The TFA9897 is a high efficiency class-D audio amplifier with a sophisticated
speaker-boost protection algorithm. It can deliver 1.2 W (RMS; THD = 1 %) output power
into an 8 Ω speaker at a battery voltage of 3.6 V. The internal boost converter raises the
supply voltage to 5.3 V, providing ample headroom for major improvements in sound
A safe working environment is provided for the speaker under all operating conditions.
The TFA9897 maximizes acoustic output while ensuring diaphragm displacement and
voice coil temperature do not exceed their rated limits. This function is based on a
speaker box model that operates in all loudspeaker environments (e.g. free air, closed box
or vented box). Furthermore, advanced signal processing ensures that the audio signal is
always of optimum quality.
The adaptive sound maximizer algorithm uses feedback to accurately calculate both the
temperature and the excursion, allowing the TFA9897 to adapt to changes in the acoustic
Internal intelligent DC-to-DC conversion boosts the supply rail to provide additional
headroom and power output. The supply voltage is only raised when necessary. This
feature maximizes the output power of the class-D audio amplifier while limiting quiescent
The TFA9897 also incorporates advanced battery protection. By limiting the supply
current when the battery voltage is low, it prevents the audio system drawing excessive
load currents from the battery (excessive load currents could cause a system
undervoltage). The advanced processor minimizes the impact of a falling battery voltage
on the audio quality by preventing distortion as the battery discharges.
The device features low RF susceptibility because it has a digital input interface that is
insensitive to clock jitter. The second order closed loop architecture used in a class-D
audio amplifier provides excellent audio performance and high supply voltage ripple
rejection. The audio input interface is TDM and can be I²S configured. Control settings are
communicated via an I²C-bus interface.
The TFA9897 is available in a 30-bump WLCSP (Wafer Level Chip-Size Package) with a
400 μm pitch.