OM13495: Surface Mount to DIP Evaluation Board

Overview

The OM13495 allows one to evaluate small, surface mount devices by breaking out the package leads to 100 mil centers pins, emulating a DIP package. The OM13495 supports the following packages: TSSOP24, (SOT355), TSSOP20, (SOT360), TSSOP16, (SOT403), TSSOP14, (SOT402).

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Surface Mount to DIP Evaluation Board OM13495

Specifications

Technical and Functional Specifications

Connectivity	Easy connection to small surface mount packages
	Allows evaluation of device that is only available in surface mount packages Eliminates costly sockets and custom printed circuit boards
	Expand the kit with add-on I2C daughter cards 100 mil center headers emulate DIP package for easy bread boarding

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OM13495 ^Active
Surface Mount to DIP Evaluation Board

OM13495UL
1 @ US
$14.03

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Distributor Name	Region	Inventory	Inventory Date

Upon selection of a preferred distributor, you will be directed to their web site to place and service your order. Please be aware that distributors are independent businesses and set their own prices, terms and conditions of sale. NXP makes no representations or warranties, express or implied, about distributors, or the prices, terms and conditions of sale agreed upon by you and any distributor.

Documents and Software

Documents (1)

Users Guide (1)

Documents

Users Guide (1)

OM13491, OM13492, OM13493, OM13494, OM13495, OM13496, OM13497 Breakout Board^{(REV
2.0
)}

Technical information for breakout boards allowing I2C-bus surface mount components to be easily evaluated
- 04 Oct 2018
- pdf
- 2.6 MB
- UM10754
- [ English ]

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