201909001F01 : XSON6 (SOT886) Assembly/Test Transfer from ATGD and ATSN to ATBK
NXP Semiconductors is transferring assembly and test of the SOT886 (XSON6) package from ATSN and ATGD to ATBK. Standard ATBK BOM and flows will be used.Product data sheets are updated and available on the NXP website indicating the new orderable part numbers reflecting the use of Static Shielding Bags (SSB).
| PCN Type | Change Category | Issue Date | Effective Date |
|---|---|---|---|
| Final Product Change Notification | Assembly location, Assembly materials, Assembly process, Packing/Shipping/Labeling, Test equipment, Test location | 24-Dec-2019 | 24-Jan-2020 |
Reason of Change
Move production to an NXP facility to assure product quality and delivery.
Identification of Affected Products
Packing Labels will show Product Manufacturing Code (PMC) "n" to reflect ATBK assembly.
Anticipated Impact
Data sheet revision: A new datasheet will be issued
No impact on form fit function reliability or quality.
Affected Parts
| Part Number / 12NC | Last Time Buy Date | Last Time Delivery Date | Replacement Part |
|---|---|---|---|
|
NCX2200GM,115 (935294048115) |
- | - |
NCX2200GMAZ
(935294048471) |
|
NX3L1T3157GM,115 (935285418115) |
- | - |
NX3L1T3157GMZ
(935285418471) |
|
NX3L1T5157GM,115 (935287633115) |
- | - |
NX3L1T5157GMZ
(935287633471) |