201904029F01 : 20PDIP Assembly Site Transfer to TFME from ATP1
NXP Semiconductors announces the assembly site transfer for the MC9S08SH8&SH4 PDIP 20 package from the current Amkor Technology Philippines Inc (ATP1) Muntinlupa Philippines assembly facility to TongFu Microelectronics Co. Ltd. Nantong China.The change in assembly site also includes change in mold compound Epoxy wire metal and lead frame. ATP1 and TFME BOM comparison is attached to this notification.Please see attached files for additional details.
| PCN Type | Change Category | Issue Date | Effective Date |
|---|---|---|---|
| Final Product Change Notification | Assembly location, Assembly materials | 16-May-2019 | 14-Aug-2019 |
Reason of Change
The Amkor Technology Philippines (ATP1) Muntinlupa Philippines assembly facility will not support PDIP20 package assembly and need to qualify TongFu Microelectronics Co. Ltd. as PDIP20 new assembly site.
Identification of Affected Products
Top side marking The assembly site is reflected in the package trace code. The format for the NXP standard trace PDIP20: AWLYYWWZ or ATWLYYWWZ A=Assembly LocationWL=Wafer Lot YYWW=Date Code Z =Assembly Lot Split The marking for ATP1 is A=ZR The marking for TFME is A=XN
Anticipated Impact
No impact on form fit function reliability or quality.
Affected Parts
| Part Number / 12NC | Last Time Buy Date | Last Time Delivery Date | Replacement Part |
|---|---|---|---|
|
MC9S08SH4CPJ (935320241174) |
- | - | - |
|
MC9S08SH4MPJ (935321017174) |
- | - | - |
|
MC9S08SH8CPJ (935319115174) |
- | - | - |
|
MC9S08SH8MPJ (935319118174) |
- | - | - |