package; 49 bumps; 3.44 mm x 3.44 mm x 0.525 mm (Backside coating included) 2016-04-26
SOT1444-6 WLCSP wafer level chip-scale package; 49 bumps; 2.97 x 3.37 x 0.5 mm 2016-04-26
SOT1444-7 WLCSP wafer level chip-scale package; 49 bumps; 2.97 x 3.37 x 0.525 mm 2016-04-26
SOT1444-8 WLCSP49 wafer level chip-scale package; 49 bumps; 3.13 x 3.63 x 0.5 mm 2016-08-09
SOT1444-9 WLCSP wafer level chip-scale package; 49 bumps; 3.19 mm x 3.19 mm x 0.49 mm 2016-04-26
SOT1445-1 WLCSP wafer level chip-scale package; 6 bumps; 0.69 x 0.44 x 0.29 mm 2016-07-11
SOT1445-2 WLCSP wafer level chip-scale package; 6 bumps; 0.69 mm x 0.44 mm x 0.29 mm 2016-12-06
SOT1445-3 WLCSP6 WLCSP6, wafer level chip scale package, 6 terminals, 0.25 mm pitch, 0.7 mm x 0.45 mm x 0.23 mm body 2018-08-23
SOT1446-1 HVQFN plastic thermal enhanced very thin quad flat package; no leads; 184 terminals; body 12 x 12 x 0.85 mm 2015-07-29
SOT1447-1 WLCSP99 wafer level chip-scale package; 99 bumps; 4.37 x 3.82 x 0.5 mm 2015-06-26
SOT1447-2 WLCSP wafer level chip-scale package; 99 bumps; 4.37 x 3.82 x 0.525 mm (Backside coating included) 2015-10-09
SOT1448-1 WLCSP29 WLCSP29, wafer level chip-size package; 29 bumps; 3.19 mm x 2.07 mm x 0.6 mm body 2017-06-14
SOT1448-2 WLCSP WLCSP29, wafer level chip-scale package; 29 bumps; 3.19 mm x 2.07 mm x 0.6 mm (backside coating included) 2017-01-11
SOT1450-2 WLCSP100 WLCSP100, wafer level chip-scale package; 100 bumps; 5.07 mm x 5.07 mm x 0.53 mm body 2018-03-06
SOT1452-1 WLCSP11 wafer level chip-scale package, 11 bumps 2016-03-02
SOT1453-1 WLCSP8 wafer level chip-scale package, 8 bumps 2016-03-02
SOT1454-1 WLCSP6 wafer level chip-scale package, 6 bumps 2016-03-02
SOT1456-1 WFBGA155 plastic very-very-thin fine-pitch ball grid array package; 155 balls, 0.5 mm pitch, 7.5 mm x 7.5 mm x 0.76 mm body 2016-04-06
SOT1457-1 LFBGA364 plastic low profile fine-pitch ball grid array package, 364 balls 2016-03-02
SOT1458-1 DHX2QFN plastic dual in-line compatible thermal enchanged super thin quad flat package; no leads; 14 terminals; body 1.5 x 2.1 x 0.32 mm 2015-11-10
SOT1459-1 WLCSP42 wafer level chip-scale package; 42 bumps; 2.88 mm x 2.80 mm x 0.54 mm (Backside coating included) 2016-09-01
SOT1459-2 WLCSP wafer level chip-scale package; 42 bumps; 3.13 x 2.46 x 0.5 mm (backside coating included) 2016-04-26
SOT1459-3 WLCSP wafer level chip-scale package; 42 bumps; 3.13 x 2.46 x 0.525 mm 2016-04-26
SOT1459-6 WLCSP WLCSP42, wafer level chip-scale package; 42 bumps; 2.91 mm x 2.51 mm x 0.525 mm body (backside coating included) 2017-07-28
SOT146-1 DIP20 plastic, dual in-line package; 20 leads; 2.54 mm pitch; 26.1 mm x 6.35 mm x 4.2 mm body SC-603(EIAJ);MS-001(JEDEC) 2003-02-13
SOT146-4 DIP20 DIP20, plastic, dual in-line package; 20 terminals; 2.54 mm pitch; 7.28 mm x 24.69 mm x 5.08 mm body E-PDIP-T20(JEDEC) 2017-06-11
SOT146-5 DIP20 DIP20, plastic, dual in-line package; 20 terminals; 2.54 mm pitch; 25.9 mm x 6.6 mm x 3.9 mm body 2018-08-08
SOT1461-1 WLCSP WLCSP13, wafer level chip-size package; 13 bumps, 0.4 mm pitch, 2.74 mm x 2.80 mm x 0.38 mm body 2016-08-08
SOT1461-2 WLCSP WLCSP13, wafer level chip-scale package; 13 bumps; 1.19 mm x 1.99 mm x 0.5 mm body 2017-02-23
SOT1462-1 HQFN plastic thermal enhanced quad flat package; no leads; 20 terminals; body 8.0 mm x 8.0 mm x 2.1 mm 2015-10-12
SOT1462-2 HQFN plastic thermal enhanced quad flat package; no leads; 20 terminals; body 8.0 mm x 8.0 mm x 2.1 mm 2015-10-13
SOT1462-3 HQFN plastic thermal enhanced quad flat package; no leads; 20 terminals; body 8.0 mm x 8.0 mm x 2.1 mm 2015-10-13
SOT1463-1 WLCSP wafer level chip-scale package, 46 bumps 2016-03-02
SOT1464-1 WLCSP wafer level chip-scale package, 6 bumps 2016-04-25
SOT1465-1 WLCSP31 wafer level chip-scale package, 31 bumps 2016-04-26
SOT1465-2 WLCSP31 wafer level chip-scale package, 31 bumps 2016-03-02
SOT1496-1 TFBGA plastic thin fine-pitch ball grid array package; 144 balls 2016-04-21
SOT1510-1 HLQFP64 HLQFP64, plastic, thermal enhanced low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body; 4.9 mm x 4.9 mm exposed pad MS-026 BCD(JEDEC) 2018-08-07
SOT1510-2 HLQFP64 HLQFP64, plastic, thermal enhanced low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body MS-026 BCD(JEDEC) 2018-07-24
SOT1510-3 HLQFP64 HLQFP64, plastic, thermal enhanced low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body FL-PQFP-G64(JEDEC) 2017-06-11
SOT1510-4 HLQFP64 plastic, thermal enhanced low profile quad flat package; 64 leads; body 10 x 10 x 1.5 mm 2016-07-12
SOT1511-1 HQFP64 HQFP64, plastic, thermal enhanced quad flatpack; no leads; 64 terminals; 0.65 mm pitch; 14 mm x 14 mm x 2.7 mm body PQFP-G64(JEDEC) 2017-06-11
SOT1512-1 LFBGA400 LFBGA400, plastic, low profile fine-pitch ball grid array; 400 balls; 0.8 mm pitch; 17 mm x 17 mm x 1.12 mm body PBGA-B400(JEDEC) 2017-06-11
SOT1512-2 LFBGA400 LFBGA400, plastic, low profile fine-pitch ball grid array; 400 balls; 0.8 mm pitch; 17 mm x 17 mm x 1.18 mm body 2016-02-01
SOT1513-1 BGA208 BGA208, plastic, ball grid array; 208 balls; 1 mm pitch; 17 mm x 17 mm x 1.15 mm body PBGA-B208(JEDEC) 2017-06-11
SOT1514-1 LFBGA404 LFBGA404, plastic, low profile fine-pitch ball grid array; 404 balls; 0.65 mm pitch; 17 mm x 17 mm x 1.02 mm body T-PBGA-B404(JEDEC) 2017-06-11
SOT1514-2 LFBGA404 LFBGA404, plastic, low profile fine-pitch ball grid array; 404 balls; 0.65 mm pitch; 17 mm x 17 mm x 1.32 mm body 2018-03-15
SOT1515-1 LFBGA289 LFBGA289, plastic, low profile fine-pitch ball grid array; 289 balls; 0.8 mm pitch; 17 mm x 17 mm x 1.6 mm body PBGA-B289(JEDEC) 2017-06-11
SOT1516-1 LFBGA292 LFBGA292, plastic, low profile fine-pitch ball grid array; 292 balls; 0.8 mm pitch; 17 mm x 17 mm x 1.7 mm body PBGA-B289(JEDEC) 2017-06-11
SOT1517-1 LFBGA364 LFBGA364, plastic, low profile fine-pitch ball grid array; 364 bumps; 0.8 mm pitch; 17 mm x 17 mm x 1.5 mm body 2017-03-24
SOT1517-2 LFBGA364 LFBGA364, plastic, low profile fine-pitch ball grid array; 363 balls; 0.8 mm pitch; 17 mm x 17 mm x 1.54 mm body 2017-06-11
SOT1517-3 LFBGA364 LFBGA364, plastic, low profile fine-pitch ball grid array; 364 balls; 0.8 mm pitch; 17 mm x 17 mm x 1.45 mm body 2017-06-11
SOT1518-1 LFBGA252 LFBGA252, plastic, low profile fine-pitch ball grid array; 252 balls; 0.8 mm pitch; 17 mm x 17 mm x 1.54 mm body 2017-06-11
SOT1519-1 LFBGA356 LFBGA356; plastic, low profile fine-pitch ball grid array; 356 bumps; 0.8 mm pitch; 17 mm x 17 mm x 1.54 mm body 2016-01-21
SOT1520-1 LFBGA292 LFBGA292, plastic, low profile fine-pitch ball grid array; 292 balls; 0.8 mm pitch; 17 mm x 17 mm x 1.46 mm body 2017-06-11
SOT1521-1 BGA208 BGA208, plastic, ball grid array; 208 balls; 1 mm pitch; 17 mm x 17 mm x 1.57 mm body 2017-06-11
SOT1522-1 HTQFP128 HTQFP128, plastic, thermal enhanced thin quad flat package; 128 terminals; 0.4 mm pitch; 14 mm x 14 mm x 1 mm body TS-PQFP-G128(JEDEC) 2017-06-11
SOT1523-1 LFBGA473 LFBGA473, plastic, low profile fine-pitch ball grid array; 473 balls; 0.8 mm pitch; 19 mm x 19 mm x 1.12 mm body PBGA-B473(JEDEC) 2017-06-11
SOT1523-2 LFBGA473 LFBGA473, plastic, low profile fine-pitch ball grid array; 473 balls; 0.8 mm pitch; 19 mm x 19 mm x 1.18 mm body 2017-06-11
SOT1524-1 FBGA484 FBGA484, plastic, fine-pitch ball grid array; 484 balls; 0.8 mm pitch; 19 mm x 19 mm x 1.62 mm body 2017-06-11
SOT1525-1 LFBGA541 LFBGA541, plastic, low profile fine-pitch ball grid array; 541 balls; 0.75 mm pitch; 19 mm x 19 mm x 1.33 mm body 2017-06-11
SOT1526-1 LFBGA529 LFBGA529, plastic, low profile fine-pitch ball grid array; 529 balls; 0.8 mm pitch; 19 mm x 19 mm x 1.37 mm body 2017-06-11
SOT1526-2 LFBGA529 LFBGA529, plastic, low profile fine-pitch ball grid array; 529 balls; 0.8 mm pitch; 19 mm x 19 mm x 1.12 mm body 2017-06-11
SOT1526-4 LFBGA529 LFBGA529, plastic, low profile fine-pitch ball grid array; 529 balls; 0.8 mm pitch; 19 mm x 19 mm x 1.25 mm body MO-275 PPAC-1(JEDEC) 2018-07-13
SOT1527-1 BGA516 BGA516, plastic, ball grid array; 516 balls; 1 mm pitch; 27 mm x 27 mm x 1.83 mm body R-PDSO-G8(JEDEC) 2017-06-11
SOT1527-2 BGA516 BGA516, plastic, ball grid array; 516 balls; 1 mm pitch; 27 mm x 27 mm x 1.95 mm body PBGA-B516(JEDEC) 2017-06-11
SOT1528-1 BGA416 BGA416, plastic, ball grid array; 416 bumps; 1.0 mm pitch; 27 mm x 27 mm x 2.02 mm body 2017-03-27
SOT1529-1 LFBGA624 plastic, low profile fine-pitch ball grid array; 624 bumps; 0.8 mm pitch; 21 mm x 21 mm x 1.6 mm body 2016-07-25
SOT1530-1 LFBGA369 LFBGA369, plastic, low profile fine-pitch ball grid array; 369 balls; 0.8 mm pitch; 19 mm x 19 mm x 1.61 mm body 2017-06-11
SOT1531-1 LFBGA489 LFBGA489, plastic, low profile fine-pitch ball grid array; 489 balls; 0.8 mm pitch; 19 mm x 19 mm x 1.61 mm body 2017-06-11
SOT1533-1 LFBGA121 LFBGA121, plastic, low profile fine-pitch ball grid array; 121 bumps; 0.65 mm pitch; 8 mm x 8 mm x 1.38 mm body 2016-01-20
SOT1533-2 LFBGA121 LFBGA121, plastic, low profile fine-pitch ball grid array; 121 bumps; 0.65 mm pitch; 8 mm x 8 mm x 1.3 mm body 2016-02-04
SOT1534-1 LFBGA289 LFBGA289, plastic, low profile fine-pitch ball grid array; 289 balls; 0.8 mm pitch; 14 mm x 14 mm x 1.37 mm body 2016-01-07
SOT1534-2 LFBGA289 LFBGA289, plastic, low profile fine-pitch ball grid array; 289 balls; 0.8 mm pitch; 14 mm x 14 mm x 1.18 mm body 2017-06-11
SOT1534-4 LFBGA289 LFBGA289, plastic, low profile fine-pitch ball grid array; 289 balls; 0.8 mm pitch; 14 mm x 14 mm x 1.37 mm body 2018-03-15
SOT1535-1 LBGA144 LBGA144; plastic, low profile ball grid array; 144 balls; 1.0 mm pitch; 13 mm x 13 mm x 1.7 mm body 2016-01-21
SOT1535-2 LBGA144 MAPBGA 144 13*13*1.6 P1 2017-06-11
SOT1536-1 LFBGA280 LFBGA280, plastic, low profile fine-pitch ball grid array; 280 balls; 0.65 mm pitch; 13 mm x 13 mm x 1.02 mm body 2016-01-29
SOT1537-1 LFBGA289 LFBGA289, plastic, low profile fine-pitch ball grid array; 289 balls; 0.65 mm pitch; 14 mm x 14 mm x 1.18 mm body PBGA-B289(JEDEC) 2017-06-11
SOT1538-1 LFBGA496 LFBGA496, plastic, low profile fine-pitch ball grid array; 496 balls; 0.5 mm pitch; 15 mm x 15 mm x 1.34 mm body PBGA-B496(JEDEC) 2017-06-11
SOT1539-1 LFBGA457 LFBGA457, plastic, low profile fine-pitch ball grid array; 457 balls; 0.5 mm pitch; 14 mm x 14 mm x 0.96 mm body PBGA-B457(JEDEC) 2017-06-11
SOT1540-1 TFBGA452 TFBGA452, plastic, thin fine-pitch ball grid array; 452 balls; 0.4 mm pitch; 11 mm x 11 mm x 1.2 mm body PBGA-B452(JEDEC) 2017-06-11
SOT1542-1 LFBGA169 LFBGA169, plastic, low profile fine-pitch ball grid array; 169 balls; 0.8 mm pitch; 11 mm x 11 mm x 1.02 mm body 2017-06-11
SOT1543-1 BGA160 BGA160, plastic, ball grid array; 160 balls; 1 mm pitch; 15 mm x 15 mm x 1.18 mm body PBGA-B160(JEDEC) 2017-06-11
SOT1544-1 LFBGA104 LFBGA104, plastic, low profile fine-pitch ball grid array; 104 balls; 0.8 mm pitch; 10 mm x 10 mm x 1.1 mm body PBGA-B104(JEDEC) 2017-06-11
SOT1545-1 LFBGA527 LFBGA527, plastic, low profile fine-pitch ball grid array; 527 balls; 0.5 mm pitch; 13 mm x 13 mm x 0.96 mm body 2017-06-11
SOT1546-1 LFBGA196 LFBGA196, plastic, low profile fine-pitch ball grid array; 196 balls; 0.65 mm pitch; 10 mm x 10 mm x 1.52 mm body 2017-06-11
SOT1546-2 LFBGA196 LFBGA196, plastic, low profile fine-pitch ball grid array; 196 balls; 0.65 mm pitch; 10 mm x 10 mm x 1.3 mm body 2017-06-01
SOT1547-1 LFBGA257 plastic, low profile fine-pitch ball grid array; 257 bumps; 0.8 mm pitch; 14 mm x 14 mm x 1.51 mm body 2016-01-28
SOT1548-1 LFBGA416 LFBGA416, plastic, low profile fine-pitch ball grid array; 416 balls; 0.5 mm pitch; 13 mm x 13 mm x 1.52 mm body 2017-06-11
SOT1549-1 HVQFN48R HVQFN48R, plastic, thermal enhanced very thin quad flatpack; no leads; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 0.98 mm body 2017-06-11
SOT1550-1 VFBGA520S VFBGA520S, plastic, very thin fine-pitch ball grid array; 520 balls; 0.4 mm pitch; 12 mm x 12 mm x 1 mm body 2017-06-11
SOT1551-1 LFBGA206 LFBGA206, plastic, low profile fine-pitch ball grid array; 206 balls; 0.8 mm pitch; 13 mm x 13 mm x 1.6 mm body 2017-06-11
SOT1552-1 VFLGA60 VFLGA60, plastic, very thin fine-pitch land grid array package; 60 balls; 0.5 mm pitch; 8 mm x 8 mm x 0.91 mm body 2017-06-11
SOT1553-1 LFBGA206 LFBGA206, plastic, low profile fine-pitch ball grid array; 206 balls; 0.5 mm pitch; 8 mm x 8 mm x 1.25 mm body 2017-06-11
SOT1554-1 LFBGA130 MAPBGA 130 8*8*1.25 P0.5 2017-06-11
SOT1555-1 LFBGA64 LFBGA64, plastic, low profile fine-pitch ball grid array; 64 bumps; 0.5 mm pitch; 5 mm x 5 mm x 1.23 mm body 2017-03-24
SOT1556-1 TFBGA432 TFBGA432, plastic, thin fine-pitch ball grid array; 432 balls; 0.5 mm pitch; 13 mm x 13 mm x 1.1 mm body 2017-06-11
SOT1557-1 XFBGA121 XFBGA121, plastic, extremely thin fine-pitch ball grid array; 121 bumps; 0.65 mm pitch; 8 mm x 8 mm x 0.5 mm body 2017-03-24
SOT1558-1 XFBGA36 MAPBGA 36 3.5*3.5*.5 P.5 2017-06-11
SOT1559-1 LFBGA400 LFBGA400, plastic, low profile fine-pitch ball grid array; 400 balls; 0.65 mm pitch; 14 mm x 14 mm x 1.165 mm body 2017-06-11
SOT1560-1 LFBGA121 LFBGA121, plastic, low profile fine-pitch ball grid array; 121 balls; 0.8 mm pitch; 10 mm x 10 mm x 1.02 mm body T-PBGA-B121(JEDEC) 2017-06-11
SOT1561-1 TFBGA185 TFBGA185, plastic, thin fine-pitch ball grid array; 185 balls; 0.5 mm pitch; 10 mm x 10 mm x 0.92 mm body 2017-06-11
SOT1562-1 TFBGA247 TFBGA247, plastic, thin fine-pitch ball grid array; 247 balls; 0.5 mm pitch; 10 mm x 10 mm x 0.92 mm body T-PBGA-B247(JEDEC) 2017-06-11
SOT1563-1 LBGA81 LBGA81, plastic, low profile ball grid array; 81 balls; 1 mm pitch; 10 mm x 10 mm x 1.52 mm body PBGA-B81(JEDEC) 2017-06-11
SOT1564-1 TFBGA139 MAPBGA 139 7*7*0.7P0.5 2017-06-11
SOT1565-1 TFBGA338 TFBGA338, plastic, thin fine-pitch ball grid array; 338 balls; 0.706 mm pitch; 11 mm x 11 mm x 0.92 mm body 2017-06-11
SOT1566-1 LFBGA225 LFBGA225, plastic, low profile fine-pitch ball grid array; 225 balls; 0.8 mm pitch; 13 mm x 13 mm x 1.6 mm body PBGA-B225(JEDEC) 2017-06-11
SOT1567-1 BGA196 BGA196, plastic, ball grid array; 196 balls; 1 mm pitch; 15 mm x 15 mm x 1.18 mm body PBGA-B196(JEDEC) 2017-06-11
SOT1569-1 LBGA100 LBGA100, plastic, low profile ball grid array; 100 balls; 1 mm pitch; 11 mm x 11 mm x 1.27 mm body PBGA-B100(JEDEC) 2017-06-11
SOT157-2 DBS9P plastic DIL-bent-SIL power package; 9 leads (lead length 12 mm) 2003-03-12
SOT157-4 DBS9P plastic DIL-bent-SIL power package; 9 leads (lead length 7.7 mm) 2003-03-12
SOT1570-1 HLQFP100 HLQFP100, plastic, thermal enhanced low profile quad flat package; 100 terminals; 0.50 mm pitch; 14 mm x 14 mm x 1.6 mm body 2016-01-08
SOT1570-2 HLQFP100 HLQFP100, plastic, thermal enhanced low profile quad flat package; 100 terminals; 0.50 mm pitch; 14 mm x 14 mm x 1.6 mm body 2017-03-27
SOT1570-3 HLQFP100 HLQFP100, plastic, thermal enhanced low profile quad flat package; 100 terminals; 0.50 mm pitch; 14 mm x 14 mm x 1.4 mm body 2018-03-02
SOT1571-1 LQFP plastic, low profile quad; flat leaded package; 48 terminals; 0.50 mm pitch; 7 mm x 7 mm x 1.4 mm body MS-026 BBC(JEDEC) 2016-05-30
SOT1571-2 HLQFP48 HLQFP48, plastic, thermal enhanced low profile quad flat package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1.4 mm body MS-026 BBC(JEDEC) 2017-06-11
SOT1571-3 HLQFP48 HLQFP48, plastic, thermal enhanced low profile quad flat package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1.4 mm body MS-026 BBC(JEDEC) 2017-06-11
SOT1571-4 HLQFP48 HLQFP48, plastic, thermal enhanced low profile quad flat package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1.4 mm body 2017-06-11
SOT1571-5 HLQFP48 plastic, thermal enhanced low profile quad flat package; 48 leads; body 7 x 7 x 1.5 mm 2016-07-14
SOT1571-6 HLQFP48 HLQFP48, plastic, thermal enhanced low profile quad flat package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1.4 mm body; 4.4 mm x 4.4 mm exposed pad 2018-07-19
SOT1571-7 HLQFP48 plastic, thermal enhanced low profile quad flat package; 48 leads; 0.5 mm pitch, 7 mm x 7 mm x 1.4 mm body MS-026 BBC(JEDEC) 2017-08-28
SOT1571-8 HLQFP48 HLQFP48, plastic, thermal enhanced low profile quad flat package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1.4 mm body MS-026 BBC(JEDEC) 2018-03-01
SOT1572-1 HLQFP80 HLQFP80, plastic, thermal enhanced, low profile quad; flat leaded package; 80 terminals; 0.5 mm pitch; 12 mm x 12 mm x 1.4 mm body 2017-03-27
SOT1573-1 HQFN16 HQFN16, plastic, thermal enhanced quad flatpack; no leads; 16 terminals; 0.8 mm pitch; 4 mm x 4 mm x 1.98 mm body 2018-01-17
SOT1574-1 HQFN16 plastic, thermally enhanced quad; flat non-leaded package; 16 terminals; 1.0 mm pitch; 6 mm x 6 mm x 1.98 mm body 2016-05-24
SOT1574-2 HQFN16 HQFN16, plastic, thermal enhanced quad flatpack; no leads; 16 terminals; 1 mm pitch; 6 mm x 6 mm x 1.98 mm body H-PQFP-N16(JEDEC) 2017-06-11
SOT1574-3 HQFN plastic, thermally enhanced quad; flat non-leaded package; 16 terminals; 1.0 mm pitch; 6 mm x 6 mm x 1.98 mm body 2016-06-06
SOT1575-1 HQFN24 plastic, thermally enhanced quad; flat non-leaded package; 24 terminals; 1.0 mm pitch; 7 mm x 7 mm x 2.2 mm body 2016-01-08
SOT1576-1 HQFN32 HQFN32, plastic, thermally enhanced quad; flat non-leaded package; 32 terminals; 0.65 mm pitch; 9 mm x 9 mm x 2.5 mm body 2017-03-22
