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Package Version Package Name Package Description Reference Codes Issue Date
HTQFP48 plastic thermal enhanced thin quad flat package; 48 leads; exposed die pad MS-026(JEDEC 2010-08-04
HTQFP48 HTQFP48: plastic thermal enhanced thin quad flat package; 48 leads; body 10 mm x 10 mm x 1 mm; exposed die pad MS-026(JEDEC 2012-10-23
HTQFP128 HTQFP128, plastic, thermal enhanced thin quad flat package; 128 terminals; 0.4 mm pitch; 14 mm x 14 mm x 1 mm body TS-PQFP-G128(JEDEC 2017-06-11
HTQFP216 HTQFP216, plastic, thermal enhanced thin quad flat package; 216 terminals; 0.5 mm pitch; 24 mm x 24 mm x 1 mm body 2017-06-11
HTQFP80 plastic thermal enhanced thin quad flat package; 80 leads; body 14 x 14 x 1 mm; heatsink 2003-02-20
HTQFP80 HTQFP80, plastic, thermal enhanced thin quad flat package; 80 terminals; 0.65 mm pitch; 14 mm x 14 mm x 1 mm body TS-PQFP-G80(JEDEC 2017-06-11
HTQFP48 plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad MS-026(JEDEC 2004-01-29
HTQFP48 plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad MS-026(JEDEC 2004-01-29
HTQFP48 plastic thermal enhanced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad MS-026(JEDEC 2004-02-05
HTQFP100 plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad MS-026(JEDEC 2005-02-02
HTQFP100 plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad MS-026(JEDEC 2005-02-02
HTQFP100 plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad MS-026(JEDEC 2008-04-08
HTQFP100 plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad MS-026(JEDEC 2008-11-12
HTQFP100 plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad MS-026(JEDEC 2008-11-12
HTQFP100 plastic thermal enhanced thin quad flat package; 100 leads; exposed diepad, 0.5 mm pitch, 14 mm x 14 mm x 1 mm body 2009-09-01
HTQFP100 HTQFP100, plastic, thermal enhanced thin quad flat package; 100 terminals; 0.5 mm pitch; 14 mm x 14 mm x 1 mm body TS-PQFP-G100(JEDEC 2017-06-11
HTQFP100 HTQFP100, plastic, thermal enhanced thin quad flat package; 100 terminals; 0.5 mm pitch; 14 mm x 14 mm x 1 mm body TS-PQFP-G100(JEDEC 2017-06-11
HTQFP52 plastic thermal enhanced thin quad flat package; 52 leads; body 10 x 10 x 1 mm; exposed die pad MS-026(JEDEC 2002-09-04
HTQFP80 plastic thermal enhanced thin quad flat package; 80 leads; body 12 x 12 x 1 mm; exposed die pad MS-026(JEDEC 2004-01-15
HTQFP80 plastic thermal enhanced thin quad flat package; 80 leads; body 12 x 12 x 1 mm; exposed die pad MS-026(JEDEC 2004-04-21
HTQFP80 plastic thermal enhanced thin quad flat package; 80 leads; body 12 x 12 x 1 mm; exposed die pad MS-026(JEDEC 2006-06-20
HTQFP80 HTQFP80, plastic, thermal enhanced thin quad flat package; 80 terminals; 0.5 mm pitch; 12 mm x 12 mm x 1 mm body TS-PQFP-G80(JEDEC 2017-06-11
HTQFP64 plastic thermal enhanced thin quad flat package; 64 leads; body 10 x 10 x 1 mm; exposed die pad MS-026(JEDEC 2005-05-11
HTQFP64 plastic thermal enhanced thin quad flat package; 64 leads; 10 x 10 x 1 mm; exposed diepad 2010-02-15
HTQFP64 plastic thermal enhanced thin quad flat package; 64 leads; exposed die pad MS-026(JEDEC 2010-04-22
HTQFP64 plastic thermal enhanced thin quad flat package; 64 leads; exposed die pad MS-026(JEDEC 2011-04-12
HTQFP64 plastic thermal enhanced thin quad flat package; 64 leads; 0.5 mm pitch, 10 mm x 10 mm x 1 mm body 2018-12-18
HTQFP64 HTQFP64, thermal enhanced thin quad flat package; 64 terminals, 0.5 mm pitch, 10 mm x 10 mm x 1 mm body; exposed die pad 2021-12-14