202012016F01 : MPC7448 and MPC7447A epoxy underfill raw material change to new supplier

NXP is pleased to announce the qualification of MPC7448 and MPC7447A epoxy underfill raw material from Resin A (supplier 1) to Resin B (supplier 2) to ensure supply continuity. Material property of Resin B is equivalent to Resin A. Hence the epoxy performance of Resin B is comparable to Resin A.

Reason of Change

Resin A (supplier 1) was discontinued by the vendor. Resin B (supplier 2) was selected as the replacement and has comparable material properties to Resin A. There is no change to the underfill manufacturing process besides this material change.

Anticipated Impact

Data sheet revision: No impact to existing datasheet

Affected Parts