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Package Version Package Name Package Description Reference Codes Issue Date
HLFLGA17 HLFLGA17, thermal enhanced low profile fine-pitch land grid array package, 17 terminals, 0.65 mm pitch, 4 mm x 3 mm x 1.348 mm body 2019-02-18
HLFLGA21 HLFLGA21, thermal enhanced low profile fine-pitch land grid array package, 21 terminals, 0.9 mm pitch, 6.2 mm x 6.2 mm x 1.148 mm body 2018-08-29
HLFLGA12 thermal enhanced low profile fine-pitch land grid array package, 13 terminals, 0.5 mm pitch, 2.2 mm x 2.2 mm x 0.68 mm body 2020-02-05