SOT1577-1 HSOP30 HSOP30, plastic, thermal enhanced small outline package; 30 terminals; 0.8 mm pitch; 11 mm x 15.9 mm x 3 mm body PDSO-G30(JEDEC) 2017-06-11
SOT1578-1 HSOP36 HSOP36, plastic, thermal enhanced small outline package; 36 terminals; 0.65 mm pitch; 11 mm x 15.9 mm x 3.6 mm body HS-PDSO-G36(JEDEC) 2017-06-11
SOT1579-1 HVQFN32 HVQFN32, plastic, thermal enhanced very thin quad flatpack; no leads; 32 terminals; 0.5 mm pitch; 7 mm x 7 mm x 0.85 mm body H-PQFP-N32(JEDEC) 2017-06-11
SOT158-1 VSO40 plastic very small outline package; 40 leads 2003-02-19
SOT158-2 VSO40 plastic very small outline package; 40 leads; face down 2003-02-19
SOT1580-1 HTQFP176 HTQFP176, plastic, thermal enhanced thin quad flat package; 176 terminals; 0.5 mm pitch; 24 mm x 24 mm x 1 mm body N/A(JEDEC) 2017-06-11
SOT1581-1 HUQFN16 QFN 16 3*3*0.65 P0.5 2017-06-11
SOT1581-2 HUQFN16 QFN-EP 16 3*3*0.65 P0.5 2017-06-11
SOT1581-3 HUQFN16 HUQFN16, plastic, thermal enhanced ultra thin quad flatpack; no leads; 16 terminals; 0.5 mm pitch; 3 mm x 3 mm x 0.58 mm body 2017-06-11
SOT1582-1 HUQFN20 HUQFN20, plastic, thermal enhanced ultra thin quad flatpack; no leads; 20 terminals; 0.4 mm pitch; 3 mm x 3 mm x 0.65 mm body 2017-06-11
SOT1582-2 HUQFN20 HUQFN20, plastic, thermal enhanced ultra thin quad flatpack; no leads; 20 terminals; 0.4 mm pitch; 3 mm x 3 mm x 0.58 mm body 2017-06-11
SOT1583-1 HUQFN20 HUQFN20, plastic, thermal enhanced ultra thin quad flatpack; no leads; 20 terminals; 0.5 mm pitch; 4 mm x 3 mm x 0.65 mm body 2017-06-11
SOT1583-2 HUQFN20 HUQFN20, plastic, thermal enhanced ultra thin quad flatpack; no leads; 20 terminals; 0.5 mm pitch; 4 mm x 3 mm x 0.65 mm body 2018-07-16
SOT1585-1 HUQFN24 HUQFN24, plastic, thermally enhanced; ultra thin quad; flat non-leaded package; 24 terminals; 0.5 mm pitch; 4 mm x 4 mm x 0.65 mm body 2017-03-27
SOT1585-2 HUQFN24 HUQFN24, plastic, thermal enhanced ultra thin quad flat non-leaded package; 24 terminals; 0.5 mm pitch; 4 mm x 4 mm x 0.65 mm body 2018-07-12
SOT1586-1 HUQFN48 QFN MAP 48 7*7*0.65 P0.5 2017-06-11
SOT1587-1 HUSON12 HUSON12, plastic, thermal enhanced ultra thin small outline; no leads; 12 terminals; 0.4 mm pitch; 3 mm x 3 mm x 0.6 mm body HF-PDSO-N12(JEDEC) 2017-06-11
SOT1588-1 HUSON6 HUSON6, plastic, thermal enhanced ultra thin small outline; no leads; 6 terminals; 0.5 mm pitch; 2 mm x 1.5 mm x 0.6 mm body NON JEDEC(JEDEC) 2017-06-11
SOT1589-1 HUSON8 HUSON8, plastic, thermal enhanced ultra thin small outline; no leads; 8 terminals; 0.5 mm pitch; 2 mm x 2 mm x 0.6 mm body NON JEDEC(JEDEC) 2017-06-11
SOT1590-1 HUSON8 QFN-D 8 EP 2*3*0.65P0.5 2017-06-11
SOT1590-2 HUSON8 HUSON8, plastic, thermal enhanced ultra thin small outline; no leads; 8 terminals; 0.5 mm pitch; 3 mm x 2 mm x 0.65 mm body 2017-08-29
SOT1591-1 HVQFN16 QFN 16 EP 3SQ*1.0P0.5 2017-06-11
SOT1591-3 HVQFN16 HVQFN16, plastic, thermal enhanced very thin quad flatpack; no leads; 16 terminals; 0.5 mm pitch; 3 mm x 3 mm x 0.85 mm body 2018-08-01
SOT1592-1 HVQFN16 HVQFN16, plastic, thermal enhanced very thin quad flatpack; no leads; 16 terminals; 0.65 mm pitch; 4 mm x 4 mm x 0.9 mm body NON-JEDEC(JEDEC) 2017-06-11
SOT1593-1 HVQFN16 HVQFN16, plastic, thermal enhanced very thin quad flatpack; no leads; 16 terminals; 0.8 mm pitch; 5 mm x 5 mm x 0.9 mm body 2017-06-11
SOT1594-1 HVQFN24 HVQFN24, plastic, thermal enhanced very thin quad flatpack; no leads; 24 terminals; 0.65 mm pitch; 5 mm x 5 mm x 0.9 mm body 2017-06-11
SOT1595-1 HVQFN32 HVQFN32, plastic, thermal enhanced very thin quad flatpack; no leads; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 0.9 mm body 2017-06-11
SOT1595-2 HVQFN32 HVQFN32, plastic, thermal enhanced very thin quad flatpack; no leads; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 1 mm body 2017-06-11
SOT1596-1 HVQFN32 HVQFN32, plastic, thermal enhanced very thin quad flatpack; no leads; 32 terminals; 0.4 mm pitch; 4 mm x 4 mm x 0.9 mm body 2017-06-11
SOT1596-2 HVQFN32 plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 4 x 4 x 0.85 mm 2016-03-04
SOT1597-1 LFBGA169 MAPBGA 169 9*9*1.3 P0.65 2017-06-11
SOT1597-2 LFBGA169 LFBGA169, plastic, low profile fine-pitch ball grid array; 169 balls; 0.65 mm pitch; 9 mm x 9 mm x 1.11 mm body 2017-06-11
SOT1598-1 LFBGA272 LFBGA272, plastic, low profile fine-pitch ball grid array; 272 balls; 0.5 mm pitch; 9 mm x 9 mm x 1.11 mm body 2017-06-11
SOT1599-1 USON8 USON8, plastic, ultra thin small outline package; no leads; 8 terminals; 0.5 mm pitch; 2 mm x 2 mm x 0.65 mm body MO-252(JEDEC) 2017-06-11
SOT1600-1 HVSON8 HVSON8, plastic, thermal enhanced very thin small outline; no leads; 8 terminals; 0.65 mm pitch; 3 mm x 3 mm x 0.9 mm body 2017-06-11
SOT1601-1 CBGA1023 CBGA1023, ceramic, ball grid array; 1023 balls; 1 mm pitch; 33 mm x 33 mm x 2.77 mm body CBGA-B1023(JEDEC) 2017-06-11
SOT1601-2 CBGA1023 CBGA1023, ceramic, ball grid array; 1023 balls; 1 mm pitch; 33 mm x 33 mm x 2.97 mm body CBGA-B1023(JEDEC) 2017-06-11
SOT1602-1 CBGA255 CBGA255, ceramic, ball grid array; 255 balls; 1.27 mm pitch; 21 mm x 21 mm x 3 mm body CBGA-B255(JEDEC) 2017-06-11
SOT1603-1 CBGA360 CBGA360, ceramic, ball grid array; 360 balls; 1.27 mm pitch; 25 mm x 25 mm x 3.2 mm body CBGA-B360(JEDEC) 2017-06-11
SOT1603-2 CBGA360 CBGA360, ceramic, ball grid array; 360 balls; 1.27 mm pitch; 25 mm x 25 mm x 2.8 mm body CBGA-B360(JEDEC) 2017-06-11
SOT1603-3 CBGA360 CBGA360, ceramic, ball grid array; 360 balls; 1.27 mm pitch; 25 mm x 25 mm x 2.4 mm body CBGA-B360(JEDEC) 2017-06-11
SOT1603-4 CBGA360 CBGA360, ceramic, ball grid array; 360 balls; 1.27 mm pitch; 25 mm x 25 mm x 2.8 mm body CBGA-B360(JEDEC) 2017-06-11
SOT1603-5 CBGA360 CBGA360, ceramic, ball grid array; 360 balls; 1.27 mm pitch; 25 mm x 25 mm x 2.8 mm body CBGA-B360(JEDEC) 2017-06-11
SOT1603-6 CBGA360 CBGA360, ceramic, ball grid array; 360 balls; 1.27 mm pitch; 25 mm x 25 mm x 3.2 mm body CBGA-B360(JEDEC) 2017-06-11
SOT1604-1 CBGA483 CBGA483, ceramic, ball grid array; 483 balls; 1.27 mm pitch; 29 mm x 29 mm x 3.2 mm body E-CBGA-B483(JEDEC) 2017-06-11
SOT1605-1 CBGA783 CBGA783, ceramic, ball grid array; 783 balls; 1 mm pitch; 29 mm x 29 mm x 3.38 mm body PBGA-B783(JEDEC) 2017-06-11
SOT1608-1 CFBGA483 CFBGA483, ceramic, fine-pitch ball grid array; 483 balls; 1.27 mm pitch; 29 mm x 29 mm x 3.1 mm body E-CBGA-B483(JEDEC) 2017-06-11
SOT1609-1 CFBGA994 CFBGA994, ceramic, fine-pitch ball grid array; 994 balls; 1 mm pitch; 33 mm x 33 mm x 2.77 mm body CBGA-B994(JEDEC) 2017-06-11
SOT1609-2 CFBGA994 CFBGA994, ceramic, fine-pitch ball grid array; 994 balls; 1 mm pitch; 33 mm x 33 mm x 2.97 mm body CBGA-B994(JEDEC) 2017-06-11
SOT1610-1 CLGA360 CLGA360, ceramic, land grid array; 360 balls; 1.27 mm pitch; 25 mm x 25 mm x 2.2 mm body CBGA-N360(JEDEC) 2017-06-11
SOT1610-2 CLGA360 CLGA360, ceramic, land grid array; 360 balls; 1.27 mm pitch; 25 mm x 25 mm x 2.2 mm body CBGA-N360(JEDEC) 2017-06-11
SOT1610-3 CLGA360 CLGA360, ceramic, land grid array; 360 balls; 1.27 mm pitch; 25 mm x 25 mm x 1.8 mm body CBGA-N360(JEDEC) 2017-06-11
SOT1611-1 CLGA483 CLGA483, ceramic, land grid array; 483 lands; 1.27 mm pitch; 29 mm x 29 mm x 2.2 mm body 2017-06-11
SOT1612-1 CQFP144 CQFP144, ceramic, quad flat package; 144 terminals; 0.65 mm pitch; 26.75 mm x 26.75 mm x 3.5 mm body CQFP-G144(JEDEC) 2017-06-11
SOT1613-1 CQFP184 CQFP184, ceramic, quad flat package; 184 terminals; 0.65 mm pitch; 31 mm x 31 mm x 3.5 mm body CQFP-G184(JEDEC) 2017-06-11
SOT1615-1 VSON10 VSON10, plastic, very thin small outline, no leads; 10 terminals; 0.4 mm pitch; 2 mm x 2 mm x 0.85 mm body 2017-06-11
SOT1615-2 VSON10 VSON10, plastic, very thin small outline, no leads; 10 terminals; 0.4 mm pitch; 2 mm x 2 mm x 0.95 mm body 2017-06-11
SOT1615-3 VSON10 VSON10, plastic, very thin small outline package, no leads; 10 terminals; 0.4 mm pitch; 2 mm x 2 mm x 0.95 mm body 2017-06-11
SOT1616-1 VSON10 VSON10, plastic, very thin small outline package, no leads; 10 terminals; 0.5 mm pitch; 3 mm x 3 mm x 0.5 mm body NJR(JEDEC) 2017-06-11
SOT1617-1 BGA1020 FCPBGA 1020 33*33*2 P1 2017-06-11
SOT1618-1 BGA1023 BGA1023, plastic, ball grid array; 1023 balls; 1 mm pitch; 33 mm x 33 mm x 2.75 mm body PBGA-B1023(JEDEC) 2017-06-11
SOT1619-1 BGA1023 BGA1023, plastic, ball grid array; 1023 balls; 1 mm pitch; 33 mm x 33 mm x 3.38 mm body NONE(JEDEC) 2017-06-11
SOT162-1 SO16 plastic, small outline package; 16 leads; 1.27 mm pitch; 10.2 mm x 7.5 mm x 2.65 mm body MS-013(JEDEC);075E03(IEC) 2003-02-19
SOT162-3 SO16 SO16, plastic, small outline package; 16 terminals; 1.27 mm pitch; 7.5 mm x 10.3 mm x 2.4 mm body E-PDSO-G16(JEDEC) 2017-06-11
SOT1620-1 BGA1023 BGA1023, plastic, ball grid array; 1023 balls; 1 mm pitch; 33 mm x 33 mm x 3.13 mm body 2017-06-11
SOT1621-1 BGA575 BGA575, plastic, ball grid array; 575 balls; 1 mm pitch; 25 mm x 25 mm x 2.75 mm body PBGA-B575(JEDEC) 2017-06-11
SOT1622-1 BGA783 BGA783, plastic, ball grid array; 783 balls; 1 mm pitch; 29 mm x 29 mm x 3.75 mm body 2015-12-17
SOT1622-2 BGA783 BGA783, plastic, ball grid array; 783 balls; 1 mm pitch; 29 mm x 29 mm x 2.7 mm body PBGA-B783(JEDEC) 2017-06-11
SOT1622-3 BGA783 BGA783, plastic, ball grid array; 783 balls; 1 mm pitch; 29 mm x 29 mm x 2.76 mm body MS-034B AAM-1(JEDEC) 2015-12-22
SOT1622-4 BGA783 BGA783, plastic, ball grid array; 783 balls; 1 mm pitch; 29 mm x 29 mm x 2.8 mm body PBGA-B783(JEDEC) 2017-06-11
SOT1623-5 BGA783 BGA783, plastic, ball grid array; 783 balls; 1 mm pitch; 29 mm x 29 mm x 3.85 mm body PBGA-B783(JEDEC) 2017-06-11
SOT1624-1 BGA783 BGA783, plastic, ball grid array; 783 balls; 1 mm pitch; 29 mm x 29 mm x 3.58 mm body MS-034(JEDEC) 2015-12-22
SOT1625-2 BGA783 plastic, ball grid array; 783 bumps; 1.0 mm pitch; 29 mm x 29 mm x 3.13 mm body 2016-08-02
SOT1626-1 FBGA431 FBGA431, plastic, fine-pitch ball grid array; 431 balls; 0.8 mm pitch; 20 mm x 20 mm x 3.3 mm body PBGA-B431(JEDEC) 2017-06-11
SOT1627-1 HBGA620 HBGA620, plastic, thermal enhanced ball grid array; 620 balls; 1 mm pitch; 29 mm x 29 mm x 2.46 mm body MS-034 AAM-1(JEDEC) 2016-02-01
SOT1628-1 HUQFN20 HUQFN20, plastic, thermal enhanced ultra thin quad flatpack; no leads; 20 terminals; 0.4 mm pitch; 3 mm x 3 mm x 0.6 mm body 2017-06-11
SOT1629-1 BGA plastic, ball grid array; 1295 bumps; 1.0 mm pitch; 37.5 mm x 37.5 mm x 3.19 mm body 2016-06-15
SOT163-1 SO20 plastic small outline package; 20 leads; body width 7.5 mm MS-013(JEDEC);075E04(IEC) 2003-02-19
SOT163-4 SO20 SO20, plastic, small outline package; 20 terminals; 1.27 mm pitch; 7.5 mm x 12.82 mm x 3.55 mm body R-PDSO-G20(JEDEC) 2017-06-11
SOT163-5 SO plastic, small outline; leaded package; 20 terminals; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body 2016-08-25
SOT1630-1 HQFN16 HQFN16, plastic, thermal enhanced quad flat package, no leads; 16 terminals; 0.9 mm pitch; 12 mm x 12 mm x 2.1 mm body I-PQFP-N16(JEDEC) 2017-06-11
SOT1630-2 HQFN16 HQFN16, plastic, thermal enhanced quad flat package, no leads; 16 terminals; 0.9 mm pitch; 12 mm x 12 mm x 2.1 mm body 2018-05-22
SOT1631-1 HQFN36 HQFN36, plastic, thermal enhanced quad flatpack; no leads; 36 terminals; 0.8 mm pitch; 12 mm x 12 mm x 2.1 mm body I-PQFP-N36(JEDEC) 2017-06-11
SOT1631-2 HQFN24 HQFN24, plastic, thermal enhanced quad flatpack; no leads; 24 terminals; 0.8 mm pitch; 12 mm x 12 mm x 2.1 mm body I-PQFP-N24(JEDEC) 2017-06-11
SOT1631-3 HQFN24 HQFN24, plastic, thermal enhanced quad flatpack; no leads; 24 terminals; 0.8 mm pitch; 12 mm x 12 mm x 2.1 mm body NON-JEDEC(JEDEC) 2017-06-11
SOT1631-4 HQFN23 HQFN23; plastic, thermally enhanced quad; flat non-leaded package; 23 terminals; 0.9 mm pitch; 12 mm x 12 mm x 2.1 mm body 2016-01-21
SOT1631-5 HQFN23 HQFN23, plastic, thermal enhanced quad flatpack; no leads; 23 terminals; 0.8 mm pitch; 12 mm x 12 mm x 2.1 mm body NA(JEDEC) 2017-06-11
SOT1631-6 HQFN16 HQFN16, plastic, thermal enhanced quad flatpack; no leads; 16 terminals; 0.8 mm pitch; 12 mm x 12 mm x 2.1 mm body I-PQFP-N16(JEDEC) 2017-06-11
SOT1631-7 HQFN24 HQFN24, plastic, thermal enhanced quad flatpack; no leads; terminals; 0.8 mm pitch; 12 mm x 12 mm x 2.1 mm body I-PQFP-N24(JEDEC) 2016-03-14
SOT1631-8 HQFN24 HQFN24, plastic, thermal enhanced quad flatpack; no leads; terminals; 0.8 mm pitch; 12 mm x 12 mm x 2.1 mm body 2016-03-14
SOT1632-1 HQFN16 HQFN16, plastic, thermal enhanced quad flatpack; no leads; 16 terminals; 0.8 mm pitch; 5 mm x 5 mm x 2.1 mm body PQFP-N16(JEDEC) 2017-06-11
SOT1633-1 HQFN PWR QFN 32 8SQ*2.1P0.8 2017-06-11
SOT1634-1 BGA456 BGA456, plastic, ball grid array; 456 balls; 1.27 mm pitch; 35 mm x 35 mm x 2.59 mm body PBGA-B456(JEDEC) 2017-06-11
SOT1635-1 PGA241 PGA241, plastic, pin grid array; 241 pins; 2.54 mm pitch; 47.2 mm x 47.2 mm x 3.18 mm body PPGA-P241(JEDEC) 2017-06-11
SOT1636-1 BGA360 BGA360, plastic, ball grid array; 360 balls; 1.27 mm pitch; 25 mm x 25 mm x 2.77 mm body E-PBGA-B360(JEDEC) 2017-06-11
SOT1637-1 BGA255 BGA255, plastic, ball grid array; 255 balls; 1.27 mm pitch; 21 mm x 21 mm x 2.8 mm body E-PBGA-B255(JEDEC) 2017-06-11
SOT1638-1 HVQFN44R MAPLGA 44 5*5*0.9 P0.65 2017-06-11
SOT1639-1 FBGA780 FBGA780, plastic, fine-pitch ball grid array; 780 bumps; 0.8 mm pitch; 23 mm x 23 mm x 2.36 mm body 2017-03-24
SOT1640-1 VFBGA416S VFBGA416S, plastic, very thin fine-pitch ball grid array; 416 balls; 0.5 mm pitch; 13 mm x 13 mm x 0.9 mm body 2017-06-11
SOT1641-1 FBGA520 FBGA520, plastic, fine-pitch ball grid array; 520 bumps; 0.8 mm pitch; 21 mm x 21 mm x 1.83 mm body 2017-03-27
SOT1642-1 LFBGA624 LFBGA624, plastic, low profile fine-pitch ball grid array; 624 bumps; 0.8 mm pitch; 21 mm x 21 mm x 1.45 mm body 2017-03-27
SOT1642-2 LFBGA624 LFBGA624, plastic, low profile fine-pitch ball grid array; 624 balls; 0.8 mm pitch; 21 mm x 21 mm x 1.45 mm body 2017-06-11
SOT1643-1 FBGA624 FBGA624; plastic, fine-pitch ball grid array; 624 bumps; 0.8 mm pitch; 21 mm x 21 mm x 2 mm body 2016-01-20
SOT1644-1 LFBGA569S LFBGA569S, plastic, low profile fine-pitch ball grid array; 569 balls; 0.4 mm pitch; 12 mm x 12 mm x 1.15 mm body 2017-06-11
SOT1645-1 BGA1932 BGA1932, plastic, ball grid array; 1932 balls; 1 mm pitch; 45 mm x 45 mm x 3.18 mm body 2017-06-11
SOT1646-1 VQFN40R VQFN40R, plastic, very thin quad flatpack; no leads; 40 terminals; 0.5 mm pitch; 6 mm x 6 mm x 0.98 mm body NON-JEDEC(JEDEC) 2017-06-11
SOT1647-1 HVQFN63R HVQFN63R, plastic, thermal enhanced very thin quad flatpack; no leads; 63 terminals; 0.5 mm pitch; 8 mm x 8 mm x 0.91 mm body 2017-06-11
SOT1648-1 VQFN41R VQFN41R, plastic, very thin quad flatpack; no leads; 41 terminals; 0.5 mm pitch; 5 mm x 5 mm x 0.91 mm body 2017-06-11
SOT1648-2 VQFN41R VQFN41R, plastic, very thin quad flatpack; no leads; 41 terminals; 0.5 mm pitch; 5 mm x 5 mm x 0.91 mm body 2017-06-11
SOT1649-1 VQFN63R LamQFN 48 7*7*0.98 P0.5 2017-06-11
SOT1650-1 BGA1152 BGA1152, plastic, ball grid array; 1152 balls; 1 mm pitch; 35 mm x 35 mm x 2.67 mm body 2017-06-11
SOT1651-1 BGA780 BGA780, plastic, ball grid array; 780 balls; 1 mm pitch; 29 mm x 29 mm x 2.68 mm body 2017-06-11
SOT1652-1 FBGA780 FBGA780, plastic, fine-pitch ball grid array; 780 bumps; 0.8 mm pitch; 23 mm x 23 mm x 1.92 mm body 2017-03-17
SOT1652-2 FBGA780 FBGA780, plastic, fine-pitch ball grid array; 780 bumps; 0.8 mm pitch; 23 mm x 23 mm x 1.92 mm body 2017-03-21
SOT1652-3 FBGA780 FBGA780, plastic, fine-pitch ball grid array; 780 bumps; 0.8 mm pitch; 23 mm x 23 mm x 1.92 mm body 2017-03-24
SOT1652-4 FBGA780 FBGA780, plastic, fine-pitch ball grid array; 780 bumps; 0.8 mm pitch; 23 mm x 23 mm x 1.92 mm body 2017-03-21
SOT1653-1 FBGA780 FBGA780, plastic, fine-pitch ball grid array; 780 bumps; 0.8 mm pitch; 23 mm x 23 mm x 2.46 mm body 2017-03-24
SOT1654-1 BGA416 BGA416, plastic, ball grid array; 416 balls; 1 mm pitch; 27 mm x 27 mm x 2.23 mm body MS-034 AAL-1(JEDEC) 2017-06-11
SOT1655-1 FBGA525 FBGA525, plastic, fine-pitch ball grid array; 525 bumps; 0.8 mm pitch; 19 mm x 19 mm x 1.62 mm body 2017-03-27
SOT1655-2 FBGA525 FBGA525, plastic, fine-pitch ball grid array; 525 bumps; 0.8 mm pitch; 19 mm x 19 mm x 1.92 mm body 2017-03-27
SOT1656-1 BGA1292 FCPBGA 1292 37.5^2*3.17 2017-06-11
SOT1657-1 FBGA896 FBGA896, plastic, fine-pitch ball grid array; 896 balls; 0.8 mm pitch; 25 mm x 25 mm x 2.46 mm body 2017-06-11
SOT1658-1 FBGA625 FCPBGA 625 21*21*2.4 P.8 2017-06-11
SOT1659-1 HBGA448 HBGA448, plastic, thermal enhanced ball grid array; 448 balls; 1 mm pitch; 23 mm x 23 mm x 1.93 mm body 2017-06-11
SOT1660-1 HLQFP156 HLQFP156, plastic, thermal enhanced low profile quad flat package; 156 terminals; 0.4 mm pitch; 14 mm x 20 mm x 1.4 mm body NON-JEDEC(JEDEC) 2017-06-11
SOT1660-2 HLQFP156 HLQFP156, plastic, thermal enhanced low profile quad flat package; 156 terminals; 0.4 mm pitch; 14 mm x 20 mm x 1.4 mm body 2018-10-26
SOT1661-1 FBGA621 FCBGA621, plastic, fine-pitch ball grid array; 621 bumps; 0.8 mm pitch; 21 mm x 21 mm x 1.92 mm body 2016-01-20
SOT1662-1 BGA495 BGA495, plastic, ball grid array; 495 balls; 1 mm pitch; 25 mm x 25 mm x 2.5 mm body 2017-06-11
SOT1663-1 HQFN PWR QFN 36 9*9*2.1P0.8 2017-06-11
SOT1664-1 HQFN24 PWR QFN 24 8*8*2.1P0.8 2017-06-11
