202603009F01 : Introduction of capacity extension for plasma diced UCODE 9

For the increase of backend manufacturing capacity we extend our production flows for plasma diced UCODE 9 products. • Next to our released flows we will introduce pre-assembly and wafer test at TFME (China) which will enable additional production capacity. • Current flows use plasma dicing at AMKOR and TFME and Wafer test and pre-assembly at ATBK To be noted: • There will be no change in type names or 12NCs (ordering code).

Reason of Change

NXP strives to provide larger flexibility in the production fulfilment. Being able to process UCODE 9 plasma diced wafer products at more than one production site will increase capacity and supply stability.

Anticipated Impact

Data sheet revision: No impact to existing datasheet

Affected Parts