201803036F01 : NX3P2902BUK assembly(bumiping) transfer from Nexperia(Germany) to SPIL(Taiwan)
NXP is pleased to announce the product assembly transferring (bumping) location from Nexperia (Germany) to SPIL (Taiwan). WLCSP bumping proces is same "UBM + Ball drop" but the solder ball material change from "SOL250" to "SAC105(Ni)"."SAC105(Ni)" is a mature and standard material in NXP and in industry.
| PCN Type | Change Category | Issue Date | Effective Date |
|---|---|---|---|
| Final Product Change Notification | Assembly location, Assembly materials | 06-May-2018 | 04-Aug-2018 |
Reason of Change
Nexperia will stop WLCSP bumping activities.The following files included in this PCN provide information about the verification of the changes (if any) in the assembly process: 1)PQIP
Identification of Affected Products
Top side marking Marking line B will change from DS* to AS* (3rd character is production code) Solder ball material changed. Nexperia is "Sol pearls" and SPIL is SAC105(Ni)
Anticipated Impact
Data sheet revision: No impact to existing datasheet
No impact on form fit function reliability or quality.
Affected Parts
| Part Number / 12NC | Last Time Buy Date | Last Time Delivery Date | Replacement Part |
|---|---|---|---|
|
NX3P2902BUKZ (935300495012) |
- | - | - |