SOT1665-1 HBGA516 HBGA516, plastic, thermal enhanced ball grid array; 516 balls; 1 mm pitch; 27 mm x 27 mm x 2.55 mm body PBGA-B516(JEDEC) 2017-06-11
SOT1666-1 BGA357 BGA357, plastic, ball grid array; 357 balls; 1.27 mm pitch; 25 mm x 25 mm x 2.52 mm body PBGA-B357(JEDEC) 2017-06-11
SOT1667-1 BGA256 BGA256, plastic, ball grid array; 256 balls; 1.27 mm pitch; 23 mm x 23 mm x 2.54 mm body PBGA-B256(JEDEC) 2017-06-11
SOT1668-1 SO16 SO16, plastic, small outline package; 16 terminals; 0.8 mm pitch; 7.03 mm x 7.03 mm x 2.3 mm body PDSO-G16(JEDEC) 2017-06-11
SOT1669-1 PGA179 PGA179, plastic, pin grid array; 179 pins; 2.54 mm pitch; 47.2 mm x 47.2 mm x 3.18 mm body PPGA-P179(JEDEC) 2017-06-11
SOT1670-1 PGA182 PGA182, plastic, pin grid array; 182 pins; 2.54 mm pitch; 46.7 mm x 46.7 mm x 3.18 mm body PPGA-P182(JEDEC) 2017-06-11
SOT1671-1 LQFP52 LQFP52, plastic, low profile quad flat package; 52 terminals; 0.65 mm pitch; 10 mm x 10 mm x 1.4 mm body L-PQFP-G52(JEDEC) 2017-06-11
SOT1671-2 LQFP52 LQFP52, plastic, low profile quad flat package; 52 terminals; 0.65 mm pitch; 10 mm x 10 mm x 1.4 mm body 2017-06-11
SOT1672-1 LQFP112 LQFP112, plastic, low profile quad flat package; 112 terminals; 0.65 mm pitch; 20 mm x 20 mm x 1.4 mm body L-PQFP-G112(JEDEC) 2017-06-11
SOT1673-1 SNSR SNSR M-PAK 05 Package PORTED R-PDSO-G5(JEDEC) 2017-06-11
SOT1674-1 SNSR SNSR M-PAK 05 Package R-PDSO-G5(JEDEC) 2017-06-11
SOT1675-1 UQFN20 UQFN20, plastic, ultra thin quad flatpack; no leads; 20 terminals; 0.4 mm pitch; 3 mm x 3 mm x 0.6 mm body 2017-06-11
SOT1676-1 VQFN16 VQFN16, plastic, very thin quad flatpack; no leads; 16 terminals; 0.5 mm pitch; 3 mm x 3 mm x 1 mm body 2016-01-05
SOT1677-1 HVQFN12 QFN 12EP 3SQ*.85PO0.50 2017-06-11
SOT1678-1 SO8 SO8, plastic, small outline package; 8 terminals; 2.54 mm pitch; 9.6 mm x 9.6 mm x 0.81 mm body 2017-06-11
SOT1679-1 VQFN12 VQFN12, plastic, very thin quad flatpack; no leads; 12 terminals; 0.65 mm pitch; 3 mm x 3 mm x 1 mm body 2017-06-11
SOT1679-2 VQFN12 VQFN12, plastic, very thin quad flatpack; no leads; 12 terminals; 0.65 mm pitch; 3 mm x 3 mm x 1 mm body 2017-06-11
SOT1680-1 TQFN16 TQFN16, plastic, thin quad flatpack; no leads; 16 terminals; 0.5 mm pitch; 3 mm x 3 mm x 1.2 mm body 2017-06-11
SOT1681-1 VQFN24 VQFN24, plastic, very thin quad flatpack; no leads; 24 terminals; 0.5 mm pitch; 4 mm x 4 mm x 1 mm body 2017-06-11
SOT1682-1 HQFN42 HQFN42, plastic, thermal enhanced quad flat package, no leads; 42 terminals; 0.65 mm pitch; 9 mm x 13.6 mm x 2.65 mm body 2017-06-11
SOT1683-1 VFBGA85 VFBGA85, plastic, very thin fine-pitch ball grid array; 85 balls; 0.5 mm pitch; 6 mm x 6 mm x 0.95 mm body 2017-06-11
SOT1684-1 VFBGA89 VFBGA89, plastic, very thin fine-pitch ball grid array; 89 balls; 0.5 mm pitch; 6 mm x 6 mm x 0.95 mm body NON-JEDEC(JEDEC) 2017-06-11
SOT1685-1 VFBGA89 VFBGA89, plastic, very thin fine-pitch ball grid array; 89 balls; 0.5 mm pitch; 6 mm x 6 mm x 0.95 mm body NON-JEDEC(JEDEC) 2017-06-11
SOT1687-1 VFBGA256 VFBGA256, plastic, very thin fine-pitch ball grid array; 256 balls; 0.5 mm pitch; 9 mm x 9 mm x 0.795 mm body 2017-06-11
SOT1688-1 HLQFN16 HLQFN16; plastic, thermal enhanced low profile quad flat non-leaded package; 16 terminals; 0.8 mm pitch; 4 mm x 4 mm x 1.45 mm body 2016-01-14
SOT1688-1(DD) HLQFN16 HLQFN16; plastic, thermal enhanced low profile quad flat non-leaded package, dimple wettable flank; 16 terminals; 0.8 mm pitch; 4 mm x 4 mm x 1.45 mm body 2018-06-12
SOT1688-1(SC) HLQFN16 HLQFN16; plastic, thermal enhanced low profile quad flat non-leaded package; 16 terminals; 0.8 mm pitch; 4 mm x 4 mm x 1.5 mm body 2018-06-15
SOT1690-2 TFBGA500S TFBGA500S, thin fine-pitch ball grid array package; 500 terminals, 0.65 mm pitch, 14 mm x 17 mm x 0.925 mm body 2017-02-28
SOT1691-1 SO8 SO8, plastic, small outline package; 8 terminals; 2.54 mm pitch; 1.07 mm x 1.07 mm x 1.99 mm body PDIP-P8(JEDEC) 2017-06-11
SOT1691-2 SO8 SO8, plastic, small outline package; 8 terminals; 2.54 mm pitch; 1.07 mm x 1.07 mm x 1.99 mm body PDIP-P8(JEDEC) 2017-06-11
SOT1692-1 SO20 SO20, plastic, small outline package; 20 terminals; 1.27 mm pitch; 7.5 mm x 13.85 mm x 4.25 mm body E-PDSO-G20(JEDEC) 2017-06-11
SOT1692-2 SO20 SO20, plastic, small outline package; 20 terminals; 1.27 mm pitch; 7.5 mm x 12.85 mm x 4.25 mm body 2017-06-11
SOT1693-1 SO8 SO8, plastic, small outline package; 8 terminals; 2.54 mm pitch; 12.06 mm x 12.06 mm x 7.62 mm body E-PDSO-G8(JEDEC) 2017-06-11
SOT1693-2 SO8 SO8, plastic, small outline package; 8 terminals; 2.54 mm pitch; 12.06 mm x 12.06 mm x 9.62 mm body E-PDSO-G8(JEDEC) 2017-06-11
SOT1693-3 SO8 SO8, plastic, small outline package; 8 terminals; 2.54 mm pitch; 12.06 mm x 12.06 mm x 8.38 mm body E-PDSO-G8(JEDEC) 2017-06-11
SOT1694-1 SO8 SO8, plastic, small outline package; 8 terminals; 2.54 mm pitch; 10.66 mm x 10.66 mm x 5.84 mm body E-PDSO-G8(JEDEC) 2017-06-11
SOT1695-1 QFP132 QFP132, plastic, quad flat package; 132 terminals; 0.635 mm pitch; 24.1 mm x 24.1 mm x 3.56 mm body PQFP-G132(JEDEC) 2017-06-11
SOT1696-1 QFP208 QFP208, plastic, quad flat package; 208 terminals; 0.5 mm pitch; 28 mm x 28 mm x 4.1 mm body F-PQFP-G208(JEDEC) 2017-06-11
SOT1697-1 QFP64 QFP64, plastic, quad flat package; 64 terminals; 0.8 mm pitch; 14 mm x 14 mm x 2.2 mm body PQFP-G64(JEDEC) 2017-06-11
SOT1697-2 QFP64 QFP64, plastic, quad flat package; 64 terminals; 0.8 mm pitch; 14 mm x 14 mm x 2.2 mm body PQFP-G64(JEDEC) 2017-06-11
SOT1698-1 QFP256S QFP256S, plastic, quad flat package; 256 terminals; 0.65 mm pitch; 45.3 mm x 45.3 mm x 4.9 mm body PQFP-G160(JEDEC) 2017-06-11
SOT1699-1 QFP64 QFP64, plastic, quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body MS-026 BCD(JEDEC) 2016-01-25
SOT1701-1 QFP240 QFP240, plastic, quad flat package; 240 terminals; 0.5 mm pitch; 32 mm x 32 mm x 3.4 mm body F-PQFP-G240(JEDEC) 2017-06-11
SOT1703-1 QFP256S QFP256S, plastic, quad flat package; 256 terminals; 0.65 mm pitch; 45.7 mm x 45.7 mm x 4.9 mm body PQFP-G132(JEDEC) 2017-06-11
SOT1704-1 PGA132 PGA132, plastic, pin grid array; 132 pins; 2.54 mm pitch; 34.8 mm x 34.8 mm x 3.18 mm body PPGA-P132(JEDEC) 2017-06-11
SOT1705-1 BGA416 BGA416, plastic, ball grid array; 416 balls; 1 mm pitch; 27 mm x 27 mm x 1.95 mm body PBGA-B416(JEDEC) 2016-01-29
SOT1706-1 LBGA672 LBGA672, plastic, low profile ball grid array; 672 balls; 1 mm pitch; 35 mm x 35 mm x 0.95 mm body 2016-02-24
SOT1707-1 LBGA740 LBGA740, plastic, low profile ball grid array; 740 balls; 1 mm pitch; 37.5 mm x 37.5 mm x 1.05 mm body 2016-02-01
SOT1708-1 BGA360 BGA360, plastic, ball grid array; 360 balls; 1 mm pitch; 23 mm x 23 mm x 1.9 mm body 2017-06-11
SOT1709-1 SO8 SO8, plastic, small outline package; 8 terminals; 1.27 mm pitch; 7.36 mm x 7.36 mm x 4.19 mm body 2016-02-01
SOT1710-1 SO8 SO8, plastic, small outline package; 8 terminals; 1.27 mm pitch; 8.26 mm x 8.26 mm x 4.8 mm body R-PDSO-G8(JEDEC) 2017-06-11
SOT1711-1 BGA255 BGA255, plastic, ball grid array; 255 balls; 1.27 mm pitch; 23 mm x 23 mm x 1.9 mm body PBGA-B255(JEDEC) 2017-06-11
SOT1712-1 BGA388 BGA388, plastic, ball grid array; 388 balls; 1 mm pitch; 27 mm x 27 mm x 1.95 mm body PBGA-B388(JEDEC) 2017-06-11
SOT1713-1 BGA672 BGA672, plastic, ball grid array; 672 balls; 0.5 mm pitch; 27 mm x 27 mm x 1.73 mm body 2017-06-11
SOT1714-1 FBGA425 plastic, fine-pitch ball grid array; 425 bumps; 0.8 mm pitch; 19 mm x 19 mm x 1.9 mm body 2016-08-24
SOT1715-1 FBGA457 FBGA457, plastic, fine-pitch ball grid array; 457 balls; 0.8 mm pitch; 19 mm x 19 mm x 1.55 mm body 2017-06-11
SOT1716-1 FBGA512 FBGA512, plastic, fine-pitch ball grid array; 512 balls; 0.8 mm pitch; 25 mm x 25 mm x 1.9 mm body 2017-06-11
SOT1717-1 FBGA529 FBGA529, plastic, fine-pitch ball grid array; 529 bumps; 0.8 mm pitch; 19 mm x 19 mm x 1.64 mm body 2017-03-24
SOT1718-1 FBGA561 TEPBGA 561 23*23*2.3 P.8 2017-06-11
SOT1720-1 FM14F FM14F, plastic, flange mount flat package; 14 terminals; 9.02 mm x 17.53 mm x 2.59 mm body 2017-06-11
SOT1720-2 FM14F FM14F, plastic, flange mount flat package; 14 terminals; 9.02 mm x 17.53 mm x 2.59 mm body PDSO-F14(JEDEC) 2017-06-11
SOT1720-3 FM14F FM14F, plastic, flange mount flat package; 14 terminals; 9.02 mm x 17.53 mm x 2.59 mm body PDSO-G14(JEDEC) 2017-06-11
SOT1721-1 FM14F FM14F, plastic, flange mount flat package; 14 terminals; 9.02 mm x 23.62 mm x 2.59 mm body PDSO-F14(JEDEC) 2017-06-11
SOT1722-1 FM15F FM15F, plastic, flange mount flat package; 15 terminals; 9.02 mm x 17.53 mm x 2.59 mm body 2017-06-11
SOT1722-2 FM15F FM15F, plastic, flange mount flat package; 15 terminals; 9.02 mm x 17.53 mm x 2.59 mm body 2017-06-11
SOT1722-3 FM15F FM15F, plastic, flange mount flat package; 15 terminals; 9.02 mm x 17.53 mm x 2.59 mm body 2017-06-11
SOT1723-1 FM16 FM16, plastic, flange mount package; 16 terminals; 9.02 mm x 17.53 mm x 2.59 mm body 2017-06-11
SOT1723-2 FM16 FM16, plastic, flange mount package; 16 terminals; 9.02 mm x 17.53 mm x 2.59 mm body 2017-06-11
SOT1724-1 FM16 FM16, plastic, flange mount package; 16 terminals; 9.02 mm x 23.62 mm x 2.59 mm body PDIL-G16(JEDEC) 2017-06-11
SOT1724-2 FM16 FM16, plastic, flange mount package; 16 terminals; 9.02 mm x 23.62 mm x 2.59 mm body PDIL-G16(JEDEC) 2017-06-11
SOT1725-1 FM16 FM16, plastic, flange mount package; 16 terminals; 9.02 mm x 23.62 mm x 3.18 mm body 2017-06-11
SOT1726-1 FM16F FM16F, plastic, flange mount flat package; 16 terminals; 9.02 mm x 17.53 mm x 2.59 mm body 2017-06-11
SOT1727-1 FM16F FM16F, plastic, flange mount flat package; 16 terminals; 9.02 mm x 23.62 mm x 2.59 mm body PDIL-F16(JEDEC) 2017-06-11
SOT1728-1 FM16F TO-270 WBL 16 PLASTIC 2017-06-11
SOT1729-1 FM16F FM16F, plastic, flange mount flat package; 16 terminals; 11 mm x 23.62 mm x 3.17 mm body 2017-06-11
SOT172A1 CRPM4 studded ceramic package; 4 leads 1999-03-29
SOT172A2 CRPM4 studded ceramic package; 4 leads 1999-03-29
SOT1730-1 FM17F TO-270 WB-17 2017-06-11
SOT1730-2 FM17F plastic, flange mounted package; 17 leads flat; 1.02 mm pitch; 17.53 x 9.02 x 2.59 mm body 2016-07-05
SOT1730-3 FM17F FM17F, plastic, flange mount flat package; 17 terminals; 9.02 mm x 17.53 mm x 2.59 mm body 2017-06-11
SOT1731-1 FM2 FM2, plastic, flange mount package; 2 terminals; 6.1 mm x 9.65 mm x 2.03 mm body PDIP-G2(JEDEC) 2017-06-11
SOT1732-1 FM2F FM2F, plastic, flange mount flat package; 2 terminals; 6.1 mm x 9.65 mm x 2.03 mm body PDIP-F2(JEDEC) 2017-06-11
SOT1733-1 FM2F FM2F, plastic, flange mount flat package; 2 terminals; 6.35 mm x 23.62 mm x 2.59 mm body PDIL-F2(JEDEC) 2017-06-11
SOT1734-1 FM4 FM4, plastic, flange mount package; 4 terminals; 9.02 mm x 17.53 mm x 2.59 mm body 2017-06-11
SOT1735-1 FM4F FM4F, plastic, flange mount flat package; 4 terminals; 9.02 mm x 23.62 mm x 2.59 mm body PDIL-F4(JEDEC) 2017-06-11
SOT1736-1 FM4F FM4F, plastic, flange mount flat package; 4 terminals; 9.02 mm x 17.53 mm x 2.59 mm body PDIP-F4(JEDEC) 2017-06-11
SOT1736-2 FM4F FM4F, plastic, flange mount flat package; 4 terminals; 9.02 mm x 17.53 mm x 2.59 mm body PDSO-F4(JEDEC) 2017-06-11
SOT1737-1 FM4F FM4F, plastic, flange mount flat package; 4 terminals; 9.02 mm x 23.62 mm x 3.18 mm body PDIP-F4(JEDEC) 2017-06-11
SOT1738-1 FM6 FM6, plastic, flange mount package; 6 terminals; 6.35 mm x 23.62 mm x 2.62 mm body PDIL-C6(JEDEC) 2017-06-11
SOT1739-1 FM6F FM6F, plastic, flange mount flat package; 6 terminals; 6.35 mm x 23.62 mm x 2.59 mm body PDIL-F6(JEDEC) 2017-06-11
SOT1740-1 FM6F FM6F, plastic, flange mount flat package; 6 terminals; 9.02 mm x 17.53 mm x 2.59 mm body PDIP-F4(JEDEC) 2017-06-11
SOT1741-1 FM8 FM8, plastic, flange mount package; 8 terminals; 6.35 mm x 23.62 mm x 2.62 mm body PDIL-C8(JEDEC) 2017-06-11
SOT1742-1 FM8F FM8F, plastic, flange mount flat package; 8 terminals; 6.35 mm x 23.62 mm x 2.59 mm body 2017-06-11
SOT1744-1 HBGA668 HBGA668, plastic, thermal enhanced ball grid array; 668 balls; 1 mm pitch; 29 mm x 29 mm x 1.8 mm body HT-PBGA-B668(JEDEC) 2017-06-11
SOT1745-1 HBGA689 HBGA689, plastic, thermal enhanced ball grid array; 689 bumps; 1.0 mm pitch; 31 mm x 31 mm x 2.23 mm body 2016-01-21
SOT1746-1 HSOP32 HSOP32, plastic, heatsink, small outline; leaded package; 32 terminals; 0.65 mm pitch; 11 mm x 7.5 mm x 2.2 mm body 2017-03-24
SOT1746-2 HSOP32 plastic, heatsink small outline package; 32 terminals; 0.65 mm pitch; 11 mm x 7.5 mm x 2.3 mm body 2016-08-19
SOT1746-3 HSOP32 HSOP32, plastic, thermal enhanced small outline package; 32 terminals; 0.65 mm pitch; 7.5 mm x 11 mm x 2.33 mm body E-PDSO-G32(JEDEC) 2017-06-11
SOT1746-4 HSOP32 HSOP32, plastic, thermal enhanced small outline package; 32 terminals; 0.65 mm pitch; 4.6 mm x 7 mm exposed pad 2018-03-08
SOT1747-1 HSOP54 HSOP54, plastic, thermal enhanced small outline package; 54 terminals; 0.65 mm pitch; 7.5 mm x 17.9 mm x 2.22 mm body 2016-03-02
SOT1747-2 HSOP54 HSOP54, plastic, heatsink small outline package; W/B, tooth gap design, 54 terminals; 0.65 mm pitch; 4.6 mm x 10.4 mm exposed pad 2018-01-05
SOT1747-3 HSOP54 HSOP54, plastic, heatsink small outline package; 54 terminals; 0.65 mm pitch; 17.9 mm x 7.5 mm x 2.45 mm body 2017-03-24
SOT1747-4 HSOP54 HSOP54, plastic, thermal enhanced small outline package; 54 terminals; 0.65 mm pitch; 7.5 mm x 17.9 mm x 2.33 mm body E-PDSO-G54(JEDEC) 2017-06-11
SOT1748-1 HTQFN32 HTQFN32, plastic, thermal enhanced thin quad flatpack; no leads; 32 terminals; 1 mm pitch; 10 mm x 10 mm x 1.55 mm body PBMA-N32(JEDEC) 2017-06-11
SOT1749-1 HTSSOP16 HTSSOP16, plastic, thermal enhanced thin shrink small outline package; 16 terminals; 0.65 mm pitch; 4.4 mm x 5 mm x 1.05 mm body TS-PDSO-G16(JEDEC) 2017-06-11
SOT1750-1 HVLGA71 HVLGA71, plastic, thermal enhanced, very thin, low profile land grid array package; 71 balls; 0.5 mm pitch; 9 mm x 9 mm x 0.9 mm body PBMA-N71(JEDEC) 2017-06-11
SOT1751-1 LBGA352 LBGA352, plastic, low profile ball grid array; 352 balls; 1.27 mm pitch; 35 mm x 35 mm x 1.05 mm body HT-PBGA-B352(JEDEC) 2017-06-11
SOT1752-1 LBGA480 LBGA480, plastic, low profile ball grid array; 480 balls; 1.27 mm pitch; 37.5 mm x 37.5 mm x 1.05 mm body HT-PBGA-B480(JEDEC) 2017-06-11
SOT1753-1 SENSOR4F SENSOR4F, sensor package; 4 terminals; 2.54 mm pitch; 17.78 mm x 29.48 mm x 8 mm body E-PSXA-F4(JEDEC) 2017-06-11
SOT1754-1 SENSOR4F SENSOR4F, sensor package; 4 terminals; 2.54 mm pitch; 17.78 mm x 29.48 mm x 10.67 mm body E-PSXC-F4(JEDEC) 2017-06-11
SOT1756-1 SENSOR4F SENSOR4F, sensor package; 4 terminals; 2.54 mm pitch; 17.78 mm x 29.48 mm x 10.67 mm body E-PSXC-F6(JEDEC) 2017-06-11
SOT1757-1 SENSOR4F SENSOR4F, sensor package; 4 terminals; 2.54 mm pitch; 19.05 mm x 27.94 mm x 8 mm body E-PSXD-F4(JEDEC) 2017-06-11
SOT1759-1 SIL3 SIL3, plastic, DIL-bent-SIL package; 3 terminals; 1.5 mm pitch; 4.15 mm x 5.5 mm x 1.5 mm body PSSO-F3(JEDEC) 2017-06-11
SOT176-1 SO8 plastic small outline package; 8 leads; body width 7.5 mm 2003-02-19
SOT1760-1 SIL4 SIL4, plastic, DIL-bent-SIL package; 4 terminals; 1.7 mm pitch; 9.2 mm x 10 mm x 4.4 mm body 2017-06-11
SOT1761-1 SO16 SO16, plastic, small outline package; 16 terminals; 1.27 mm pitch; 7.5 mm x 10.3 mm x 3.43 mm body F-PDSO-G16(JEDEC) 2017-06-11
SOT1762-1 SSOP32 SSOP32, plastic, shrink small outline package; 32 terminals; 0.65 mm pitch; 7.5 mm x 11 mm x 2.5 mm body 2016-02-29
SOT1762-2 SSOP32 SSOP32; plastic, shrink small outline package; 32 terminals; 0.65 mm pitch; 11 mm x 7.5 mm x 2.3 mm body 2016-01-21
SOT1763-1 SO4 SO4, plastic, small outline package; 4 terminals; 1.15 mm pitch; 1.25 mm x 2 mm x 1 mm body PDSO-G4(JEDEC) 2017-06-11
SOT1764-1 SSOP54 SSOP54, plastic, shrink small outline package; 54 terminals; 0.65 mm pitch; 7.5 mm x 17.9 mm x 2.5 mm body E-PDSO-G54(JEDEC) 2017-06-11
SOT1765-1 TLGA99 TLGA99, plastic, thin low profile land grid array; 99 balls; 9.5 mm x 9.5 mm x 1.1 mm body 2016-03-21
SOT1766-1 TQFN24 TQFN24, plastic, thin quad flatpack; no leads; 24 terminals; 0.5 mm pitch; 5 mm x 3 mm x 1 mm body 2017-06-11
SOT1767-1 TSON14 TSON14, plastic, thin small outline package; no leads; 14 terminals; 0.4 mm pitch; 5 mm x 3 mm x 1 mm body PBMA-N14(JEDEC) 2017-06-11
SOT1768-1 TSON8 TSON8, plastic, thin small outline; no leads; 8 terminals; 1.25 mm pitch; 3 mm x 5 mm x 1.1 mm body 2017-06-11
SOT1769-1 TSON8 TSON8, plastic, thin small outline package; no leads; 8 terminals; 1.25 mm pitch; 5 mm x 3 mm x 1.2 mm body PBMA-N14(JEDEC) 2017-06-11
SOT1770-1 TSOP6 TSOP6, plastic, thin small outline package; 6 terminals; 0.65 mm pitch; 1.25 mm x 2 mm x 1 mm body PDSO-G6(JEDEC) 2017-06-11
SOT1771-1 TSSOP24 TSSOP24, plastic, thin shrink small outline package; 24 terminals; 0.65 mm pitch; 5.6 mm x 7.8 mm x 1.05 mm body 2017-06-11
SOT1772-1 UNIBODY4F UNIBODY4F, unibody package; 4 terminals; 2.54 mm pitch; 15.56 mm x 15.56 mm x 5.33 mm body E-PSXA-F4(JEDEC) 2017-06-11
SOT1773-1 VQFN16 VQFN16, plastic, very thin quad flatpack; no leads; 16 terminals; 0.5 mm pitch; 3 mm x 3 mm x 1 mm body 2017-06-11
SOT1774-1 WLCSP120 WLCSP 120 5.29*5.28*.36 2017-06-11
SOT1775-1 WLCSP142 WLCSP 142 4.8*5.6*0.6P.4 2017-06-11
SOT1776-1 WLCSP143 WLCSP 143 6.44*5.55*0.56 2017-06-11
SOT1777-1 WLCSP169 WLCSP 169 5.7*5.5*.6 P.4 2017-06-11
SOT1778-1 WLCSP173 WLCSP173, wafer level chip-size package; 173 terminals; 0.5 mm pitch; 7.74 mm x 7.9 mm x 0.6 mm body 2017-06-11
