201901014F01 : LPC5410xUK49 in WLCSP49 Package Change from Rev "B" to Rev "C"

Microcontroller products LPC5410xUK49 in WLCSP49 package will change from version "B" to version "C". Changes included a die revision to fix errata issues and an upgraded bump process.The following functional changes were made to product version "C":- IRC frequency tolerance improvement over temperature to resolve errata IRC.1 as defined in the device errata sheet.- System clock frequency improved to resolved errata Frequency.1 as defined in the device errata sheet.The following bump process changes were made to product version "C":- Under Bump Metal (UBM) and Re-Distribution Layer (RDL) change from a sputter to a plated process.- Back side protection (BSP) material changes from 40um to 25um thickness.- Overall maximum package thickness changes from 0.58mm to 0.565mm (see package drawing in attached datasheet).A revised data sheet LPC5410x v2.10 is available at https://www.nxp.com/docs/en/data-sheet/LPC5410X.pdf.

Reason of Change

1) To fix errata IRC.1 and Frequency.1.2) The sputter UBM process is outdated and has been obsoleted by the assembly vendor. The assemlby process is being ugraded to the current process already qualified by the LPC5411xUK49.

Identification of Affected Products

Top side marking The change applies to product version "C" visible on the top side marking.

Anticipated Impact

Data sheet revision: A new datasheet will be issued

Product overall height is reduced by 15um due to change in back side protection thickness. Product functionality changes to fix errata issues IRC.1 and Frequency.1.

Affected Parts