201909001F02 : XSON6 (SOT886) Assembly/Test Transfer from ATGD and ATSN to ATBK
NXP Semiconductors is transferring assembly and test of the SOT886 (XSON6) package from ATSN and ATGD to ATBK. This will mitigate supply continuity concerns with ATSN (currently on lockdown) and ATGD during the COVID-19 crisis. There are no changes to the die and packing orientation. Standard ATBK materials and flows will be used including a roughened leadframe to improve package delamination performance. Please refer to the attached qualification report for detail. Product data sheets have been updated with new orderable part numbers to reflect the use of Static Shielding Bags (SSB). Although the planned first shipment is 90 days from notification customer may request product delivery sooner and NXP will provide as available.
| PCN Type | Change Category | Issue Date | Effective Date |
|---|---|---|---|
| Final Product Change Notification | Assembly location, Assembly materials, Assembly process, Packing/Shipping/Labeling, Test equipment, Test location | 27-Apr-2020 | 26-Jul-2020 |
Reason of Change
Move production to an NXP facility to improve product quality and to assure product delivery especially during the COVID -19 crisis.
Identification of Affected Products
Packing Labels will show Product Manufacturing Code (PMC) "n" to reflect ATBK assembly.
Anticipated Impact
Data sheet revision: A new datasheet will be issued
No impact on form fit function reliability or quality.
Affected Parts
| Part Number / 12NC | Last Time Buy Date | Last Time Delivery Date | Replacement Part |
|---|---|---|---|
|
NX3L1G3157GM,115 (935284122115) |
- | - |
NX3L1G3157GMZ
(935284122471) |