SOT1779-1 WLCSP211 WLCSP211, , wafer level chip-size package; 211 terminals; 0.5 mm pitch; 9.33 mm x 7.91 mm x 0.6 mm body 2017-06-11
SOT1780-1 WLCSP36 WLCSP36, , wafer level chip-size package; 36 terminals; 0.4 mm pitch; 2.98 mm x 3.07 mm x 0.6 mm body 2017-06-11
SOT1780-2 WLCSP36 WLCSP36, , wafer level chip-size package; 36 terminals; 0.4 mm pitch; 3.06 mm x 3.06 mm x 0.6 mm body 2017-06-11
SOT1780-3 WLCSP36 WLCSP36, , wafer level chip-size package; 36 terminals; 0.4 mm pitch; 2.67 mm x 2.82 mm x 0.56 mm body 2017-06-11
SOT1780-4 WLCSP36 WLCSP36, wafer level chip-scale package; 36 bumps; 0.4 mm pitch, 2.62 mm x 2.51 mm x 0.525 mm body (backside coating included) 2017-12-20
SOT1780-5 WLCSP36 WLCSP36, wafer level chip-scale package; 36 bumps; 0.4 mm pitch, 2.62 mm x 2.51 mm x 0.5 mm body 2017-12-08
SOT1780-6 WLCSP36 WLCSP36, wafer level chip-scale package; 36 bumps; 0.4 mm pitch, 2.62 mm x 2.51 mm x 0.5 mm body 2017-09-18
SOT1780-7 WLCSP36 WLCSP36, wafer level chip-scale package; 36 bumps; 0.4 mm pitch, 2.62 mm x 2.51 mm x 0.525 mm body 2017-09-18
SOT1780-8 WLCSP36 WLCSP36, wafer level chip-scale package, 36 terminals, 0.4 mm pitch, 3.9 mm x 1.9 mm x 0.525 mm body (backside coating included) 2018-06-20
SOT1780-9 WLCSP36 WLCSP36, wafer level chip-scale package, 36 terminals, 0.4 mm pitch, 2.8 mm x 2.52 mm x 0.525 mm body (backside coating included) 2018-11-01
SOT1781-1 WLCSP35 WLCSP35, , wafer level chip-size package; 35 terminals; 0.4 mm pitch; 2.99 mm x 2.53 mm x 0.6 mm body 2017-06-11
SOT1782-1 WLCSP64 WLCSP 64 3.4*3.3*0.6P0.4 2017-06-11
SOT1782-2 WLCSP64 WLCSP64, , wafer level chip-size package; 64 terminals; 0.4 mm pitch; 3.38 mm x 3.48 mm x 0.32 mm body 2017-06-11
SOT1782-3 WLCSP64 WLCSP64, wafer level chip-scale package; 64 bumps; 3.24 mm x 3.24 mm x 0.625 mm body (backside coating included) 2018-08-02
SOT1783-1 WLCSP80 WLCSP 80 4.1*3.6*0.6 P.4 2017-06-11
SOT1783-2 WLCSP80 WLCSP 80 4.3*3.6*.34 P.4 2017-06-11
SOT1784-1 WLCSP89 wafer level chip-scale package, 89 bumps, 0.4 mm pitch, 3.63 mm x 3.58 mm x 0.38 mm body 2016-09-05
SOT1785-1 CFM4F CFM4F, ceramic, flange mount flat package; 4 terminals; 9.78 mm x 20.58 mm x 3.75 mm body 2017-06-11
SOT1785-2 CFM4F CFM4F, ceramic, flange mount flat package; 4 terminals; 9.78 mm x 20.58 mm x 3.75 mm body 2017-06-11
SOT1786-1 CFM4F CFM4F, ceramic, flange mount flat package; 4 terminals; 9.78 mm x 23.12 mm x 3.75 mm body 2017-06-11
SOT1787-1 CFM4F CFM4F, ceramic, flange mount flat package; 4 terminals; 10.16 mm x 41.1 mm x 4.58 mm body 2017-06-11
SOT1788-1 CFM2F CFM2F, ceramic, flange mount flat package; 2 terminals; 13.72 mm x 34.04 mm x 4.41 mm body 2017-06-11
SOT1789-1 CFM2F CFM2F, ceramic, flange mount flat package; 2 terminals; 13.72 mm x 23.12 mm x 4.41 mm body 2017-06-11
SOT1790-1 CFM2F CFM2F, ceramic, flange mount flat package; 2 terminals; 9.78 mm x 23.12 mm x 3.75 mm body 2017-06-11
SOT1791-1 CFM2F CFM2F, ceramic, flange mount flat package; 2 terminals; 5.85 mm x 20.32 mm x 3.82 mm body 2017-06-11
SOT1791-2 CFM2F CFM2F, ceramic, flange mount flat package; 2 terminals; 5.84 mm x 20.32 mm x 3.81 mm body 2017-06-11
SOT1792-1 CFM2F CFM2F, ceramic, flange mount flat package; 2 terminals; 9.78 mm x 34.04 mm x 3.75 mm body 2017-06-11
SOT1793-1 CFM2F NI-780S 2017-06-11
SOT1794-1 CFM8F CFM8F, ceramic, flange mount flat package; 8 terminals; 10.16 mm x 41.15 mm x 4.45 mm body 2017-06-11
SOT1795-1 CFM8F CFM8F, ceramic, flange mount flat package; 8 terminals; 10.16 mm x 32.26 mm x 4.45 mm body 2017-06-11
SOT1796-1 CFM8F CFM8F, ceramic, flange mount flat package; 8 terminals; 10.16 mm x 32.26 mm x 4.45 mm body 2017-06-11
SOT1797-1 CFM8F CFM8F, ceramic, flange mount flat package; 8 terminals; 9.78 mm x 20.58 mm x 3.75 mm body 2017-06-11
SOT1797-2 CFM8F CFM8F, ceramic, flange mount flat package; 8 terminals; 9.78 mm x 20.58 mm x 3.75 mm body 2017-06-11
SOT1798-1 CFM8F CFM8F, ceramic, flange mount flat package; 8 terminals; 9.78 mm x 23.12 mm x 3.75 mm body 2017-06-11
SOT1798-2 CFM8F CFM8F, ceramic, flange mount flat package; 8 terminals; 9.78 mm x 23.12 mm x 3.75 mm body 2017-06-11
SOT1799-1 CFM6F CFM6F, ceramic, flange mount flat package; 6 terminals; 9.78 mm x 20.58 mm x 3.75 mm body 2017-06-11
SOT1799-2 CFM6F CFM6F, ceramic, flange mount flat package; 6 terminals; 9.78 mm x 20.58 mm x 3.75 mm body 2017-06-11
SOT1799-3 CFM6F CFM6F, ceramic, flange mount flat package; 6 terminals; 9.78 mm x 20.58 mm x 3.75 mm body 2017-06-11
SOT1799-4 CFM6F CFM6F, ceramic, flange mount flat package; 6 terminals; 9.78 mm x 20.58 mm x 3.75 mm body 2017-06-11
SOT1799-5 CFM6F CFM6F, ceramic flange mount flat package; 6 terminals; 5.36 mm pitch, 9.78 mm x 20.58 mm x 3.75 mm body 2018-05-30
SOT1800-1 CFM6F CFM6F, ceramic, flange mount flat package; 6 terminals; 10.16 mm x 32.26 mm x 4.58 mm body 2017-06-11
SOT1800-2 CFM6F CFM6F, ceramic, flange mount flat package; 6 terminals; 10.16 mm x 32.26 mm x 4.45 mm body 2017-06-11
SOT1800-4 ACP-1230S-4L2S CFM6F, ceramic, flange mount flat package; 6 terminals; 10.16 mm x 32.26 mm x 4.45 mm body 2017-06-26
SOT1801-1 CFM6F CFM6F, ceramic, flange mount flat package; 6 terminals; 9.78 mm x 23.12 mm x 3.75 mm body 2017-06-11
SOT1801-2 CFM6F CFM6F, ceramic, flange mount flat package; 6 terminals; 9.78 mm x 23.12 mm x 3.75 mm body 2017-06-11
SOT1801-3 CFM6F CFM6F, ceramic, flange mount flat package; 6 terminals; 9.78 mm x 23.12 mm x 3.75 mm body 2017-06-11
SOT1802-1 CFM2 CFM2, ceramic, flange mount package; 2 terminals; 9.78 mm x 20.58 mm x 3.75 mm body 2017-06-11
SOT1803-1 CFM2 CFM2, ceramic, flange mount package; 2 terminals; 13.72 mm x 23.12 mm x 4.41 mm body 2017-06-11
SOT1804-1 CFM2 CFM2, ceramic, flange mount package; 2 terminals; 9.78 mm x 23.12 mm x 3.75 mm body 2017-06-11
SOT1804-2 CFM2 CFM2, ceramic, flange mount package; 2 terminals; 9.78 mm x 23.12 mm x 3.75 mm body 2017-06-11
SOT1805-1 CFM4 CFM4, ceramic, flange mount package; 4 terminals; 9.78 mm x 20.58 mm x 3.75 mm body 2017-06-11
SOT1805-3 CFM4 CFM4, ceramic, flange mount package; 4 terminals; 9.78 mm x 20.58 mm x 3.75 mm body 2017-06-11
SOT1806-1 CFM4 CFM4, ceramic, flange mount package; 4 terminals; 10.16 mm x 32.26 mm x 4.45 mm body 2017-06-11
SOT1806-2 CFM4 CFM4, ceramic, flange mount package; 4 terminals; 10.16 mm x 32.26 mm x 4.58 mm body 2017-06-11
SOT1809-1 CFM8 CFM8, ceramic, flange mount package; 8 terminals; 9.78 mm x 20.58 mm x 3.75 mm body 2017-06-11
SOT1811-1 PLD4L PLD4L, plastic, RF over-molded package designation; 4 terminals; 5.85 mm x 6.61 mm x 1.74 mm body PDFP-D2(JEDEC) 2017-06-11
SOT1811-2 PLD4L PLD4L, plastic, RF over-molded package designation; 4 terminals; 0 mm pitch; 5.85 mm x 6.61 mm x 1.74 mm body 2017-06-11
SOT1812-1 CFM2F CFM2F, ceramic, flange mount flat package; 2 terminals; 9.78 mm x 20.32 mm x 3.67 mm body 2017-06-11
SOT1812-2 CFM2F CFM2F, ceramic, flange mount flat package; 2 terminals; 9.78 mm x 20.32 mm x 3.66 mm body 2016-03-18
SOT1813-1 CFM2 CFM2, ceramic, flange mount package; 2 terminals; 3.68 mm x 4.7 mm x 2.51 mm body 2017-06-11
SOT1814-1 CFM2 CFM2, ceramic, flange mount package; 2 terminals; 5.85 mm x 20.32 mm x 3.83 mm body 2017-06-11
SOT1815-1 FM2 FM2, plastic, flange mount package; 2 terminals; 9.96 mm x 20.57 mm x 3.81 mm body 2017-06-11
SOT1815-2 FM2 FM2, plastic, flange mount package; 2 terminals; 9.96 mm x 20.57 mm x 3.81 mm body 2017-06-11
SOT1816-1 FM4F FM4F, plastic, flange mount flat package; 4 terminals; 9.96 mm x 32.26 mm x 3.81 mm body 2017-06-11
SOT1817-1 FM4F FM4F, plastic, flange mount flat package; 4 terminals; 9.96 mm x 23.21 mm x 3.81 mm body 2017-06-11
SOT1818-1 FM4F FM4F, plastic, flange mount flat package; 4 terminals; 9.96 mm x 20.57 mm x 3.81 mm body 2017-06-11
SOT1818-3 FM4F FM4F, plastic, flange mount flat package; 4 terminals; 9.96 mm x 20.57 mm x 3.81 mm body 2017-06-11
SOT1818-4 FM4F FM4F, plastic, flange mount flat package; 4 terminals; 9.96 mm x 20.57 mm x 3.81 mm body 2017-06-11
SOT1819-1 FM6F FM6F, plastic, flange mount flat package; 6 terminals; 9.96 mm x 32.26 mm x 3.81 mm body 2017-06-11
SOT1819-2 FM6F FM6F, plastic, flange mount flat package; 6 terminals; 9.96 mm x 32.26 mm x 3.81 mm body 2017-06-11
SOT1821-1 FM8F FM8F, plastic, flange mount flat package; 8 terminals; 6.1 mm x 9.65 mm x 2.03 mm body 2017-06-11
SOT1822-1 FM2F FM2F, plastic, flange mount flat package; 2 terminals; 6.1 mm x 10.67 mm x 2.03 mm body PDIP-F2(JEDEC) 2017-06-11
SOT1823-1 FM2F FM2F, plastic, flange mount package; 2 terminals; 9.96 mm x 20.57 mm x 3.81 mm body 2017-06-11
SOT1824-1 FM4 FM4, plastic, flange mount package; 4 terminals; 9.96 mm x 32.26 mm x 3.81 mm body 2017-06-11
SOT1825-1 FM4 FM4, plastic, flange mount package; 4 terminals; 9.96 mm x 20.57 mm x 3.81 mm body 2017-06-11
SOT1825-2 FM4 FM4, plastic, flange mount package; 4 terminals; 9.96 mm x 20.57 mm x 3.81 mm body 2017-06-11
SOT1826-1 CFM4F CFM4F, ceramic, flange mount flat package; 4 terminals; 9.78 mm x 20.53 mm x 3.75 mm body 2017-06-11
SOT1827-1 CFM4F CFM4F, ceramic, flange mount flat package; 4 terminals; 9.78 mm x 34.04 mm x 3.75 mm body 2017-06-11
SOT1828-1 CFM2F NI-400S-240 2017-06-11
SOT1829-1 CFM4F CFM4F, ceramic, flange mount flat package; 4 terminals; 10.16 mm x 32.26 mm x 4.58 mm body 2017-06-11
SOT1829-2 CFM4F CFM4F, ceramic, flange mount flat package; 4 terminals; 10.16 mm x 32.26 mm x 4.45 mm body 2017-06-11
SOT1830-1 HVQFN28 plastic thermal enhanced very thin quad flat package; no leads; 28 terminals; body 3.5 x 5.5 x 0.85 mm MO-220(JEDEC) 2016-04-26
SOT1832-1 HUQFN16 plastic thermal enhanced ultra thin quad flat package; no leads; 16 terminals; body 2.4 x 1.6 x 0.5 mm 2016-04-26
SOT1833-1 WLCSP75 WLCSP75, wafer level chip-size package; 75 terminals; 0.4 mm pitch; 3.8 mm x 3.89 mm x 0.56 mm body 2017-06-11
SOT1834-1 LFBGA304 LFBGA304, plastic, low profile fine-pitch ball grid array; 304 balls; 0.5 mm pitch; 12 mm x 12 mm x 1.11 mm body 2017-06-11
SOT1835-1 WLCSP25 wafer level chip-scale package, 25 bumps 2016-04-26
SOT1836-1 LBGA121 LBGA121, plastic, low profile ball grid array; 121 balls; 1 mm pitch; 12 mm x 12 mm x 1.12 mm body PBGA-B121(JEDEC) 2017-06-11
SOT1837-1 LFBGA347 LFBGA347, plastic, low profile fine-pitch ball grid array; 347 balls; 0.5 mm pitch; 12 mm x 12 mm x 1.3 mm body 2017-06-11
SOT1838-1 LFBGA236 LFBGA236, plastic, low profile fine-pitch ball grid array; 236 balls; 0.5 mm pitch; 9 mm x 9 mm x 1.24 mm body 2017-06-11
SOT1839-1 TFBGA488 TFBGA488, plastic, thin fine-pitch ball grid array; 488 balls; 0.4 mm pitch; 12 mm x 12 mm x 1.04 mm body JEDEC MO-298(JEDEC) 2017-06-11
SOT1840-1 FBGA621 FBGA621, plastic, fine-pitch ball grid array; 621 balls; 0.65 mm pitch; 17 mm x 17 mm x 1.97 mm body 2017-06-11
SOT1840-3 FBGA621 FBGA621, fine-pitch ball grid array package; 621 terminals, 0.65 mm pitch, 17 mm x 17 mm x 2.03 mm body 2017-03-27
SOT1842-1 LFBGA186 MAPBGA 186 12*12*0.8P0.8 2017-06-11
SOT1843-1 SIL4 SIL4, plastic, DIL-bent-SIL package; 4 terminals; 1.27 mm pitch; 6.35 mm x 9.25 mm x 3.63 mm body R-PSIP-F4(JEDEC) 2017-06-11
SOT1845-1 SO8 SO8, plastic, small outline package; 8 terminals; 2.54 mm pitch; 10.67 mm x 10.67 mm x 5.46 mm body E-PDIP-T8(JEDEC) 2017-06-11
SOT1848-2 BGA1517 BGA1517, plastic ball grid array package; 1517 balls, 1 mm pitch, 40 mm x 40 mm x 3.36 mm body 2017-12-18
SOT1849-1 VFBGA361 VFBGA361, plastic, very thin fine-pitch ball grid array; 361 balls; 0.5 mm pitch; 10 mm x 10 mm x 0.8 mm body VFBGA(JEDEC) 2017-06-11
SOT1850-1 VFBGA176 VFBGA176, plastic, very thin fine-pitch ball grid array; 176 balls; 0.5 mm pitch; 9 mm x 9 mm x 0.86 mm body 2018-07-13
SOT1851-1 VFBGA36 plastic very thin fine-pitch ball grid array package, 36 balls 2016-03-02
SOT1852-1 SENSOR6F SENSOR6F, sensor package; 6 terminals; 2.54 mm pitch; 17.78 mm x 29.47 mm x 8.01 mm body E-PSXB-F6(JEDEC) 2017-06-11
SOT1854-1 SO8 SO8, plastic, small outline package; 8 terminals; 2.54 mm pitch; 10.67 mm x 10.67 mm x 12.96 mm body E-PDSO-F8(JEDEC) 2017-06-11
SOT1855-1 WLCSP wafer level chip-scale package; 29 bumps; 1.14 x 1.14 x 0.28 mm 2016-10-04
SOT1856-1 CFM4F CFM4F, ceramic, flange mount flat package; 4 terminals; 9.78 mm x 34.04 mm x 5.13 mm body 2017-06-11
SOT1857-1 UFLGA64 plastic ultra thin fine-pitch land array package: 64 lands 2016-04-04
SOT186 TO-220F; SC-67 plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 3 lead TO-220 "full pack" exposed tabs 2002-03-12
SOT1860-1 VFBGA64 plastic very thin fine-pitch ball grid array package; 64 balls 2016-05-18
SOT1862-1 HVSON16 HVSON16, plastic, thermal enhanced very thin small outline; no leads; 16 terminals; 0.65 mm pitch; 4 mm x 6 mm x 0.9 mm body NON-JEDEC(JEDEC) 2017-06-11
SOT1863-1 SO8 SO8, plastic, small outline package; 8 terminals; 2.54 mm pitch; 10.67 mm x 10.67 mm x 12.96 mm body E-PDIP-F8(JEDEC) 2017-10-24
SOT1865-1 TFBGA265S TFBGA265S, plastic thin fine-pitch ball grid array; 265 balls, 0.75 mm interstitial pitch, 13 mm x 13 mm x 1.04 mm body 2018-09-14
SOT1865-2 TFBGA265S TFBGA265S, plastic thin fine-pitch ball grid array; 265 balls, 0.75 mm pitch, 13 mm x 13 mm x 1.04 mm body 2017-09-14
SOT1866-1 DBS27P plastic DIL-bent-SIL(special bent) power package; 27 leads (lead length 6.8 mm) 2016-06-09
SOT1868-1 VFLGA211 VFLGA211, plastic, very thin fine-pitch land grid array; 211 balls; 0.5 mm pitch; 9.6 mm x 9.6 mm x 0.81 mm body 2017-06-11
SOT186A TO-220F plastic, single-ended package; 3 leads; 2.54 mm pitch; 15.5 mm x 10 mm x 4.3 mm body 3-lead TO-220F(JEDEC) 2006-02-14
SOT186B TO-220F plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 3 lead TO-220 "full pack" 2002-03-12
SOT187-2 PLCC44 plastic leaded chip carrier; 44 leads EDR-7319(EIAJ);MS-018(JEDEC);112E10(IEC) 2001-11-14
SOT187-3 PLCC44 PLCC44, plastic leaded chip carrier; 44 terminals; 1.27 mm pitch; 16.58 mm x 16.58 mm x 4.57 mm body PQCC-J44(JEDEC) 2017-06-11
SOT1870-1 WLCSP8 Bumped die with 8 functional bumps; 2.51 mm x 2.51 mm x 0.16 mm 2016-10-04
SOT1872-1 WLCSP7 WLCSP7, , wafer level chip-size package; 7 terminals; 0 mm pitch; 0.38 mm x 1.47 mm x 0.38 mm body 2017-06-11
SOT1873-1 CFM2 CFM2, ceramic, flange mount package; 2 terminals; 3.75 mm x 34.04 mm x 3.75 mm body 2016-03-07
SOT1875-1 WLCSP210 WLCSP210, wafer level chip-size package; 210 terminals; 0.4 mm pitch; 6.33 mm x 6.62 mm x 0.56 mm body 2017-06-11
SOT1875-2 WLCSP210 WLCSP210, wafer level chip-size package; 210 terminals; 0.4 mm pitch; 6.94 mm x 6.94 mm x 0.56 mm body 2017-06-11
SOT1877-1 SIL6 SIL6, plastic, DIL-bent-SIL package; 6 terminals; 2.54 mm pitch; 15.56 mm x 15.56 mm x 5.34 mm body E-PSXA-F6(JEDEC) 2017-06-11
SOT1878-1 HX2QFN20 plastic, thermal enhanced super thin quad flat package; no leads; 20 terminals; 0.4 mm pitch, 3.0 mm x 2.0 mm x 0.35 mm body 2016-06-10
SOT1879-1 LFBGA393 LFBGA393, plastic, low profile fine-pitch ball grid array; 393 balls; 0.5 mm pitch; 14 mm x 14 mm x 1.11 mm body 2017-06-11
SOT188-2 PLCC68 plastic leaded chip carrier; 68 leads EDR-7319(EIAJ);MS-018(JEDEC);112E10(IEC) 2001-11-14
SOT188-3 PLCC68 plastic leaded chip carrier; 68 leads; pedestal, 1.27 mm pitch, 24.15 mm x 24.15 mm x 3.56 mm body MO-047(JEDEC);112E10(IEC) 2001-11-14
SOT188-4 PLCC68 PLCC68, plastic leaded chip carrier; 68 terminals; 1.27 mm pitch; 24.2 mm x 24.2 mm x 4.57 mm body PQCC-J68(JEDEC) 2017-06-11
SOT1880-1 UFBGA16 plastic ultra thin fine-pitch ball grid array package; 16 balls 2016-06-16
SOT1882-1 WLCSP47 wafer level chip-scale package; 47 bumps; 3.20 mm x 3.28 mm x 0.365 mm body 2016-08-01
SOT1883-1 HX2QFN16 plastic, thermal enhanced super thin quad flat package; no leads; 16 terminals; body 2.6 x 2.6 x 0.35 mm 2016-06-16
SOT1887-1 WLCSP48 wafer level chip-scale package; 48 bumps; 3.72 mm x 2.79 mm x 0.525 mm (Backside coating included) 2016-10-04
SOT1887-2 WLCSP48 WLCSP48, wafer level chip-scale package; 48 bumps; 0.4 mm pitch, 2.51 mm x 3.55 mm x 0.5 mm body 2017-12-11
SOT1887-3 WLCSP48 WLCSP48, wafer level chip-scale package; 48 bumps; 0.4 mm pitch, 2.51 mm x 3.55 mm x 0.525 mm body 2017-12-11
SOT1887-4 WLCSP48 WLCSP48, wafer level chip-scale package; 48 bumps; 0.4 mm pitch, 2.51 mm x 3.55 mm x 0.50 mm body 2017-12-19
SOT1887-5 WLCSP48 WLCSP48, wafer level chip-scale package; 48 bumps; 0.4 mm pitch, 2.51 mm x 3.55 mm x 0.525 mm body 2017-12-08
SOT1888-1 LFBGA141 LFBGA141, plastic, low profile fine-pitch ball grid array; 141 balls; 0.65 mm pitch; 10 mm x 10 mm x 1.38 mm body 2017-06-11
SOT189-2 PLCC84 plastic leaded chip carrier; 84 leads EDR-7319(EIAJ);MS-018(JEDEC);112E13(IEC) 2001-11-14
SOT189-3 PLCC84 plastic leaded chip carrier; 84 leads; pedestal, 1.27 mm pitch, 29.24 mm x 29.24 mm x 3.68 mm body MO-047(JEDEC);112E13(IEC) 2001-11-14
SOT189-4 PLCC84 PLCC84, plastic leaded chip carrier; 84 terminals; 1.27 mm pitch; 29.28 mm x 29.28 mm x 4 mm body PQCC-J84(JEDEC) 2017-06-11
SOT1890-1 WLCSP56 wafer level chip-scale package; 56 bumps; 0.35 mm pitch, 2.95 mm x 2.6 mm x 0.415 mm body (backside coating included) 2018-11-01
SOT1893-1 CLSON12 CLSON12, ceramic, low-profile small outline no lead; 12 terminals; 0.8 mm pitch; 4 mm x 5 mm x 1.215 mm body 2017-06-11
