201802006A : MMA845x Assembly Transfer from Carsem Malaysia to ASECL Taiwan

NXP Semiconductors announces the assembly transfer of MMA845x to ASE-Chungli Taiwan (ASECL) assembly site. These products are currently being assembled at the Carsem Malaysia assembly site.With this change NXP Semiconductors also announces the materials change to Gold Palladium Copper (AuPdCu) wire Sumitomo EME-G700LA version P mold compound Ablestik Die Attach Film (DAF) ATB-125 and Mitsui Rough Palladium Pre-plated Frame (PPF) with Nickel Palladium Gold (NiPdAu) C7025 material for MMA845x. These products were previously assembled with Gold (Au) wire Sumitomo EME-G770HCD mold compound Henkel 8006NS Screen Print DAF and HDS PPF (RT micro NiPdAuAg) C7025 material.

Reason of Change

The transfer to ASECL is for consolidation of our assembly sites. The transfer from Gold to Gold Palladium Copper wire is an alignment to industry standard convention for wirebond material type. The change to mold compound and die attach material for QFN 3x3 package is required to standardize the bill of materials for ASECL assembly production.

Identification of Affected Products

Top side marking There is no change to the orderable part numbers. NXP will have traceability of the assembly site by the 1st and 2nd digit of the tracecode.

Anticipated Impact

Data sheet revision: No impact to existing datasheet

No impact on form fit function reliability or quality.

Timing and Logistics

The Final PCN is planned to be issued on 13-Jul-2018

Affected Parts