202009025AW : Withdrawal: APCN NX20P5090UK FAB EXPANSION SSMC TO TSMC F10 WITHDRAWAL
NXP Semiconductor is annoucing the introduction of Taiwan Semiconductor Manufacturing Compony Fab10 (TSMC F10) Shanghai China as a dual source wafer manufacturing location for the NX20P5090UK. Reason for change: The fab manufacturing site capacity expansion to TSMC F10 will improve NXP's ability to meet increasing customer demand and still maintain supply from the original fab (SSMC). Identification of affected products: Line C marking XtDYYWW X = foundry location "Z" is for SSMC and "N" is for TSMC F10.
| PCN Type | Change Category | Issue Date |
|---|---|---|
| Advanced Product Change Notification | Wafer fab location | 28-Mar-2021 |
Reason of Change
The fab manufacturing site capacity expansion to TSMC F10 will improve NXP's ability to meet increasing customer demand and still maintain supply from the original fab (SSMC).
Update Information
NXP decided to stop the NX20P5090 fab expansion because the current SSMC has enough capacity to support customer demands.
Anticipated Impact
Data sheet revision: A new datasheet will be issued
Affected Parts
| Part Number / 12NC | Last Time Buy Date | Last Time Delivery Date | Replacement Part |
|---|---|---|---|
|
NX20P5090UKAZ (935305697041) |
- | - | - |