SOT1894-1 SO14 plastic small outline package; 14 leads; 9.9 mm x 3.9 mm x 1.35 mm body 2016-08-17
SOT1895-1 X2QFN24 plastic, thermal enhanced super thin quad flat package; no leads; 24 terminals; 2.0 mm x 2.0 mm x 0.35 mm body 2016-08-19
SOT1896-1 X2QFN16 plastic, thermal enhanced super thin quad flat package; no leads; 16 terminals; 1.6 mm x 1.6 mm x 0.35 mm body 2016-08-19
SOT1898-1 HLQFP64 plastic, thermal enhanced low profile quad flat package; 64 leads; 14 x 14 x 1.5 mm body; exposed die pad 2016-09-01
SOT1899-1 BGA1313 BGA1313, plastic, ball grid array; 1313 balls; 1 mm pitch; 29 mm x 29 mm x 2.37 mm body 2017-06-11
SOT190-1 VSO56 plastic very small outline package; 56 leads 2003-02-19
SOT190-2 VSO56 plastic very small outline package; 56 leads; face down 2003-02-19
SOT1901-1 WLCSP8 WLCSP8, wafer level chip-scale package; 8 bumps; 0.810 mm x 0.505 mm x 0.23 mm body 2017-03-08
SOT1903-1 HX2QFN24 plastic, thermal enhanced super thin quad flat package; no leads; 24 terminals; 0.4 mm pitch, 2.4 mm x 3.2 mm x 0.35 mm body 2016-12-16
SOT1906-2 WLCSP214 WLCSP214, wafer level chip-scale package, 214 terminals, 0.5 mm pitch, 9.418 mm x 7.918 mm x 0.55 mm body 2018-03-28
SOT1910-1 LFLGA54 LFLGA54, plastic low profile, fine pitch, land grid array package; 54 terminals; 0.5 mm pitch; 6 mm x 9.7 mm x 1.17 mm body 2017-01-23
SOT1911-1 CFM4F CFM4F, ceramic, flange mount flat package; 4 terminals; 5.845 mm x 16.35 mm x 3.975 mm body 2017-06-11
SOT1914-1 WLCSP56 WLCSP56, wafer level chip-scale package; 56 bumps, 0.4 mm pitch, 4.39 mm x 3.59 mm x 0.5 mm body 2018-02-08
SOT1915-1 FBGA525 FBGA525, fine-pitch ball grid array package; 525 terminals, 0.8 mm pitch, 19 mm x 19 mm x 2.47 mm body 2017-01-24
SOT1915-2 FBGA525 FBGA525, fine-pitch ball grid array package; 525 balls, 0.8 mm pitch, 19 mm x 19 mm x 2.37 mm body 2018-08-13
SOT1916-1 FBGA609 FBGA609, fine-pitch ball grid array package; 609 terminals, 0.8 mm pitch, 21 mm x 21 mm x 2.37 mm body 2017-07-06
SOT1917-1 WLCSP72 WLCSP72, wafer level chip-scale package; 72 bumps; 0.35 mm pitch, 2.99 mm x 3.54 mm x 0.355 mm body 2018-01-22
SOT1917-2 WLCSP72 WLCSP72, wafer level chip-scale package; 72 bumps; 3.54 mm x 2.99 mm x 0.365 mm body 2017-02-21
SOT1917-3 WLCSP72 WLCSP72, wafer level chip-scale package; 72 bumps; 0.35 mm pitch, 3.54 mm x 2.99 mm x 0.49 mm body 2018-04-27
SOT1926-1 WLCSP41 WLCSP41, wafer level chip-scale package; 41 bumps; 1.500 mm x 1.455 mm x 0.275 mm body 2017-06-14
SOT1927-1 HX2QFN HX2QFN16, plastic, thermal enhanced super-thin quad; flat non-leaded package; 16 terminals; 0.4 mm pitch; 2.3 mm x 2.3 mm x 0.38 mm body 2017-06-14
SOT1928-1 LFBGA249 LFBGA249, plastic low profile fine-pitch ball grid array package; 249 balls; 12.0 mm x 12.0 mm x 1.30 mm body 2017-08-17
SOT193-2 SIL13P plastic single in-line power package; 13 leads 2003-03-12
SOT1930-1 SIL3 SIL3, plastic DIL-bent-SIL package, 3 terminals; 5.44 mm pitch; 15.92 mm x 20.96 mm x 5.07 mm body 2017-10-18
SOT1931-1(SC) HQFN24 plastic thermal enhanced quad flat package; no leads; 24 terminals; 0.5 mm pitch, 4 mm x 4 mm x 1.98 mm body 2018-10-08
SOT1933-1 HQFN36 HQFN36, plastic, thermal enhanced quad flatpack; no leads; 36 terminals; 0.8 mm pitch; 12 mm x 12 mm x 2.1 mm body I-PQFP-N36(JEDEC) 2017-06-11
SOT1936-1 HX2QFN14 HX2QFN14, plastic thermal enchanced super thin quad flat package; no leads; 14 terminals; 3.5 mm x 3.5 mm x 0.32 mm body 2017-07-24
SOT1937-1 SIL3 SIL3, plastic, DIL-bent-SIL package; 3 terminals; 2.54 mm pitch; 14.32 mm x 9.96 mm x 2.50 mm body 2018-04-19
SOT1938-1 HQFN23 HQFN23, thermal enhanced qual flat package, no leads, 23 terminals, 0.9 mm pitch, 12 mm x 12 mm x 2.1 mm body 2018-07-03
SOT1938-2 HQFN23 HQFN23, thermal enhanced qual flat package, no leads, 23 terminals, 0.9 mm pitch, 12 mm x 12 mm x 2.1 mm body 2018-07-16
SOT1941-1 FBGA780 FBGA780, plastic, fine-pitch ball grid array; 780 balls, 0.65 mm pitch, 19 mm x 19 mm x 2.37 mm body 2017-09-14
SOT1942-1 WLCSP40 WLCSP40, wafer level chip-scale package; 40 bumps; 0.4 mm pitch; 2.25 mm x 3.45 mm x 0.525 mm body (backside coating included) 2017-09-13
SOT1944-1 VFBGA100 VFBGA100, very thin fine-pitch ball grid array package, 100 terminals, 0.5 mm pitch, 6 mm x 6 mm x 0.8 mm body 2018-04-03
SOT1945-1 VFBGA180 VFBGA180, plastic, very thin fine pitch ball grid array; 180 bumps; 0.5 mm pitch; 8 mm x 8 mm x 0.86 mm body 2017-10-12
SOT1948-1 HWFLGA36 HWFLGA36, plastic thermal enhanced very very thin fine-pitch land grid array package, 0.4 mm pitch, 2.1 mm x 6 mm x 0.637 mm body 2018-09-03
SOT195 SIP4 plastic single-ended flat package; 4 in-line leads 1997-06-02
SOT1950-1 WLCSP72 WLCSP72, wafer level chip-scale package, 72 bumps, 4.46 mm x 3.96 mm x 0.53 mm body 2017-10-05
SOT1951-1 FBGA1150 FBGA1150, plastic, fine-pitch ball grid array package, 1150 balls, 0.65 mm pitch, 23 mm x 23 mm x 2.37 mm body 2017-11-13
SOT1954-1 FBAG352 FBGA352, plastic fine-pitch ball grid array package, 352 balls, 0.8 mm pitch, 17 mm x 17 mm x 1.63 mm body 2017-11-28
SOT1956-1 XQFN16 XQFN16, plastic, extremely thin quad flat package; no leads; 16 terminals; 0.4 mm pitch, 2.2 mm x 2.8 mm x 0.50 mm body 2017-12-07
SOT1957-1 WLCSP43 WLCSP43, wafer level chip-scale package; 43 bumps; 0.4 mm pitch, 4.045 mm x 3.16 mm x 0.38 mm body 2018-04-12
SOT1958-1 FBAG501 FBGA501, plastic fine-pitch ball grid array package, 501 balls, 0.8 mm pitch, 21 mm x 21 mm x 1.63 mm body 2017-12-12
SOT1959-1 HUQFN18 plastic thermal enhanced ultra thin quad flat package; no leads; 18 terminals; 0.4 mm pitch, 2.6 mm x 2.6 mm x 0.55 mm body 2018-10-17
SOT1961-1 RDBS27P RDBS27P, right-angle DIL-bent-SIL package, 27 terminals, 1.0 mm pitch, 15.9 mm x 29.1 mm x 4.5 mm body 2018-01-17
SOT1962-1 LFBGA485 LFBGA485, plastic, low profile fine-pitch ball grid array package; 485 balls; 0.5 mm pitch; 14 mm x 14 mm x 1.25 mm body 2018-01-12
SOT1963-1 VFBGA42 VFBGA42, plastic very thin fine-pitch ball grid array package, 42 balls, 0.4 mm pitch, 2.6 mm x 3 mm x 0.9 mm body 2018-02-01
SOT1964-1 WLCSP8 WLCSP8, wafer level chip-scale package, 8 terminals, 0.205 mm pitch, 1.16 mm x 0.86 mm x 0.48 mm body 2018-03-07
SOT1966-1 WLCSP81 WLCSP81, wafer level chip-scale package; 81 bumps; 0.35 mm pitch, 3.55 mm x 3.36 mm x 0.365 mm body 2018-02-12
SOT1966-2 WLCSP81 WLCSP81, wafer level chip-scale package; 81 bumps; 0.35 mm pitch, 3.55 mm x 3.36 mm x 0.365 mm body (backside coating included) 2018-03-14
SOT1967-1 LFBGA486 LFBGA486, low profile fine-pitch ball grid array, 486 balls, 0.5 mm pitch, 14 mm x 14 mm x 1.15 mm body 2018-08-02
SOT1967-2 LFBGA486 LFBGA486, low profile fine-pitch ball grid array, 486 balls, 0.5 mm pitch, 14 mm x 14 mm x 1.15 mm body 2018-03-01
SOT1968-1 LFBGA196 LFBGA196, low profile fine pitch ball grid array, 196 terminals, 0.8 mm pitch, 12 mm x 12 mm x 1.37 mm body 2018-03-26
SOT1975-1 WLCSP68 WLCSP68, wafer level chip-scale package, 68 terminals; 0.35 mm pitch, 3.78 mm x 3.06 mm x 0.49 mm body (backside coating included) 2018-05-16
SOT1978-1 FBAG957 FBGA957, fine-pitch ball grid array package, 0.65 mm pitch, 21 mm x 21 mm x 2.37 mm body 2018-05-18
SOT1979-1 FBGA187 FBGA187, fine-pitch ball grid array package, 187 terminals, 0.5 mm pitch, 9 mm x 9 mm x 1.87 mm body 2018-05-28
SOT1980-1 WLCSP36 WLCSP36, wafer level chip scale package, 36 terminals, 1.63 mm x 1.53 mm x 0.225 mm body 2018-10-16
SOT1982-1 VFBGA98 VFBGA98, very thin fine-pitch ball grid array package, 98 terminals, 0.5 mm pitch, 7 mm x 7 mm x 0.86 mm body 2018-09-26
SOT1985-1 VFBGA36 VFBGA36, very thin fine-pitch ball grid array package, 36 terminals, 0.5 mm pitch, 3.5 mm x 3.5 mm x 0.8 mm body 2018-06-28
SOT1986-1 X2SON8 X2SON8, super thin small outline package, no leads; 8 terminals; 0.35 mm pitch; 1.4 mm x 1.0 mm x 0.32 mm body 2018-08-06
SOT1989-1 LFBGA269 LFBGA269, low-profile fine-pitch ball grid array package, 269 terminals, 0.8 mm pitch, 14 mm x 14 mm x 1.37 mm body 2018-07-06
SOT199 TO-247F plastic single-ended package; heatsink mounted; 1 mounting hole; 3 lead TO-247 "full pack" 3-lead TO-247F(JEDEC) 1999-09-13
SOT1990-1 HLLAG33R HLLGA33R, thermal enhanced low profile land grid array, 33 terminals, 0.8 mm pitch, 10 mm x 6 mm x 1.365 mm body 2018-08-22
SOT1991-1(SC) HTQFN24 HTQFN24, thermal enhanced thin quad flat package; no leads; step-cut wettable flank; 24 terminals, 0.5 mm pitch, 4 mm x 4 mm x 1 mm body 2018-07-18
SOT1997-1 FBGA477 FBGA477, fine-pitch ball grid array package, 477 terminals, 0.75 mm pitch, 17 mm x 17 mm x 2.03 mm body 2018-09-21
SOT1998-1 WLCSP40 WLCSP40, wafer level chip scale package, 40 terminals, 1.83 mm x 1.62 mm x 0.225 mm body 2018-10-16
SOT1999-1 WLCSP12 WLCSP12, wafer level chip scale package; 12 terminals, 0.5 mm pitch, 2.06 mm x 2.018 mm x 0.6 mm body 2011-07-12
SOT205-1 QFP44 plastic quad flat package; 44 leads (lead length 2.35 mm); body 14 x 14 x 2.2 mm 133E01(IEC) 2003-02-25
SOT222-1 DIP24 plastic, dual in-line package; 24 leads; 2.54 mm pitch, 31.7 mm x 6.5 mm x 4.7 mm body MS-001(JEDEC) 2003-03-12
SOT223 SC-73 plastic, surface-mounted package with increased heatsink; 4 leads; 4.6 mm pitch; 6.5 mm x 3.5 mm x 1.65 mm body SC-73(EIAJ) 2006-03-16
SOT223-1 SO4 plastic small outline package; 4 leads; body width 3.5 mm TO-261(JEDEC) 2003-02-19
SOT226 I2PAK plastic, single-ended package (I2PAK); 3 terminals; 2.54 mm pitch; 11 mm x 10 mm x 4.3 mm body TO-262(JEDEC) 2009-08-25
SOT226A I2PAK plastic single-ended package (I2PAK); TO-262 TO-262(JEDEC) 2009-08-25
SOT226B I2PAK plastic, single-ended package (I2PAK); 3 leads; 2.54 mm pitch; 11 mm x 10 mm x 4.5 mm body 2016-06-08
SOT226C I2PAK plastic, single-ended package (I2PAK); 3 leads; 2.54 mm pitch; 11 mm x 10 mm x 4.5 mm body 2016-08-08
SOT23 TO-236AB plastic, surface-mounted package; 3 terminals; 1.9 mm pitch; 2.9 mm x 1.3 mm x 1 mm body TO-236AB(JEDEC) 2006-03-16
SOT232-1 SDIP32 plastic shrink dual in-line package; 32 leads (400 mil) 2003-02-13
SOT232-2 SDIP32 SDIP32, plastic, shrink dual in-line package; 32 terminals; 1.778 mm pitch; 9.9 mm x 28.1 mm x 4.9 mm body E-PDIP-T32(JEDEC) 2017-06-11
SOT234-1 SDIP24 plastic shrink dual in-line package; 24 leads (400 mil) 2003-02-13
SOT238-2 PLCC52 plastic leaded chip carrier; 52 leads EDR-7319(EIAJ);MS-018(JEDEC);112E11(IEC) 2001-11-15
SOT238-3 PLCC52 plastic leaded chip carrier; 52 leads; pedestal, 1.27 mm pitch, 19.1 mm x 19.1 mm x 4.38 mm body MO-047(JEDEC);112E11(IEC) 2001-11-15
SOT238-4 PLCC52 PLCC52, plastic leaded chip carrier; 52 terminals; 1.27 mm pitch; 19.12 mm x 19.12 mm x 4.57 mm body PQCC-J52(JEDEC) 2017-06-11
SOT240-1 DIP48 plastic dual in-line package; 48 leads (600 mil) MS-011(JEDEC) 2003-02-13
SOT243-1 DBS17P plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm) 2003-03-12
SOT243-3 DBS17P plastic DIL-bent-SIL power package; 17 leads (lead length 7.7 mm) 2003-03-12
SOT247-1 SDIP52 plastic shrink dual in-line package; 52 leads (600 mil) MS-020(JEDEC) 2003-02-13
SOT257-2 CPGA68 ceramic pin grid array package; 68 pins; body 27.9 x 27.9 x 2.4 mm 2002-11-01
SOT258-2 CPGA84 ceramic pin grid array package; 84 pins; body 27.9 x 27.9 x 2.3 mm 2002-11-01
SOT259-2 CPGA120 ceramic pin grid array package; 120 pins; body 33.5 x 33.5 x 2.6 mm 2002-11-01
SOT261-2 PLCC28 plastic, leaded chip carrier; 28 leads; 1.27 mm pitch; 11.48 mm x 11.48 mm x 4.38 mm body EDR-7319(EIAJ);MS-018(JEDEC);112E08(IEC) 2001-11-15
SOT261-3 PLCC28 plastic leaded chip carrier; 28 leads; pedestal, 1.27 mm pitch, 11.5 mm x 11.5 mm x 4.38 mm body MO-047(JEDEC);112E08(IEC) 2001-11-15
SOT263 TO-220-5 plastic, single-ended package; 5 leads; 1.7 mm pitch; 15.5 mm x 10 mm x 4.3 mm body 5-lead TO-220(JEDEC) 2006-02-14
SOT263-01 TO-220-5 option plastic single-ended package; heatsink mounted; 1 mounting hole; 5-lead TO-220 lead form option 5-lead TO-220(JEDEC) 2006-02-14
SOT263B TO-220-5 plastic, single-ended package (heatsink mounted, 1 mounting hole); 5 leads; 1.7 mm pitch; 15.5 mm x 10 mm x 4.3 mm body 5-lead TO-220(JEDEC) 2001-01-11
SOT263B-01 TO-220-5 option plastic, single-ended package; 5 leads; 1.7 mm pitch; 15.5 mm x 10 mm x 4.3 mm body 5-lead TO-220(JEDEC) 2001-01-11
SOT266-1 SSOP20 plastic shrink small outline package; 20 leads; body width 4.4 mm MO-152(JEDEC) 2003-02-19
SOT27-1 DIP14 plastic, dual in-line package; 14 leads; 2.54 mm pitch; 19 mm x 6.35 mm x 4.2 mm body SC-501-14(EIAJ);MO-001(JEDEC);050G04(IEC) 2003-02-13
SOT270-1 SDIP42 plastic shrink dual in-line package; 42 leads (600 mil) MS-020(JEDEC) 2003-02-13
SOT270-3 SDIP42 SDIP42, plastic, shrink dual in-line package; 42 terminals; 1.778 mm pitch; 13.97 mm x 36.83 mm x 5.08 mm body E-PDIP-T42(JEDEC) 2017-06-11
SOT274-1 SDIP64 plastic shrink dual in-line package; 64 leads (750 mil) MS-021(JEDEC) 2003-02-13
SOT274-2 SDIP64 plastic shrink dual in-line package; 64 leads (750 mil); face down MS-021(JEDEC) 2006-02-24
SOT281 TO-220 plastic single-ended package; 5-lead low-profile TO-220 1997-06-11
SOT287-1 SO32 plastic small outline package; 32 leads; body width 7.5 mm MO-119(JEDEC) 2003-02-19
SOT307-2 QFP44 plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm 2003-02-25
SOT310-1 QFP80 plastic quad flat package; 80 leads (lead length 1.6 mm); body 14 x 20 x 3.0 mm MS-022(JEDEC);112E08(IEC) 2003-02-25
SOT313-2 LQFP48 plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm MS-026(JEDEC);136E05(IEC) 2003-02-25
SOT313-3 LQFP plastic, low profile quad; flat leaded package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1.4 mm body MS-026-BBC(JEDEC) 2016-05-12
SOT314-2 LQFP64 plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm MS-026(JEDEC);136E10(IEC) 2003-02-25
SOT315-1 LQFP80 plastic low profile quad flat package; 80 leads; body 12 x 12 x 1.4 mm MS-026(JEDEC);136E15(IEC) 2003-02-25
SOT315-2 LQFP80 plastic, low profile quad; flat leaded package; 80 terminals; 0.50 mm pitch; 12 mm x 12 mm x 1.6 mm body 2016-07-12
SOT316-1 SQFP208 plastic shrink quad flat package; 208 leads (lead length 1.3 mm); body 28 x 28 x 3.4 mm; high stand-off height MS-029(JEDEC) 2003-02-25
SOT317-1 QFP100 plastic quad flat package; 100 leads (lead length 1.95 mm); body 14 x 20 x 2.7 mm; high stand-off height MO-112(JEDEC) 2003-02-25
SOT317-2 QFP100 plastic quad flat package; 100 leads (lead length 1.95 mm); 0.65 mm pitch, 14 mm x 20 mm x 2.8 mm body MO-112(JEDEC) 2003-02-25
SOT317-3 QFP100 plastic quad flat package; 100 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm MO-112(JEDEC) 2003-02-25
SOT318-1 QFP80 plastic quad flat package; 80 leads (lead length 1.95 mm); body 14 x 20 x 2.7 mm; high stand-off height MO-112(JEDEC) 2003-02-25
SOT318-2 QFP80 plastic quad flat package; 80 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm MO-112(JEDEC) 2003-02-25
SOT318-5 QFP80 plastic quad flat package; 80 leads (lead length 1.95 mm; slope angle 60 deg); body 14 x 20 x 2.8 mm 2003-02-25
SOT319-2 QFP64 plastic quad flat package; 64 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm MO-112(JEDEC) 2003-02-25
SOT32 TO-126 plastic single-ended leaded (through hole) package; mountable to heatsink, 1 mounting hole; 3 leads TO-126(JEDEC) 1997-03-04
SOT320-2 QFP128 plastic quad flat package; 128 leads (lead length 1.6 mm); body 28 x 28 x 3.4 mm; high stand-off height MS-022(JEDEC);134E13(IEC) 2003-02-25
SOT320-3 QFP128 plastic quad flat package; 128 leads (lead length 1.95 mm); body 28 x 28 x 3.4 mm; lead angle 60 deg MO-112(JEDEC) 2003-02-19
SOT322-1 QFP160 plastic quad flat package;160 leads (lead length 1.95 mm); body 28 x 28 x 3.4 mm; high stand-off height MO-112(JEDEC) 2003-02-25
SOT322-2 QFP160 plastic quad flat package; 160 leads (lead length 1.6 mm); body 28 x 28 x 3.4 mm; high stand-off height MS-022(JEDEC);135E12(IEC) 2003-02-25
SOT322-3 QFP160 plastic quad flat package;160 leads (lead length 1.95 mm); body 28 x 28 x 3.4 mm; lead angle 60 deg MO-112(JEDEC) 2004-09-13
SOT322-4 QFP160 QFP160, plastic, quad flat package; 160 terminals; 0.65 mm pitch; 28 mm x 28 mm x 3.3 mm body PQFP-G160(JEDEC) 2017-06-11
SOT323 SC-70 plastic, surface-mounted package; 3 leads; 1.3 mm pitch; 2 mm x 1.25 mm x 0.95 mm body SC-70(EIAJ) 2006-03-16
SOT334-2 SQFP240 plastic shrink quad flat package; 240 leads (lead length 1.3 mm); body 32 x 32 x 3.4 mm; high stand-off height MS-029(JEDEC) 2003-05-21
SOT337-1 SSOP14 plastic, shrink small outline package; 14 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body MO-150(JEDEC) 2003-02-19
SOT338-1 SSOP16 plastic, shrink small outline package; 16 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body MO-150(JEDEC) 2003-02-19
SOT338-2 SSOP16 SSOP16, plastic, shrink small outline package; 16 terminals; 0.65 mm pitch; 5.3 mm x 5.45 mm x 2 mm body 2017-06-11
SOT339-1 SSOP20 plastic, shrink small outline package; 20 leads; 0.65 mm pitch; 7.2 mm x 5.3 mm x 2 mm body MO-150(JEDEC) 2003-02-19
SOT339-2 SSOP20 SSOP20, plastic, shrink small outline package; 20 terminals; 0.65 mm pitch; 5.3 mm x 7.2 mm x 1.8 mm body 2017-06-11
SOT340-1 SSOP24 plastic, shrink small outline package; 24 leads; 0.65 mm pitch; 8.2 mm x 5.3 mm x 2 mm body MO-150(JEDEC) 2003-02-19
