201805014F01 : MC9S08AWXX Fab Expansion (NXP-CHD FAB to TSMC3) for V Suffix: -40° to 105°C and M Suffix: -40° to 125°C Products

NXP Semiconductors is announcing the introduction of Taiwan Semiconductor Manufacturing Company Fab 3 (TSMC3) Hsinchu Taiwan as a dual source wafer manufacturing location for the extended temperature (V suffix: -40° to 105°C; and M suffix: -40° to 125°C) MC9S08AWXX products.The current mask set for product sourced out of NXP-CHD Fab is identified as 5M75B.The new mask set for product sourced out of TSMC3 Fab is identified as 1N20A.An errata document is generated for the MC9S08AW60/48/32/16 Mask 1N20A devices associated with this notification. The document provides a detailed description of the changes along with existing deviations from datasheet identified on current production devices. Potential implications on customer applications are described.1N20A:The following erratum was fixed.SE194-STOP3DCO: Stop3 Mode DCO Erratum.The following erratum was update.Changed to (1N20A) SE198B-ICG-RANGE=0 HGO=1 From (5M75B) SE198A-ICG-RANGE=0 HGO=1O Oscillator Mode Erratum.The errata MSE9S08AW60_ 1N20A revision 0 can be found at:http://www.nxp.com/products/automotive-products/microcontrollers-and-processors/arm-mcus-and-mpus/s32-arm-processors-microcontrollers/8-bit-general-purpose-aw60-48-32-16-mcus:S08AW?tab=Documentation_Tab

Reason of Change

Qualification of Taiwan Semiconductor Manufacturing Company Fab 3 (TSMC3) Hsinchu Taiwan is required for manufacturing flexibility and customer supply assurance.

Identification of Affected Products

Top side marking Part marking for maskset information will be 1N20A for TSMC Fab3 and remain 5M75B for CHD Fab.

Anticipated Impact

Data sheet revision: No impact to existing datasheet

There is no change to product form fit function or reliability for the new identified errata there are potential hardware and / or software implications to customers.

Affected Parts