SOT341-1 SSOP28 plastic, shrink small outline package; 28 leads; 0.65 mm pitch; 10.2 mm x 5.3 mm x 2 mm body MO-150(JEDEC) 2003-02-19
SOT343F DFP4 Plastic surface-mounted flat pack package; 4 leads 2006-03-16
SOT343N SO4 plastic surface-mounted package; 4 leads 2006-03-16
SOT343R CMPAK-4 plastic surface-mounted package; reverse pinning; 4 leads 2006-03-16
SOT346 SMT3; MPAK plastic, surface-mounted package; 3 leads; 1.9 mm pitch; 2.9 mm x 1.5 mm x 1.15 mm body SC-59A(EIAJ);TO-236(JEDEC) 2006-03-16
SOT349-2 QFP120 plastic quad flat package; 120 leads (lead length 1.6 mm); body 28 x 28 x 3.4 mm; high stand-off height MS-022(JEDEC);134E11(IEC) 2003-02-25
SOT352-1 RBS9MPF plastic rectangular-bent single in-line medium power package with fin; 9 leads 2003-03-12
SOT353 SOT353 plastic, surface-mounted package; 5 leads; 1.3 mm pitch; 2 mm x 1.25 mm x 0.95 mm body SC-88A(EIAJ) 2006-03-16
SOT353-1 TSSOP5 plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body SC-88A(EIAJ);MO-203(JEDEC) 2003-02-19
SOT354-1 SMS9P plastic surface-mounted single in-line power package; 9 leads 2006-03-16
SOT355-1 TSSOP24 plastic, thin shrink small outline package; 24 leads; 0.65 mm pitch; 7.8 mm x 4.4 mm x 1.1 mm body MO-153(JEDEC) 2003-02-19
SOT357-1 TQFP64 plastic thin quad flat package; 64 leads; body 10 x 10 x 1.0 mm MS-026(JEDEC);137E10(IEC) 2002-03-14
SOT358-1 LQFP32 plastic low profile quad flat package; 32 leads; body 7 mm x 7 mm x 1.4 mm MS-026(JEDEC);136E03(IEC) 2005-11-09
SOT358-2 LQFP plastic, low profile quad; flat leaded package; 32 terminals; 0.80 mm pitch; 7 x 7 x 1.4 mm body (EIAJ);MS-026 BBA(JEDEC);IEC 2016-06-06
SOT358-3 LQFP plastic, low profile quad; flat leaded package; 32 terminals; 0.80 mm pitch; 7 mm x 7 mm x 1.4 mm body 2016-05-19
SOT360-1 TSSOP20 plastic thin shrink small outline package; 20 leads; body width 4.4 mm MO-153(JEDEC) 2003-02-19
SOT360-2 TSSOP20 TSSOP20, plastic, thin shrink small outline package; 20 terminals; 0.65 mm pitch; 4.4 mm x 6.5 mm x 1.05 mm body TS-PDSO-G20(JEDEC) 2017-06-11
SOT361-1 TSSOP28 plastic thin shrink small outline package; 28 leads; body width 4.4 mm MO-153(JEDEC) 2003-02-19
SOT361-2 TSSOP28 TSSOP28, plastic, thin shrink small outline package; 28 terminals; 0.65 mm pitch; 4.4 mm x 9.7 mm x 0.95 mm body TS-PDSO-G28(JEDEC) 2017-06-11
SOT362-1 TSSOP48 plastic, thin shrink small outline package; 48 leads; 0.5 mm pitch; 12.8 mm x 6.1 mm x 1.2 mm body MO-153(JEDEC) 2003-02-19
SOT363 TSSOP6 plastic, surface-mounted package; 6 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body SC-88(EIAJ) 2006-03-16
SOT364-1 TSSOP56 plastic, thin shrink small outline package; 56 leads; 0.5 mm pitch; 14 mm x 6.1 mm x 1.2 mm body MO-153(JEDEC) 2003-02-19
SOT369-1 SSOP16 plastic shrink small outline package; 16 leads; body width 4.4 mm MO-152(JEDEC) 2003-02-19
SOT370-1 SSOP48 plastic, shrink small outline package; 48 leads; 0.635 mm pitch; 15.9 mm x 7.5 mm x 2.8 mm body MO-118(JEDEC) 2003-02-19
SOT371-1 SSOP56 plastic, shrink small outline package; 56 leads; 0.635 mm pitch; 18.45 mm x 7.5 mm x 2.8 mm body MO-118(JEDEC) 2003-02-18
SOT375-1 TQFP80 plastic thin quad flat package; 80 leads; body 12 x 12 x 1 mm MS-026(JEDEC) 2003-02-25
SOT376-1 TQFP44 plastic thin quad flat package; 44 leads; body 10 x 10 x 1.0 mm MS-026(JEDEC);137E08(IEC) 2002-03-14
SOT379-1 QFP52 plastic quad flat package; 52 leads (lead length 1.6 mm); body 10 x 10 x 2 mm MS-022(JEDEC);135E04(IEC) 2003-02-25
SOT379-2 QFP52 plastic, quad flat package; 52 leads; 0.65 mm pitch; 10 mm x 10 mm x 2 mm body MS-022(JEDEC) 2003-02-25
SOT38-1 DIP16 plastic dual in-line package; 16 leads (300 mil); long body SC-503-16(EIAJ);MO-001(JEDEC);050G09(IEC) 2003-02-13
SOT38-10 DIP16 DIP16, plastic, dual in-line package; 16 terminals; 2.54 mm pitch; 6.6 mm x 19.18 mm x 4.44 mm body E-PDIP-T16(JEDEC) 2017-06-11
SOT38-4 DIP16 plastic, dual in-line package; 16 leads; 2.54 mm pitch; 19 mm x 6.35 mm x 4.2 mm body 2003-02-13
SOT380-1 PLCC20 plastic, leaded chip carrier; 20 leads; 1.27 mm pitch; 9 mm x 9 mm x 4.5 mm body EDR-7319(EIAJ);MS-018(JEDEC);112E04(IEC) 2001-11-20
SOT385-1 PLLMC plastic leadless module carrier 2003-09-23
SOT386-1 TQFP100 plastic thin quad flat package; 100 leads; body 14 x 14 x 1 mm MS-026(JEDEC);137E20(IEC) 2003-02-25
SOT387-3 SQFP128 plastic shrink quad flat package;128 leads (lead length 1.6 mm); body 14 x 20 x 2.72 mm 2003-02-25
SOT389-1 LQFP44 plastic low profile quad flat package; 44 leads; body 10 x 10 x 1.4 mm MS-026(JEDEC);136E08(IEC) 2002-06-07
SOT389-2 LQFP44 LQFP44, plastic, low profile quad flat package; 44 terminals; 0.8 mm pitch; 10 mm x 10 mm x 1.4 mm body L-PQFP-G44(JEDEC) 2017-06-11
SOT390B CDFM2 flanged ceramic package; 2 mounting holes; 2 leads (EIAJ);(JEDEC);IEC 2010-11-08
SOT391B CDFM2 flangeless ceramic package; 2 leads 1997-05-29
SOT393-1 QFP64 plastic, quad flat package; 64 leads; 0.8 mm pitch; 14 mm x 14 mm x 2.7 mm body MS-022(JEDEC);134E07(IEC) 2003-02-20
SOT397-1 HSOP20 plastic, heatsink small outline package; 20 leads, 1.27 mm pitch, 15.9 mm x 11.0 mm x 3.35 mm body 2003-07-23
SOT397-2 HSOP20 HSOP20, plastic, heatsink small outline package; 20 terminals; 1.27 mm pitch; 11 mm x 15.9 mm x 3.2 mm body 2017-03-24
SOT398-1 HDIP18 plastic heat-dissipating dual in-line package; 18 leads 2003-02-13
SOT399 TOP-3D plastic single-ended through-hole package; mountable to heatsink; 1 mounting hole; 3 in-line leads 1998-11-06
SOT400-1 SDIP56 plastic shrink dual in-line package; 56 leads (600 mil) 2003-02-13
SOT400-3 SDIP56 SDIP56, plastic, shrink dual in-line package; 56 terminals; 1.778 mm pitch; 13.97 mm x 52.08 mm x 5.08 mm body E-PDIP-T56(JEDEC) 2017-06-11
SOT401-1 LQFP32 plastic low profile quad flat package; 32 leads; body 5 x 5 x 1.4 mm MS-026(JEDEC);136E01(IEC) 2003-02-20
SOT401-2 LQFP32 LQFP32, plastic, low profile quad flat package; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 1.4 mm body FL-PQFP-G32(JEDEC) 2017-06-11
SOT402-1 TSSOP14 plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body MO-153(JEDEC) 2003-02-18
SOT403-1 TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm MO-153(JEDEC) 2003-02-18
SOT403-2 TSSOP16 TSSOP16, plastic, thin shrink small outline package; 16 terminals; 0.65 mm pitch; 4.4 mm x 5 mm x 1.05 mm body TS-PDSO-G14(JEDEC) 2017-06-11
SOT403-3 TSSOP16 TSSOP16, plastic, thin shrink small outline package; 16 terminals; 0.65 mm pitch; 4.4 mm x 5 mm x 1.05 mm body TS-PDSO-G16(JEDEC) 2017-06-11
SOT404 D2PAK plastic, single-ended surface-mounted package (D2PAK); 3 terminals (one lead cropped); 2.54 mm pitch; 11 mm x 10 mm x 4.3 mm body 2013-02-25
SOT404A D2PAK plastic, single-ended surface-mounted package (D2PAK); 3 leads; 2.54 mm pitch; 11 mm x 10 mm x 4.3 mm body 2013-03-12
SOT407-1 LQFP100 plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm MS-026(JEDEC);136E20(IEC) 2003-02-20
SOT407-2 LQFP100 LQFP100, plastic, low profile quad flat package; 100 terminals; 0.5 mm pitch; 14 mm x 14 mm x 1.4 mm body FL-PQFP-G100(JEDEC) 2017-06-11
SOT407-3 LQFP100 LQFP100, plastic, low profile quad flat package; 100 terminals; 0.5 mm pitch; 14 mm x 14 mm x 1.7 mm body FL-PQFP-G100(JEDEC) 2017-06-11
SOT409A1 CDIP8 ceramic surface mounted package; 8 leads 2001-03-01
SOT409B1 CDIP8 ceramic surface mounted package; 8 leads 1998-01-27
SOT411-1 DBS23P plastic DIL-bent-SIL power package; 23 leads (straight lead length 3.2 mm) 2002-04-24
SOT411-2 DBS23P plastic DIL-bent-SIL power package; 23 leads (lead length 12 mm) 2002-04-24
SOT414-1 LQFP64 plastic low profile quad flat package; 64 leads; body 7 x 7 x 1.4 mm MS-026(JEDEC);136E06(IEC) 2003-02-20
SOT416 SC-75 plastic, surface-mounted package; 3 leads; 1 mm pitch; 1.6 mm x 0.75 mm x 0.9 mm body SC-75(EIAJ) 2013-06-07
SOT418-2 HSOP20 plastic, heatsink small outline package; 20 leads; low stand-off height 2003-07-23
SOT418-3 HSOP20 plastic, heatsink small outline package; 20 leads; low stand-off height, 1.27 mm pitch, 15.9 mm x 11.0 mm x 3.35 mm body 2003-07-23
SOT418-4 HSOP20 plastic, heatsink small outline package; 20 leads; low stand-off height 2005-03-10
SOT420-1 LQFP128 plastic low profile quad flat package; 128 leads; body 14 x 14 x 1.4 mm MS-026(JEDEC) 2003-02-20
SOT420-2 LQFP128 LQFP128, plastic, low profile quad flat package; 128 terminals; 0.4 mm pitch; 14 mm x 14 mm x 1.4 mm body FL-PQFP-G128(JEDEC) 2017-06-11
SOT425-1 LQFP128 plastic low profile quad flat package; 128 leads; body 14 x 20 x 1.4 mm MS-026(JEDEC);136E28(IEC) 2003-02-20
SOT425-2 LQFP128 LQFP128, plastic, low profile quad flat package; 128 terminals; 0.5 mm pitch; 14 mm x 20 mm x 1.4 mm body FLR-PQFPG128(JEDEC) 2017-06-11
SOT426 D2PAK plastic, single-ended surface-mounted package (D2PAK); 5 leads; 1.7 mm pitch; 11 mm x 10 mm x 4.3 mm body 2006-03-16
SOT427 D2PAK-7 plastic, single-ended surface-mounted package (D2PAK-7); 7 leads; 1.27 mm pitch; 11 mm x 10 mm x 4.3 mm body 2006-03-16
SOT428 DPAK plastic, single-ended surface-mounted package (DPAK); 3 leads; 2.285 mm pitch; 6 mm x 6.6 mm x 2.3 mm body SC-63(EIAJ);TO-252(JEDEC) 2014-06-10
SOT429 TO-247 plastic, single-ended through-hole package; 3 leads; 5.45 mm pitch; 20.45 mm x 15.6 mm x 4.95 mm body TO-247(JEDEC) 2013-03-25
SOT431-1 HSQFP208 plastic thermal enhanced shrink quad flat package; 208 leads (lead length 1.3 mm); body 28 x 28 x 3.4 mm; high stand-off height; heatsink 2003-02-20
SOT435-1 LQFP160 plastic low profile quad flat package; 160 leads; body 24 x 24 x 1.4 mm 2003-02-20
SOT435-2 LQFP160 LQFP160, plastic, low profile quad flat package; 160 terminals; 0.5 mm pitch; 24 mm x 24 mm x 1.4 mm body FL-PQFP-G160(JEDEC) 2017-06-11
SOT441A CRDB4 studless ceramic package; 4 leads 1999-03-29
SOT442A CRPM4 studded ceramic package; 4 leads 1999-03-29
SOT445A CDFM2 flanged hermetic ceramic package; 2 mounting holes; 2 leads 1999-03-29
SOT449-1 SOJ40 plastic small outline package; 40 leads (J-bent); body width 10.16 mm MS-027(JEDEC) 2003-02-18
SOT449-2 SOJ40 plastic small outline package; 40 leads (J-bent); body width 10.16 mm MS-027(JEDEC) 2003-04-08
SOT453A SIP2 plastic single-ended multi-chip package; magnetized ferrite magnet (3.8 x 2 x 0.8 mm); 4 interconnections; 2 in-line leads 2000-08-31
SOT453B SIP2 plastic single-ended multi-chip package; magnetized ferrite magnet (8 x 8 x 4.5 mm); 4 interconnections; 2 in-line leads 2000-08-31
SOT453C SIP2 plastic single-ended multi-chip package; magnetized ferrite magnet (5.5 x 5.5 x 3 mm); 4 interconnections; 2 in-line leads 2000-08-31
SOT453E SIP2 Plastic single-ended multi-chip package; magnetized ferrite magnet (4.25 x 5.2 x 3 mm); 4 interconnections; 2 in-line leads 2013-11-26+01:00
SOT455-1 PLLMC6 palladium plated contact chip card module (super 35 mm tape format, 6-contact, transfer mould technology) (EIAJ);(JEDEC);IEC 2012-09-20
SOT455-5 PLLMC6 palladium plated contact chip card module (super 35 mm tape format, 6-contact, transfer mould technology) (EIAJ);(JEDEC);IEC 2012-09-20
SOT457 TSOP6 plastic, surface-mounted package (TSOP6); 6 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body SC-74(EIAJ) 2006-03-16
SOT459-1 LQFP208 plastic low profile quad flat package; 208 leads; body 28 x 28 x 1.4 mm MS-026(JEDEC);136E30(IEC) 2003-02-20
SOT459-2 LQFP208 LQFP208, plastic, low profile quad flat package; 208 terminals; 0.5 mm pitch; 28 mm x 28 mm x 1.4 mm body FL-PQFP-G208(JEDEC) 2017-06-11
SOT462-1 RDBS13P plastic rectangular-DIL-bent-SIL (reverse bent) power package; 13 leads 2003-03-12
SOT462-2 RDBS13P plastic rectangular-DIL-bent-SIL (reverse bent) power package; 13 leads, 1.7 mm pitch, 23.7 mm x 12 mm x 4.5 mm body 2003-03-12
SOT464-1 HSQFP240 plastic, heatsink shrink quad flat package; 240 leads; body 32 x 32 x 3.4 mm 1999-11-12
SOT464-2 HSQFP240 plastic thermal enhanced shrink quad flat package; 240 leads; body 32 x 32 x 3.4 mm; heatsink 2002-06-19
SOT467A CDFM2 flanged ceramic package; 2 mounting holes; 2 leads 1999-12-28
SOT470-1 HLQFP100 plastic thermal enhanced low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm; heatsink MS-026(JEDEC) 2003-02-20
SOT470-2 HLQFP100 plastic thermal enhanced low profile quad flat package; 100 leads; exposed die pad 2015-07-06
SOT470-4 HLQFP100 HLQFP100, plastic, thermal enhanced low profile quad flat package; 100 terminals; 0.5 mm pitch; 14 mm x 14 mm x 1.4 mm body NON JEDEC(JEDEC) 2017-06-11
SOT470-5 HLQFP100 plastic, thermal enhanced low profile quad flat package; 100 leads; body 14 mm x 14 mm x 1.6 mm; exposed die pad 2017-03-03
SOT471-1 BGA256 plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm MS-034(JEDEC);144E(IEC) 2003-01-22
SOT472-1 BGA156 plastic, ball grid array package; 156 balls; 1 mm pitch; 15 mm x 15 mm x 1.15 mm body MS-034(JEDEC);144E(IEC) 2003-01-22
SOT475-1 DBS17P plastic DIL-bent-SIL (special bent) power package; 17 leads (lead length 12 mm) 2003-03-12
SOT477A SIP3 plastic single-ended multi-chip package; magnetized ferrite magnet (3.8 x 2 x 0.8 mm); 4 interconnections; 3 in-line leads 2000-08-31
SOT477B SIP3 plastic single-ended multi-chip package; magnetized ferrite magnet (8 x 8 x 4.5 mm); 4 interconnections; 3 in-line leads 2000-08-31
SOT477C SIP3 plastic single-ended multi-chip package; magnetized ferrite magnet (5.5 x 5.5 x 3 mm); 4 interconnections; 3 in-line leads 2000-08-31
SOT477D SIP3 plastic single-ended multi-chip package; magnetized ferrite magnet (5.5 x 5.5 x 3 mm); 4 interconnections; 3 in-line leads 2003-06-11
SOT480-1 TSSOP48 plastic, thin shrink small outline package; 48 leads; 0.4 mm pitch; 9.7 mm x 4.4 mm x 0.9 mm body MO-153(JEDEC) 2003-02-18
SOT481-2 TSSOP56 plastic, thin shrink small outline package; 56 leads; 0.4 mm pitch; 11.3 mm x 4.4 mm x 1.2 mm body MO-194(JEDEC) 2001-11-24
SOT486-1 LQFP144 plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm MS-026(JEDEC);136E23(IEC) 2003-02-20
SOT486-2 LQFP144 LQFP144, plastic, low profile quad flat package; 144 terminals; 0.5 mm pitch; 20 mm x 20 mm x 1.4 mm body FL-PQFP-G144(JEDEC) 2017-06-11
SOT487-1 TSSOP32 plastic, thin shrink small outline package; 32 leads; 0.65 mm pitch; 11 mm x 6.1 mm x 0.9 mm body MO-153(JEDEC) 2003-02-18
SOT489-1 BGA292 plastic ball grid array package; 292 balls; body 27 x 27 x 1.75 mm MS-034(JEDEC);144E(IEC) 2003-01-22
SOT490 SC-89 plastic, surface-mounted package; 3 leads; 1 mm pitch; 1.6 mm x 0.85 mm x 0.7 mm body SC-89(EIAJ) 2006-03-16
SOT496-1 QFP80 plastic quad flat package; 80 leads (lead length 1.6 mm); body 14 x 14 x 2.7 mm ED-7311EE(EIAJ);MS-022(JEDEC);135E06(IEC) 2002-10-04
SOT500-1 PLLMC plastic leadless module carrier package; 35 mm wide tape 2013-01-16
SOT500-2 PLLMC plastic leadless module carrier package; 35 mm wide tape 2006-05-22
SOT500-3 PLLMC plastic leadless module carrier package; 35 mm wide tape 2007-10-18
SOT500-4 PLLMC plastic leadless module carrier package; 35 mm wide tape 2011-02-18
SOT500-5 PLLMC PLLMC, plastic leadless module carrier package; 35 mm wide tape 2017-08-17
SOT505-1 TSSOP8 plastic, thin shrink small outline package; 8 leads; 0.65 mm pitch; 3 mm x 3 mm x 1.1 mm body 2003-02-18
SOT505-2 TSSOP plastic, thin shrink small outline package; 8 leads; 0.65 mm pitch; 3 mm x 3 mm x 1.1 mm body 2002-01-16
SOT506-1 LQFP176 plastic low profile quad flat package; 176 leads; body 24 x 24 x 1.4 mm MS-026(JEDEC);136E25(IEC) 2003-02-20
SOT506-2 LQFP176 LQFP176, plastic, low profile quad flat package; 176 terminals; 0.5 mm pitch; 24 mm x 24 mm x 1.4 mm body FL-PQFP-G176(JEDEC) 2017-06-11
SOT509-2 HLBGA304 plastic thermal enhanced low profile ball grid array package; 304 balls; body 31 x 31 x 0.9 mm; heatsink MO-149(JEDEC) 2005-09-01
SOT510-1 TSSOP38 plastic, thin shrink small outline package; 38 leads; 0.5 mm pitch; 9.7 mm x 4.4 mm x 1.1 mm body MO-153(JEDEC) 2005-11-02
SOT513-1 HTQFP80 plastic thermal enhanced thin quad flat package; 80 leads; body 14 x 14 x 1 mm; heatsink 2003-02-20
SOT513-2 HTQFP80 HTQFP80, plastic, thermal enhanced thin quad flat package; 80 terminals; 0.65 mm pitch; 14 mm x 14 mm x 1 mm body TS-PQFP-G80(JEDEC) 2017-06-11
SOT517-1 SMS13P plastic surface mounted single in-line power package; 13 leads 2003-03-12
SOT519-1 SSOP16 plastic, shrink small outline package; 16 leads; 0.635 mm pitch; 4.9 mm x 3.9 mm x 1.73 mm body 2003-02-18
SOT521-1 DBS27P plastic DIL-bent-SIL power package; 27 leads (lead length 7.7 mm) 2002-04-24
SOT523-1 DBS9P plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad 2003-03-12
SOT524-1 DBS7P plastic DIL-bent-SIL power package; 7 leads (lead length 12/11 mm); exposed die pad 2003-03-12
SOT527-1 HTSSOP20 plastic thermal enhanced thin shrink small outline package; 20 leads; body width 4.4 mm; exposed die pad MO-153(JEDEC) 2005-11-02
SOT527-2 HTSSOP20 TSSOP20EP4.4*6.5*1.1P.65 2017-06-11
SOT528-1 RDBS13P plastic rectangular-DIL-bent-SIL power package; 13 leads 2003-03-12
SOT528-2 RDBS13P plastic rectangular-DIL-bent-SIL power package; 13 leads 2003-03-12
SOT530-1 TSSOP8 plastic, thin shrink small outline package; 8 terminals; 0.65 mm pitch; 3 mm x 4.4 mm x 1.1 mm body MO-153(JEDEC) 2003-02-18
SOT531-1 BGA316 plastic ball grid array package; 316 balls; body 27 x 27 x 1.75 mm MS-034(JEDEC);144E(IEC) 2003-01-22
SOT532-1 BGA388 plastic, ball grid array package; 388 balls; 1.27 mm pitch; 35 mm x 35 mm x 1.75 mm body MS-034(JEDEC);144E(IEC) 2003-01-23
SOT532-2 BGA388 plastic ball grid array package; 388 balls; body 35 x 35 x 1.75 mm MS-034(JEDEC);144E(IEC) 2006-08-24
SOT533 IPAK plastic, single-ended package (IPAK); 3 leads; 2.285 mm pitch; 6 mm x 6.6 mm x 2.3 mm body TO-251(JEDEC) 2006-02-14
SOT533A IPAK plastic single-ended package (IPAK); 3 short leads (in line) TO-251(JEDEC) 2008-08-07
SOT534-1 LFBGA64 plastic low profile fine-pitch ball grid array package; 64 balls; body 8 x 8 x 1.05 mm 2003-02-05
SOT536-1 LFBGA96 plastic, low profile fine-pitch ball grid array package; 96 balls; 0.8 mm pitch; 13.5 mm x 5.5 mm x 1.5 mm body 2003-02-05
SOT537-1 LFBGA114 plastic, low profile fine-pitch ball grid array package; 114 balls; 0.8 mm pitch; 16 mm x 5.5 mm x 1.5 mm body 2003-02-05
SOT54 TO-92 plastic, single-ended leaded (through hole) package; 3 leads; 2.54 mm pitch; 4.6 mm x 3.9 mm x 5.1 mm body SC-43A(EIAJ);TO-92(JEDEC) 2004-11-16
SOT542-1 TFBGA56 plastic thin fine-pitch ball grid array package; 56 balls; body 6 x 6 x 0.8 mm MO-195(JEDEC) 2002-06-10
SOT543-1 TFBGA64 plastic thin fine-pitch ball grid array package; 64 balls; body 6 x 6 x 0.8 mm MO-195(JEDEC) 2002-04-09
SOT545-1 HTQFP48 plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad MS-026(JEDEC) 2004-01-29
SOT545-2 HTQFP48 plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad MS-026(JEDEC) 2004-01-29
SOT545-3 HTQFP48 plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad MS-026(JEDEC) 2004-02-05
SOT546-2 HBGA352 plastic, heatsink ball grid array package; 352 balls; body 35 x 35 x 0.9 mm 2000-03-04
SOT549-1 HTSSOP32 plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad MO-153(JEDEC) 2005-11-02
SOT549-3 HTSSOP32 plastic thermal enhanced thin shrink small outline package; 32 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad MO-153(JEDEC) 2005-11-02
SOT54A PBCYT3 plastic single-ended leaded (through hole) package; 3 leads (wide pitch) 2004-06-28
SOT54V PBCYT3 plastic single-ended leaded (through hole) package; 3 leads (on-circle) 2005-01-10
SOT550-1 BGA304 plastic ball grid array package; 304 balls; body 31 x 31 x 1.75 mm MS-034(JEDEC);144E(IEC) 2003-01-23
SOT550-2 BGA304 plastic ball grid array package; 304 balls; body 31 x 31 x 1.75 mm MS-034(JEDEC) 2004-07-28
SOT552-1 TSSOP10 plastic, thin shrink small outline package; 10 leads; 0.5 mm pitch; 3 mm x 3 mm x 1.1 mm body 2003-02-18
SOT553-1 HBGA292 plastic thermal enhanced ball grid array package; 292 balls; body 27 x 27 x 1.75 mm; heatsink MS-034(JEDEC);144E(IEC) 2002-02-27
SOT555-4 PGA206 PGA206, plastic, pin grid array package, 206 pins, 2.54 mm pitch, 47.2 mm x 47.2 mm x 3.2 mm body 2017-06-11
SOT556-1 SSOP24 plastic, shrink small outline package; 24 leads; 0.635 mm pitch; 8.7 mm x 3.9 mm x 1.47 mm body MO-137(JEDEC) 2003-02-18
SOT559A QMAN16 leadless surface mounted package; plastic cap; 16 terminations 2006-03-16
SOT560-1 HBCC32 plastic thermal enhanced bottom chip carrier; 32 terminals; body 5 x 5 x 0.65 mm MO-217(JEDEC) 2003-03-12
SOT564-1 HBCC24 plastic thermal enhanced bottom chip carrier; 24 terminals; body 4 x 4 x 0.65 mm MO-217(JEDEC) 2003-03-12
SOT566-1 HSOP24 plastic, heatsink small outline package; 24 leads 2003-07-23
SOT566-2 HSOP24 plastic, heatsink small outline package; 24 leads; low stand-off height 2003-07-23
SOT566-3 HSOP24 plastic, heatsink small outline package; 24 leads; low stand-off height, 1.0 mm pitch, 15.9 mm x 11.0 mm x 3.35 mm body 2003-07-23
SOT567A DMAN8 leadless surface mounted package; plastic cap; 8 terminations 2006-03-16
SOT569-1 TFBGA144 plastic thin fine-pitch ball grid array package; 144 balls; body 12 x 12 x 0.8 mm MO-216(JEDEC) 2005-09-14
SOT569-2 TFBGA144 plastic thin fine-pitch ball grid array package; 144 balls 2008-03-14
SOT570-1 TFBGA180 plastic thin fine-pitch ball grid array package; 180 balls MO-216(JEDEC) 2003-07-09
SOT570-2 TFBGA180 plastic thin fine-pitch ball grid array package; 180 balls 2006-03-14
SOT570-3 TFBGA180 thin fine-pitch ball grid array package; 180 balls 2010-04-15
SOT572-1 LQFP100 plastic low profile quad flat package; 100 leads; body 12 x 12 x 1.4 mm MS-026(JEDEC) 2003-02-20
SOT573-1 QFP144 plastic quad flat package; 144 leads (lead length 1.6 mm); body 28 x 28 x 3.4 mm MS-022(JEDEC) 2003-02-20
SOT573-2 QFP144 QFP144, plastic, quad flat package; 144 terminals; 0.65 mm pitch; 28 mm x 28 mm x 4.1 mm body PQFP-G144(JEDEC) 2017-06-11
SOT574-1 TQFP128 plastic thin quad flat package; 128 leads; body 14 x 14 x 1 mm 2003-02-20
SOT576-1 HQFP160 plastic thermal enhanced quad flat package;160 leads (lead length 1.6 mm); body 28 x 28 x 3.4 mm; high stand-off height; heatsink 2003-02-20
SOT577-2 RDBS17P plastic rectangular-DIL-bent-SIL power package; 17 leads (row spacing 2.54 mm) 2003-03-12
SOT578-1 TBS13P plastic Triple-bent-SIL power package; 13 leads (lead length 7.7 mm) 2003-03-12
SOT579-1 BGA272 plastic ball grid array package; 272 balls; body 27 x 27 x 1.55 mm MS-034(JEDEC);144E(IEC) 2004-09-28
SOT581-1 BGA352 plastic, ball grid array package; 352 balls; 1.27 mm pitch; 35 mm x 35 mm x 1.75 mm body ED-7311-9A(EIAJ);MS-034(JEDEC);144E(IEC) 2003-01-23
SOT584-1 BGA456 plastic ball grid array package; 456 balls; body 35 x 35 x 1.75 mm MS-034(JEDEC);144E(IEC) 2007-06-26
SOT587-1 BGA596 plastic ball grid array package; 596 balls; body 40 x 40 x 1.75 mm MS-034(JEDEC);144E(IEC) 2003-01-23
SOT588-1 BGA656 plastic ball grid array package; 656 balls; body 40 x 40 x 1.75 mm MS-034(JEDEC);144E(IEC) 2003-01-24
SOT589-1 BGA553 plastic, ball grid array package; 553 balls; 1.27 mm pitch; 37.5 mm x 37.5 mm x 1.75 mm body MS-034(JEDEC);144E(IEC) 2005-11-25
SOT594-1 CWQCCN32 Ceramic window quad chip carrier; no leads; 32 terminals;body 10.67 x 10.67 x 2.23 mm MS-009(JEDEC) 2003-03-12
SOT595-1 BGA208 plastic ball grid array package; 208 balls; body 17 x 17 x 1.2 mm MS-034(JEDEC);144E(IEC) 2003-01-24
SOT597-1 TFBGA96 plastic, thin fine-pitch ball grid array package; 96 balls; 0.5 mm pitch; 8 mm x 8 mm x 0.8 mm body MO-195(JEDEC) 2003-03-03
SOT598-1 TFBGA100 plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.8 mm MO-216(JEDEC) 2003-03-03
SOT599-1 TFBGA132 plastic thin fine-pitch ball grid array package; 132 balls; body 12 x 12 x 0.8 mm MO-216(JEDEC) 2003-07-09
SOT599-2 TFBGA132 plastic, thin fine-pitch ball grid array package; 132 balls; 0.8 mm pitch; 12 mm x 12 mm x 0.8 mm body 2006-01-09
SOT600-1 TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body 15 x 15 x 0.8 mm MO-216(JEDEC) 2003-07-09
SOT601-1 TFBGA280 plastic thin fine-pitch ball grid array package; 280 balls; body 16 x 16 x 0.8 mm MO-216(JEDEC) 2003-07-09
SOT602-1 HBGA256 plastic thermal enhanced ball grid array package; 256 balls; body 27 x 27 x 0.9 mm; heatsink MS-034(JEDEC);144E(IEC) 2003-03-17
SOT603-1 HBGA420 plastic thermal enhanced ball grid array package; 420 balls; body 35 x 35 x 0.9 mm; heatsink MS-034(JEDEC);144E(IEC) 2003-03-17
SOT604-1 HBGA504 plastic, thermal enhanced ball grid array package; 504 balls; 1.27 mm pitch; 35 mm x 35 mm x 0.9 mm body MS-034(JEDEC);144E(IEC) 2003-03-17
SOT605-1 HBGA600 plastic, thermal enhanced ball grid array package; 600 balls; 1.27 mm pitch; 40 mm x 40 mm x 0.9 mm body MS-034(JEDEC);144E(IEC) 2003-03-17
SOT607-1 TSSOP30 plastic thin shrink small outline package; 30 leads; body width 4.4 mm; lead pitch 0.5 mm MO-153(JEDEC) 2003-02-18
SOT610-1 HBGA456 plastic thermal enhanced ball grid array package; 456 balls; body 35 x 35 x 1.8 mm; heatsink MS-034(JEDEC);144E(IEC) 2009-08-14
SOT611-1 BGA329 plastic, ball grid array package; 329 balls; 1.27 mm pitch; 31 mm x 31 mm x 1.75 mm body MS-034(JEDEC);144E(IEC) 2003-01-24
SOT611-2 BGA329 plastic ball grid array package; 329 balls; body 31 x 31 x 1.75 mm MS-034(JEDEC);144E(IEC) 2003-01-30
SOT612-2 HLQFP144 plastic thermal enhanced low profile quad flat package; 144 leads; body 20 mm x 20 mm x 1.4 mm; exposed die pad MS-026(JEDEC) 2004-07-05
SOT612-3 HLQFP144 plastic thermal enhanced low profile quad flat package; 144 leads; body 20 mm x 20 mm x 1.4 mm; exposed die pad MS-026(JEDEC) 2004-07-05
SOT612-4 HLQFP144 plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad MS-026(JEDEC) 2008-01-18
SOT612-5 HLQFP144 plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad MS-026(JEDEC) 2008-11-21
SOT612-6 HLQFP144 plastic thermal enhanced low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm; exposed die pad MS-026(JEDEC) 2010-02-25
SOT612-7 HLQFP144 plastic thermal enhanced low profile quad flat package; 144 leads ---(EIAJ);MS-026(JEDEC);---(IEC) 2011-11-28
SOT616-1 HVQFN24 plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.85 mm MO-220(JEDEC) 2002-10-22
SOT616-3 HVQFN24 plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.85 mm MO-220(JEDEC) 2005-03-10
SOT616-4 HVQFN24 plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.85 mm ---(EIAJ);MO-220(JEDEC);---(IEC) 2008-03-06
SOT616-5 HVQFN24 QFN 24 EP 4SQ*1.0P0.5 2017-06-11
SOT616-6 HVQFN24 HVQFN24, plastic, thermal enhanced very thin quad flatpack; no leads; 24 terminals; 0.5 mm pitch; 4 mm x 4 mm x 0.85 mm body NON-JEDEC(JEDEC) 2017-06-11
SOT616-7 HVQFN24 HVQFN24, plastic, thermal enhanced very thin quad flatpack; no leads; 24 terminals; 0.5 mm pitch; 4 mm x 4 mm x 0.85 mm body 2017-06-11
SOT616-8 HVQFN24 HVQFN24, plastic, thermally enhanced very thin quad; flat non-leaded package; 24 terminals; 0.5 mm pitch; 4 mm x 4 mm x 1.0 mm body 2017-03-22
SOT617-1 HVQFN32 DFN5050-32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm MO-220(JEDEC) 2002-10-18
SOT617-11 HVQFN32 DFN5050-32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals MO-220(JEDEC) 2013-01-29
SOT617-12 HVQFN32 plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm MO-220(JEDEC) 2013-11-05
SOT617-13 HVQFN plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm 2015-01-12
SOT617-14 HVQFN32 HVQFN32, plastic, thermal enhanced very thin quad flatpack; no leads; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 1 mm body HTS-PQFP-N32(JEDEC) 2017-06-11
SOT617-15 HVQFN32 HVQFN32, plastic, thermal enhanced very thin quad flatpack; no leads; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 1 mm body 2017-06-11
SOT617-16 HVQFN32 HVQFN32, plastic, thermal enhanced very thin quad flatpack; no leads; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 1 mm body TS-PQFP-N32(JEDEC) 2017-06-11
SOT617-17 HVQFN32 plastic, thermally enhanced very thin quad; flat non-leaded package; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 0.9 mm body 2016-07-04
SOT617-18 HVQFN32 HVQFN32, plastic, thermal enhanced very thin quad flatpack; no leads; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 0.85 mm body 2017-06-11
SOT617-19 HVQFN32 HVQFN32, plastic, thermally enhanced very thin quad; flat non-leaded package; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 0.85 mm body 2017-03-24
SOT617-2 HVQFN32 DFN5050-32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm MO-220(JEDEC) 2003-05-02
SOT617-20 HVQFN32 HVQFN32, plastic, thermal enhanced very thin quad flatpack; no leads; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 1 mm body HF-PQFN-N32(JEDEC) 2017-06-11
SOT617-21 HVQFN32 HVQFN32, plastic, thermal enhanced very thin quad flatpack; no leads; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 1 mm body HTS-PQFP-N32(JEDEC) 2017-06-11
SOT617-3 HVQFN32 plastic, thermal enhanced very thin quad flat package; 32 terminals; 0.5 mm pitch; 5 mm x 5 mm x 0.85 mm body MO-220(JEDEC) 2002-10-22
SOT617-5 HVQFN32 DFN5050-32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm MO-220(JEDEC) 2008-03-12
SOT617-7 HVQFN32 DFN5050-32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals - - -(EIAJ);- - -(JEDEC) 2010-02-09
SOT617-9 HVQFN32 DFN5050-32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals MO-220(JEDEC) 2012-07-02
SOT618-1 HVQFN40 plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm MO-220(JEDEC) 2002-10-22
SOT618-10 HVQFN40 HVQFN40, plastic, thermal enhanced very thin quad flatpack; no leads; 40 terminals; 0.5 mm pitch; 6 mm x 6 mm x 0.9 mm body HTS-PQFP-N40(JEDEC) 2017-06-11
SOT618-12 HVQFN40 HVQFN40, plastic, thermal enhanced very thin quad flatpack; no leads; 40 terminals; 0.5 mm pitch; 6 mm x 6 mm x 0.85 mm body NON-JEDEC(JEDEC) 2017-06-11
SOT618-13 HVQFN40 HVQFN40, plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; 0.5 mm pitch, 6 mm x 6 mm x 0.85 mm body 2018-10-05
SOT618-13(DD) HVQFN40 HVQFN40, plastic thermal enhanced very thin quad flat package; no leads, wettable flanks; 40 terminals; 0.5 mm pitch, 6 mm x 6 mm x 0.85 mm body 2018-10-05
SOT618-14 HVQFN40 HVQFN40, plastic thermal enhanced very thin quad flatpack; no leads, 40 terminals, 0.5 mm pitch, 6 mm x 6 mm x 0.85 mm body 2017-10-11
SOT618-2 HVQFN40 plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm MO-220(JEDEC) 2003-04-22
SOT618-3 HVQFN40 plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm MO-220(JEDEC) 2004-04-08
SOT618-4 HVQFN40 plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm MO-220(JEDEC) 2005-10-06
SOT618-5 HVQFN40 plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm ---(EIAJ);MO-220(JEDEC);---(IEC) 2008-06-27
SOT618-6 HVQFN40 plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm MO-220(JEDEC) 2009-03-04
SOT618-7 HVQFN40 plastic thermal enhanced very thin quad flat package; no leads; 40 terminals MO-220(JEDEC) 2010-11-05
SOT618-8 HVQFN40 plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; 0.5 mm pitch; 6 mm x 6 mm x 0.85 mm body 2017-03-17
SOT618-9 HVQFN40 HVQFN40, plastic, thermal enhanced very thin quad flatpack; no leads; 40 terminals; 0.5 mm pitch; 6 mm x 6 mm x 0.9 mm body 2017-06-11
SOT619-1 HVQFN48 plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm MO-220(JEDEC) 2012-11-22
SOT619-10 HVQFN48 plastic thermal enhanced very thin quad flat package; no leads; 48 terminals - - -(EIAJ);MO-220(JEDEC);- - -(IEC) 2009-12-11
SOT619-11 HVQFN48 plastic thermal enhanced very thin quad flat package; no leads; 48 terminals MO-220(JEDEC) 2009-12-11
SOT619-13 HVQFN48 plastic thermal enhanced very thin quad flat package; no leads; 48 terminals MO-220(JEDEC) 2013-03-27
SOT619-14 HVQFN48 HVQFN48, plastic, thermal enhanced very thin quad flatpack; no leads; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1 mm body MO-220 VKKD-2(JEDEC) 2016-02-02
SOT619-15 HVQFN48 QFN 48 EP 7SQ*1.0 P0.5 S 2017-06-11
SOT619-16 HVQFN48 HVQFN48, plastic, thermal enhanced very thin quad flatpack; no leads; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 0.85 mm body NON-JEDEC(JEDEC) 2017-06-11
SOT619-17 HVQFN48 HVQFN48, plastic, thermal enhanced very thin quad flatpack; no leads; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 0.85 mm body NON-JEDEC(JEDEC) 2017-06-11
SOT619-17(D) HVQFN48 plastic thermal enhanced very thin quad flat package; no leads; 0.1 dimple wettable flank, 48 terminals; 7 mm x 7 mm x 0.85 mm body 2018-09-28
SOT619-18 HVQFN plastic, thermally enhanced very thin quad; flat non-leaded package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 0.85 mm body 2016-07-22
SOT619-19 HVQFN48 HVQFN48, plastic, thermal enhanced very thin quad flatpack; no leads; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 0.85 mm body NON-JEDEC(JEDEC) 2017-06-11
SOT619-2 HVQFN48 plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm MO-220(JEDEC) 2002-10-22
SOT619-20 HVQFN48 HVQFN48, plastic, thermal enhanced very thin quad flatpack; no leads; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 1 mm body HF-PQFN-N48(JEDEC) 2017-06-11
SOT619-21 HVQFN48 HVQFN48, plastic, thermal enhanced very thin quad flatpack; no leads; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 0.85 mm body 2017-06-11
SOT619-22 HVQFN48 plastic, thermally enhanced very thin quad; flat non-leaded package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 0.9 mm body 2016-07-13
SOT619-23 HVQFN48 HVQFN48, plastic,thermal enhanced very thin quad flat package; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 0.85 mm body 2017-03-27
SOT619-24 HVQFN48 HVQFN48, plastic, thermal enhanced very thin quad flatpack; no leads; 48 terminals; 0.5 mm pitch; 7 mm x 7 mm x 0.85 mm body 2017-06-11
SOT619-25(D) HVQFN48 plastic thermal enhanced very thin quad flat package; no leads; 0.1 dimple wettable flank, 48 terminals; 7 mm x 7 mm x 0.9 mm body 2018-02-28
SOT619-3 HVQFN48 plastic, heatsink very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.9 mm MO-220(JEDEC) 2001-09-07
SOT619-4 HVQFN48 plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm MO-220(JEDEC) 2002-09-30
SOT619-5 HVQFN48 plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.9 mm MO-220(JEDEC) 2005-06-10
SOT619-6 HVQFN48 plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm MO-220(JEDEC) 2005-06-16
SOT619-7 HVQFN48 plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm MO-220(JEDEC) 2005-10-25
SOT619-8 HVQFN48 plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm MO-220(JEDEC) 2007-01-30
SOT619-9 HVQFN48 plastic thermal enhanced very thin quad flat package; no leads; 48 terminals; body 7 x 7 x 0.85 mm - - -(EIAJ);MO-220(JEDEC);- - -(IEC) 2008-11-13
SOT622-1 LFBGA180 plastic low profile fine-pitch ball grid array package; 180 balls; body 12 x 12 x 1.05 mm MO-205(JEDEC) 2002-02-13
SOT623-1 BGA658 plastic ball grid array package; 658 balls; body 40 x 40 x 1.75 mm MS-034(JEDEC);144E(IEC) 2003-01-24
SOT624-1 HBGA1312 plastic thermal enhanced ball grid array package; 1312 balls; body 40 x 40 x 1.65 mm; heatsink MS-034(JEDEC);144E(IEC) 2003-01-14
SOT627-1 TFBGA81 plastic thin fine-pitch ball grid array package; 81 balls; body 8 x 8 x 0.8 mm MO-216(JEDEC) 2002-02-15
SOT629-1 HVQFN16 plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 4 x 4 x 0.85 mm MO-220(JEDEC) 2002-10-22
SOT630-1 TFBGA112 plastic thin fine-pitch ball grid array package; 112 balls; body 7 x 7 x 0.8 mm 2006-04-27
SOT630-2 TFBGA112 plastic thin fine-pitch ball grid array package; 112 balls; body 7 x 7 x 0.7 mm MO-195(JEDEC) 2006-04-27
SOT631-1 LFBGA208 plastic low profile fine-pitch ball grid array package; 208 balls; body 15 x 15 x 1.25 mm MO-205(JEDEC) 2002-08-19
SOT631-2 LFBGA208 plastic low profile fine-pitch ball grid array package; 208 balls; body 15 x 15 x 1.05 mm MO-205(JEDEC) 2002-08-14
SOT631-3 LFBGA208 plastic low profile fine-pitch ball grid array package; 208 balls; body 15 x 15 x 1.05 mm MO-205(JEDEC) 2003-10-20
SOT631-4 LFBGA208 plastic low profile fine-pitch ball grid array package; 208 balls; body 15 x 15 x 1 mm MO-205(JEDEC) 2007-03-19
SOT632A QMAN12 leadless surface mounted package; plastic cap; 12 terminations 2006-03-16
SOT633-3 HTSSOP38 plastic thermal enhanced thin shrink small outline package; 38 leads; body width 6.1 mm; lead pitch 0.65 mm; exposed die pad 2004-01-22
SOT635-1 HBGA596 plastic thermal enhanced ball grid array package; 596 balls; body 40 x 40 x 1.75 mm; heatsink MS-034(JEDEC);144E(IEC) 2003-01-14
SOT636-1 HBGA388 plastic, heatsink ball grid array package; 388 balls; 1.27 mm pitch; 35 mm x 35 mm x 1.75 mm body MS-034(JEDEC);144E(IEC) 2001-12-11
SOT637 SIP5 plastic single-ended multi-chip package; 6 interconnections; 5 in-line leads 2004-12-10
SOT638-1 HTQFP100 plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad MS-026(JEDEC) 2005-02-02
SOT638-2 HTQFP100 plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad MS-026(JEDEC) 2005-02-02
SOT638-3 HTQFP100 plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad MS-026(JEDEC) 2008-04-08
SOT638-4 HTQFP100 plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad MS-026(JEDEC) 2008-11-12
SOT638-5 HTQFP100 plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad MS-026(JEDEC) 2008-11-12
SOT638-6 HTQFP100 plastic thermal enhanced thin quad flat package; 100 leads; exposed diepad - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2009-09-01
SOT638-7 HTQFP100 HTQFP100, plastic, thermal enhanced thin quad flat package; 100 terminals; 0.5 mm pitch; 14 mm x 14 mm x 1 mm body TS-PQFP-G100(JEDEC) 2017-06-11
SOT638-8 HTQFP100 HTQFP100, plastic, thermal enhanced thin quad flat package; 100 terminals; 0.5 mm pitch; 14 mm x 14 mm x 1 mm body TS-PQFP-G100(JEDEC) 2017-06-11
SOT639-2 HBCC16 plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 x 3 x 0.65 mm MO-217(JEDEC) 2003-03-12
SOT640-1 TFBGA180 plastic thin fine-pitch ball grid array package; 180 balls; body 10 x 10 x 0.8 mm MO-195(JEDEC) 2003-03-03
SOT643-1 LFBGA81 plastic low profile fine-pitch ball grid array package; 81 balls; body 9 x 9 x 1.05 mm MO-205(JEDEC) 2002-03-28
SOT644-1 LFBGA144 plastic low profile fine-pitch ball grid array package; 144 balls; body 12 x 12 x 0.9 mm MO-205(JEDEC) 2003-02-05
SOT646-1 TSSOP64 plastic, thin shrink small outline package; 64 leads; 0.5 mm pitch; 17 mm x 6.1 mm x 1.2 mm body MO-153(JEDEC) 2003-02-18
SOT647-1 TSSOP80 plastic thin shrink small outline package; 80 leads; body width 6.1 mm MO-153(JEDEC) 2003-02-18
SOT648-1 BGA225 plastic ball grid array package; 225 balls; body 27 x 27 x 1.55 mm ED-7311-9A(EIAJ);MS-034(JEDEC);144E(IEC) 2003-01-24
SOT649A QMAN22 leadless surface mounted package; plastic cap; 22 terminations 2006-03-16
SOT650-1 HVSON10 plastic thermal enhanced very thin small outline package; no leads; 10 terminals; body 3 mm x 3 mm x 0.85 mm MO-229(JEDEC) 2002-02-08
SOT650-2 HVSON10 plastic thermal enhanced very thin small outline package; no leads; 10 terminals; 3 x 3 x 0.85 mm - - -(EIAJ);MO-229(JEDEC);- - -(IEC) 2009-03-18
SOT651-1 BGA956 plastic ball grid array package; 956 balls; body 40 x 40 x 1.75 mm MS-034(JEDEC);144E(IEC) 2003-01-24
SOT652-1 BGA760 plastic ball grid array package; 760 balls; body 40 x 40 x 1.75 mm MS-034(JEDEC);144E(IEC) 2003-01-24
SOT655-1 TFBGA228 plastic thin fine-pitch ball grid array package; 228 balls; body 12 x 12 x 0.8 mm MO-195(JEDEC) 2002-02-08
SOT658-1 PLLMC8 palladium plated contact chip card module (super 35 mm tape format, 8-contact) 2012-09-14
SOT658-3 PLLMC8 dual interface chip card module (Plug-in type; super 35 mm tape format, 8-contact) 2012-09-14
SOT658-6 PLLMC8 dual interface chip card module (Plug-in type; super 35 mm tape format, 8-contact) 2012-09-14
SOT658-7 PLLMC8 dual interface chip card module (Plug-in type; super 35 mm tape format, 8-contact) 2012-09-14
SOT662-1 HVQFN20 plastic thermal enhanced very thin quad flat package; no leads; 20 terminals; body 5 x 5 x 0.85 mm MO-220(JEDEC) 2002-10-22
SOT663 SOT663 plastic, surface-mounted package; 3 leads; 1 mm pitch; 1.6 mm x 1.2 mm x 0.55 mm body 2006-03-16
SOT665 SOT665 plastic, surface-mounted package; 5 leads; 1 mm pitch; 1.6 mm x 1.2 mm x 0.55 mm body 2006-03-16
SOT666 SOT666 plastic, surface-mounted package; 6 leads; 1 mm pitch; 1.6 mm x 1.2 mm x 0.55 mm body 2006-03-16
SOT668-2 RDBS17P plastic rectangular-DIL-bent-SIL (reverse bent) power package; 17 leads (row spacing 2.54 mm) 2003-03-12
SOT669 LFPAK56; Power-SO8 plastic, single-ended surface-mounted package; 4 terminals; 4.9 mm x 4.45 mm x 1 mm body MO-235(JEDEC) 2013-02-27
SOT680-1 SO5 plastic small outline package; 5 leads; body width 1.6 mm MO-178(JEDEC) 2001-11-15
SOT683-1 HBGA960 plastic thermal enhanced ball grid array package; 960 balls; body 33 x 33 x 2.4 mm; heatsink MS-034(JEDEC) 2002-05-01
SOT684-1 HVQFN56 plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm MO-220(JEDEC) 2002-10-22
SOT684-10 HVQFN56 plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; - - -(EIAJ);- - -(JEDEC) 2014-05-12
SOT684-13 HVQFN56 HVQFN56, plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 mm x 8 mm x 0.85 mm 2015-07-13
SOT684-14 HVQFN56 plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 mm x 8 mm x 0.85 mm 2015-07-13
SOT684-15 HVQFN56 QFN-EP 56 8*8*0.9 P.5 WF 2017-06-11
SOT684-16 HVQFN56 HVQFN56, plastic, thermally enhanced very thin quad; flat non-leaded package; 56 terminals; 0.5 mm pitch; 8 mm x 8 mm x 0.85 mm body 2017-03-22
SOT684-17 HVQFN56 QFN-56 EP 56 8*8*.9 P0.5 2017-06-11
SOT684-18 HVQFN56 plastic, thermally enhanced very thin quad; flat non-leaded package; 56 terminals; 0.5 mm pitch; 8 mm x 8 mm x 0.85 mm body 2016-04-19
SOT684-2 HVQFN56 plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm MO-220(JEDEC) 2002-10-22
SOT684-20 HVQFN56 plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 mm x 8 mm x 0.85 mm 2017-04-24
SOT684-21 HVQFN56 HVQFN56, plastic, thermally enhanced very thin quad; flat non-leaded package, wettable flanks; 56 terminals; 0.5 mm pitch; 8 mm x 8 mm x 0.85 mm body 2017-04-07
SOT684-23 HVQFN56 plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; 0.5 mm pitch, 8 mm x 8 mm x 0.85 mm body 2018-11-05
SOT684-24(DD) HVQFN56 HVQFN56, thermal enhanced very thin quad flat package; no leads; dimple wettable flank; 56 terminals; 0.5 mm pitch, 8 mm x 8 mm x 0.85 mm body 2018-07-10
SOT684-25(DD) HVQFN56 HVQFN56, thermal enhanced very thin quad flat package; no leads; dimple wettable flank; 56 terminals; 0.5 mm pitch, 8 mm x 8 mm x 0.85 mm body 2018-08-01
SOT684-3 HVQFN56 plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm MO-220(JEDEC) 2003-03-11
SOT684-4 HVQFN56 plastic, thermal enhanced very thin quad flat package; 56 terminals; 0.5 mm pitch; 8 mm x 8 mm x 0.85 mm body MO-220(JEDEC) 2004-09-14
SOT684-6 HVQFN56 plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm 2002-11-27
SOT684-7 HVQFN56 HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 mm x 8 mm x 0.85 mm MO-220(JEDEC) 2009-03-04
SOT684-8 HVQFN56 plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2009-02-24
SOT684-9 HVQFN56 plastic thermal enhanced very thin quad flat package; no leads; 56 terminals - - - - - - - -(EIAJ);- - - - - - - -(JEDEC);- - - - - - - -(IEC) 2009-05-25
SOT685-1 HVSON8; QFPAK plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 6 x 5 x 0.85 mm 2002-11-27
SOT685-3 HVSON8; QFPAK plastic, thermal enhanced very thin small outline package; no leads; 8 terminals ---(EIAJ);MO-229(JEDEC);---(IEC) 2011-08-30
SOT686-1 LFBGA64 plastic low profile fine-pitch ball grid array package; 64 balls; body 6 x 6 x 1.05 mm 2002-03-11
SOT687-1 HVQFN68; MLF plastic, thermal enhanced very thin quad flat package; 68 terminals; 0.5 mm pitch; 10 mm x 10 mm x 0.85 mm body MO-220(JEDEC) 2003-06-13
SOT697-1 LFBGA180 plastic low profile fine-pitch ball grid array package; 180 balls; body 15 x 15 x 1.05 mm MO-205(JEDEC) 2002-02-13
SOT698-2 BGA272 BGA272, plastic, ball grid array; 272 balls; 1.27 mm pitch; 27 mm x 27 mm x 1.95 mm body PBGA-B272(JEDEC) 2017-06-11
SOT700-1 LBGA156 plastic low profile ball grid array package; 156 balls; body 15 x 15 x 1.05 mm MO-192(JEDEC) 2001-11-06
SOT702-1 VFBGA56 plastic, very thin fine-pitch ball grid array package; 56 balls; 0.65 mm pitch; 4.5 mm x 7 mm x 0.65 mm body MO-225(JEDEC) 2003-07-01
SOT702-2 VFBGA56 plastic, very thin fine-pitch ball grid array package; 56 balls; 0.65 mm pitch; 4.5 mm x 7 mm x 0.85 mm body 2014-08-21
SOT706-1 HBGA552 plastic thermal enhanced ball grid array package; 552 balls; body 37.5 x 37.5 x 1.42 mm; heatsink 2002-11-13
SOT707-1 HBGA584 plastic thermal enhanced ball grid array package; 584 balls; body 37.5 x 37.5 x 1.42 mm; heatsink 2002-11-22
SOT710-1 BGA217 plastic ball grid array package; 217 balls; body 23 x 23 x 1.75 mm MS-034(JEDEC);144E(IEC) 2001-11-01
SOT710-2 BGA217 BGA217, plastic, ball grid array; 217 balls; 1.27 mm pitch; 23 mm x 23 mm x 2.65 mm body PBGA-B217(JEDEC) 2017-06-11
SOT711-1 BGA240 plastic ball grid array package; 240 balls; body 23 x 23 x 1.75 mm IC-7315-001(EIAJ);MS-034(JEDEC);144E(IEC) 2001-11-01
SOT711-2 BGA240 plastic, ball grid array package; 240 balls; 1.27 mm pitch; 23 mm x 23 mm x 1.55 mm body MS-034(JEDEC);144E(IEC) 2005-03-14
SOT713-1 TFBGA204 plastic, thin fine-pitch ball grid array package; 204 balls; 0.5 mm pitch; 11 mm x 11 mm x 0.8 mm body MO-195(JEDEC) 2005-06-23
SOT714-1 HBGA329 plastic thermal enhanced ball grid array package; 329 balls; body 31 x 31 x 1.75 mm; heatsink MS-034(JEDEC);144E(IEC) 2001-10-30
SOT715-1 LFBGA216 plastic low profile fine-pitch ball grid array package; 216 balls; body 16 x 16 x 1.05 mm MO-205(JEDEC) 2001-11-14
SOT724-1 SSOP20 plastic, shrink small outline package; 20 leads; 0.635 mm pitch; 8.7 mm x 3.9 mm x 1.73 mm body MO-137(JEDEC) 2003-02-18
SOT725-1 DBS37P plastic DIL-bent-SIL power package; 37 leads (lead length 6.8 mm) 2002-11-22
SOT726-1 TCP plastic tape carrier package; 35 mm wide tape ---(EIAJ);---(JEDEC);---(IEC) 2002-02-14
SOT727-1 HLBGA475 plastic thermal enhanced low profile ball grid array package; 475 balls; body 35 x 35 x 0.9 mm; heatsink MO-192(JEDEC) 2002-02-07
SOT728-1 LBGA324 plastic low profile ball grid array package; 324 balls; body 19 x 19 x 1.05 mm MO-192(JEDEC) 2001-11-01
SOT728-2 LBGA324 plastic, low profile ball grid array package; 324 balls; 1 mm pitch; 19 mm x 19 mm x 1 mm body MO-192(JEDEC) 2005-05-25
SOT728-3 LBGA324 LBGA324, plastic, low profile ball grid array; 324 balls; 1 mm pitch; 19 mm x 19 mm x 1.54 mm body PBGA-B324(JEDEC) 2017-06-11
SOT730-1 CWQCCN32L ceramic window quad chip carrier; no leads; with lens; body 10.7 x 10.7 x 8 mm 2002-08-12
SOT732-1 FCP2 metal flip chip package; 2 leads; 35 mm wide tape 2005-03-04
SOT734-1 SSOP16T plastic shrink small outline package/transparent; 16 leads (straight leads); body width 4.4 mm 2001-11-09
SOT740-1 LBGA256 plastic low profile ball grid array package; 256 balls; body 17 x 17 x 1.05 mm MO-192(JEDEC) 2002-01-09
SOT740-2 LBGA256 plastic low profile ball grid array package; 256 balls; body 17 x 17 x 1 mm MO-192(JEDEC) 2005-08-04
SOT740-3 LBGA256 LBGA256; plastic, low profile ball grid array; 256 bumps; 1.0 mm pitch; 17 mm x 17 mm x 1.7 mm body 2016-01-14
SOT740-4 LBGA256 LBGA256, plastic, low profile ball grid array; 256 balls; 1 mm pitch; 17 mm x 17 mm x 1.16 mm body 2016-02-05
SOT741-1 BGA376 plastic, ball grid array package; 376 balls; 1 mm pitch; 23 mm x 23 mm x 1.75 mm body MS-034(JEDEC);144E(IEC) 2002-01-14
SOT744-1 LFBGA64 plastic low profile fine-pitch ball grid array package; 64 balls; body 7 x 7 x 0.9 mm 2001-12-11
SOT745-1 LFBGA72 plastic low profile fine-pitch ball grid array package; 72 balls; body 7 x 7 x 0.9 mm 2004-05-19
SOT746-1 TFBGA64 plastic thin fine-pitch ball grid array package; 64 balls; body 7 x 7 x 0.7 mm MO-195(JEDEC) 2002-01-11
SOT747-1 TFBGA72 plastic thin fine-pitch ball grid array package; 72 balls; body 7 x 7 x 0.7 mm MO-195(JEDEC) 2002-01-11
SOT748-1 COF plastic chip on foil package; 35 mm wide tape 2002-04-24
SOT748-2 COF plastic chip on foil package; 35 mm wide tape 2002-10-18
SOT748-3 COF plastic chip on foil package; 48 mm wide tape 2002-10-18
SOT748-4 COF plastic chip on foil package; 48 mm wide tape 2002-10-18
SOT750A QMAN28 leadless surface mounted package; plastic cap; 28 terminations 2006-03-16
SOT751-1 LFBGA80 plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 1.05 mm 2003-09-16
SOT751-2 LFBGA80 plastic low profile fine-pitch ball grid array package; 80 balls; body 7 x 7 x 0.9 mm 2003-09-16
SOT753 TSOP5 plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body SC-74A(EIAJ) 2006-03-16
SOT754-1 TFBGA256 plastic thin fine-pitch ball grid array package; 256 balls; body 15 x 15 x 0.8 mm MO-216(JEDEC) 2002-01-14
SOT754-2 TFBGA256 plastic thin fine-pitch ball grid array package; 256 balls, 0.8 mm pitch, 15 mm x 15 mm x 0.71 mm body MO-216(JEDEC) 2009-10-27
SOT756 SPAK-5 plastic single-ended surface-mounted package; 5 leads 2008-02-15
SOT758-1 HVQFN16 plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm MO-220(JEDEC) 2002-10-21
SOT758-2 HVQFN16 plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm MO-220(JEDEC) 2007-01-26
SOT758-3 HVQFN16 plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm MO-220(JEDEC) 2008-02-08
SOT758-4 HVQFN16 HVQFN16, plastic, thermal enhanced very thin quad flatpack; no leads; 16 terminals; 0.5 mm pitch; 3 mm x 3 mm x 0.85 mm body 2017-06-11
SOT758-5 HVQFN16 plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; 0.5 mm pitch, 3 mm x 3 mm x 0.9 mm 2018-08-13
SOT759-1 LFBGA228 plastic low profile fine-pitch ball grid array package; 228 balls; body 12 x 12 x 1.05 mm 2002-03-18
SOT761-1 TFBGA72 plastic thin fine-pitch ball grid array package; 72 balls; body 6 x 6 x 0.8 mm MO-195(JEDEC) 2002-04-10
SOT762-1 DHVQFN14 plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body MO-241(JEDEC) 2015-05-05
SOT763-1 DHVQFN16 plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body MO-241(JEDEC) 2003-01-27
SOT764-1 DHVQFN20 plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body MO-241(JEDEC) 2014-12-12
SOT765-1 VSSOP8 plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body MO-187(JEDEC) 2016-05-31
SOT766-1 HLQFP176 plastic thermal enhanced low profile quad flat package; 176 leads; body 24 mm x 24 mm x 1.4 mm; exposed die pad MS-026(JEDEC) 2002-06-13
SOT766-2 HLQFP176 Plastic thermal enhanced low profile quad flat package; 176 leads, 0.5 mm pitch, 24 mm x 24 mm x 1.4 mm body MS-026(JEDEC) 2014-04-01
SOT766-4 HLQFP176 HLQFP176, plastic, thermal enhanced low profile quad flat package; 176 terminals; 0.5 mm pitch; 24 mm x 24 mm x 1.4 mm body 2017-06-11
SOT766-5 HLQFP176 HLQFP176, plastic, thermal enhanced low profile quad flat package; 176 terminals; 0.50 mm pitch; 24 mm x 24 mm x 1.6 mm body 2017-03-27
SOT766-6 HLQFP176 HLQFP176, plastic, thermal enhanced low profile quad flat package; 176 terminals; 0.5 mm pitch; 24 mm x 24 mm x 1.4 mm body 2017-06-11
SOT766-7 HLQFP176 HLQFP176, plastic, thermal enhanced low profile quad; flat leaded package; 176 terminals; 0.5 mm pitch; 24 mm x 24 mm x 1.4 mm body 2017-03-27
SOT766-9 HLQFP176 HLQFP176, plastic, thermal enhanced low profile quad flat package; 176 terminals; 0.5 mm pitch; 24 mm x 24 mm x 1.4 mm body 2017-06-11
SOT767-1 DBS27P plastic DIL-bent-SIL (special bent) power package; 27 leads (lead length 7.7 mm) 2002-05-02
SOT770-1 HTSSOP8 plastic thermal enhanced thin shrink small outline package; 8 leads; body width 3 mm; exposed die pad 2002-05-14
SOT773-1 HVQFN14 plastic thermal enhanced very thin quad flat package; no leads; 14 terminals; body 2.5 x 2.5 x 0.85 mm 2002-07-05
SOT774-1 LBGA208 plastic low profile ball grid array package; 208 balls; body 17 x 17 x 1.05 mm MO-192(JEDEC) 2002-05-14